Patents by Inventor Fuka YAMAOKA

Fuka YAMAOKA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Copper or copper alloy electroplating bath
    Patent number: 11946153
    Abstract: A copper or copper alloy electroplating bath has two or more electrolytes. The two or more electrolytes include at least one selected from nitric acid and a nitrate. The two or more electrolytes can form electrodeposits, such as a group of high-aspect bump electrodes, that have a uniform height or thickness at high speed.
    Type: Grant
    Filed: January 16, 2020
    Date of Patent: April 2, 2024
    Assignee: ISHIHARA CHEMICAL CO., LTD.
    Inventors: Masaru Hatabe, Hironori Murakami, Fuka Yamaoka
  • STRUCTURE INCLUDING COPPER PLATING LAYER OR COPPER ALLOY PLATING LAYER
    Publication number: 20220316085
    Abstract: A structure includes a copper or copper alloy plating layer, in which Kirkendall void formation is suppressed. The copper or copper alloy plating layer is formed by electroplating at a prescribed first cathode current density by using a copper or copper alloy electroplating bath and then completing the electroplating after the first cathode current density is changed to a lower second cathode current density. The first cathode current density is a single cathode current density in the electroplating at this current density or an average cathode current density in the electroplating by combining plural cathode current densities. The first cathode current density is at lowest 5 A/dm2. A layer formed by changing the first cathode current density to the second cathode current density is a surface layer part of the copper or copper alloy plating layer, which can have a thickness of 0.05 ?m to 15 ?m.
    Type: Application
    Filed: April 30, 2020
    Publication date: October 6, 2022
    Inventors: Masaru HATABE, Hironori MURAKAMI, Fuka YAMAOKA
  • COPPER OR COPPER ALLOY ELECTROPLATING BATH
    Publication number: 20220127741
    Abstract: A copper or copper alloy electroplating bath has two or more electrolytes. The two or more electrolytes include at least one selected from nitric acid and a nitrate. The two or more electrolytes can form electrodeposits, such as a group of high-aspect bump electrodes, that have a uniform height or thickness at high speed.
    Type: Application
    Filed: January 16, 2020
    Publication date: April 28, 2022
    Inventors: Masaru HATABE, Hironori MURAKAMI, Fuka YAMAOKA
  • Structure containing Sn layer or Sn alloy layer
    Patent number: 11052637
    Abstract: A structure containing a Sn layer or a Sn alloy layer includes a substrate, a Sn layer or Sn alloy layer formed above the substrate, and an under barrier metal formed between the substrate and the Sn layer or Sn alloy layer in the form of a single metal layer containing any one of Fe, Co, Ru and Pd, or an alloy layer containing two or more of Fe, Co, Ru and Pd.
    Type: Grant
    Filed: November 27, 2018
    Date of Patent: July 6, 2021
    Assignee: ISHIHARA CHEMICAL CO., LTD.
    Inventors: Shoya Iuchi, Masaru Hatabe, Takahiro Tanaka, Fuka Yamaoka
  • STRUCTURE CONTAINING SN LAYER OR SN ALLOY LAYER
    Publication number: 20200376808
    Abstract: A structure containing a Sn layer or a Sn alloy layer includes a substrate, a Sn layer or Sn alloy layer formed above the substrate, and an under barrier metal formed between the substrate and the Sn layer or Sn alloy layer in the form of a single metal layer containing any one of Fe, Co, Ru and Pd, or an alloy layer containing two or more of Fe, Co, Ru and Pd.
    Type: Application
    Filed: November 27, 2018
    Publication date: December 3, 2020
    Inventors: Shoya IUCHI, Masaru HATABE, Takahiro TANAKA, Fuka YAMAOKA