Patents by Inventor Fukuaki Wada

Fukuaki Wada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Plated resin article
    Patent number: 4876145
    Abstract: A molded article of a transparent ABS resin comprising 10 to 24% by weight of a diene type rubber having a weight average particle size of 150 m.mu. or less and not containing methyl methacrylate in the continuous resin phase is subjected to wet plating. The resulting plated resin article has an excellent adhesion of the plating layer and a good transparency.
    Type: Grant
    Filed: July 10, 1987
    Date of Patent: October 24, 1989
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Tetsuro Maeda, Fukuaki Wada, Susumu Ohoka, Akihiro Okamoto
  • Plated resin article
    Patent number: 4732807
    Abstract: A molded article of a transparent ABS resin comprising 10 to 24% by weight of a diene type rubber having a weight average particle size of 150 m.mu. or less and not containing methyl methacrylate in the continuous resin phase is subjected to wet plating. The resulting plated resin article has an excellent adhesion of the plating layer and a good transparency.
    Type: Grant
    Filed: February 11, 1985
    Date of Patent: March 22, 1988
    Assignee: Denki Kagaku Kogyo K.K.
    Inventors: Tetsuro Maeda, Fukuaki Wada, Susumu Ohoka, Akihiro Okamoto