Abstract: The invention provides a manufacturing apparatus in which inter-substrate transfer of a thin film circuit or a thin film element can automatically be performed. An apparatus for manufacturing electronic devices includes a laser device to generate laser beams, a masking unit having a masking substrate to shape beam spots of the laser beams, a first stage to place a first substrate, which carries a object to be transferred, a second stage to place a second substrate, to which the object to be transferred is transferred, an adhesive agent applying unit to apply an adhesive agent on the object to be transferred or on a transferred position on the second substrate, and a control unit to control the actions of the first and the second stages.

Abstract: The invention provides a manufacturing apparatus in which inter-substrate transfer of a thin film circuit or a thin film element can automatically be performed. An apparatus for manufacturing electronic devices includes a laser device to generate laser beams, a masking unit having a masking substrate to shape beam spots of the laser beams, a first stage to place a first substrate, which carries a object to be transferred, a second stage to place a second substrate, to which the object to be transferred is transferred, an adhesive agent applying unit to apply an adhesive agent on the object to be transferred or on a transferred position on the second substrate, and a control unit to control the actions of the first and the second stages.

Abstract: A method of manufacturing an electronic device includes providing a mask substrate, a first substrate on which an object to be transferred is formed, and a second substrate to which the object is to be transferred, adjusting positions of the mask substrate, the first substrate and the second substrate so that an alignment mark formed on one of the substrates (a reference substrate) and alignment marks formed on other two of the substrates are aligned with each other, and transferring the object to be transferred from the first substrate to the second substrate, the transferring step including irradiating the object to be transferred from the first substrate with light transmitted through the mask substrate.

Abstract: The invention provides an IC card in which it is difficult to separate IC chips from the IC card. In accordance with the invention, an IC card formed by laminating a plurality of substrates can include a sensor for identifying an authorized person, a signal processing circuit for processing the identification based on an output from the sensor and a card-shaped card medium containing the sensor and the signal processing circuit. At least the signal processing circuit can include a thin film circuit which is sufficiently thinner than the card medium and contains a material which is dissolvable equally to or more than the card medium.

Abstract: The present application provides a manufacturing method for a device which enables manufacture of a device effectively at low cost by dispersingly arranging elements such as TFTs on a final substrate which becomes an active matrix substrate for electro-optic devices, a device obtained by the method, an electro-optic device, and electronic equipment. The method is to prepare a part or all of many elements formed on a first substrate 10 and then these elements are transferred to a second substrate 14. for manufacturing a device.

Abstract: To provide a manufacturing apparatus in which inter-substrate transfer of a thin film circuit or a thin film element can automatically be performed.

Abstract: The invention provides an IC card in which it is difficult to separate IC chips from the IC card. In accordance with the invention, an IC card formed by laminating a plurality of substrates can include a sensor for identifying an authorized person, a signal processing circuit for processing the identification based on an output from the sensor and a card-shaped card medium containing the sensor and the signal processing circuit. At least the signal processing circuit can include a thin film circuit which is sufficiently thinner than the card medium and contains a material which is dissolvable equally to or more than the card medium.