Abstract: A die bonder and a bonding method are provided that are capable of surely mounting a die on an intermediate stage and surely picking up the die from the intermediate stage and thus, are high in reliability. The die bonder is provided with the intermediate stage for mounting thereon the die picked up by the pickup head from a die supply unit. A mounting portion of the intermediate stage is provided with an uneven pattern including a plurality of mounting support protrusions having contact surfaces that flush contact the back surface of the die for supporting the die not to slip out of place, and a plurality of recesses formed between the mounting support protrusions.

Abstract: A die bonder and a bonding method are provided that are capable of surely mounting a die on an intermediate stage and surely picking up the die from the intermediate stage and thus, are high in reliability. The die bonder is provided with the intermediate stage for mounting thereon the die picked up by the pickup head from a die supply unit. A mounting portion of the intermediate stage is provided with an uneven pattern including a plurality of mounting support protrusions having contact surfaces that flush contact the back surface of the die for supporting the die not to slip out of place, and a plurality of recesses formed between the mounting support protrusions.

Abstract: With a die bonder or a bonding method, the die is adsorbed by the collet, the dicing tape to which the die is adsorbed is thrust up, the die adsorbed by the collet, and thrust up is peeled from the dicing tape, and the peeled die is bonded to the substrate. When the decrease in the air leak flow rate through the gap between the collet and the die upon the thrust up is smaller than the decrease in the normal peel by a predetermined amount, it is judged that a deflection occurs in the die.

Abstract: With a die bonder or a bonding method, the die is adsorbed by the collet, the dicing tape to which the die is adsorbed is thrust up, the die adsorbed by the collet, and thrust up is peeled from the dicing tape, and the peeled die is bonded to the substrate. When the decrease in the air leak flow rate through the gap between the collet and the die upon the thrust up is smaller than the decrease in the normal peel by a predetermined amount, it is judged that a deflection occurs in the die.