Patents by Inventor Fukuo Kanno

Fukuo Kanno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6780944
    Abstract: A resin composition which comprises from 50 to 99.5 parts by weight of a polyphenylene sulfide and from 0.5 to 50 parts by weight of a fluorinated resin having a solidification temperature of at least 237° C. when cooled at a cooling rate of 10° C./min after melting in a nitrogen atmosphere at 330° C., and from 0 to 250 parts by weight of a filler, etc. per 100 parts by weight of the two components.
    Type: Grant
    Filed: September 15, 2000
    Date of Patent: August 24, 2004
    Assignee: Asahi Glass Company, Limited
    Inventors: Yasuki Miura, Fukuo Kanno, Masataka Yokota
  • Patent number: 4698379
    Abstract: Magnesium hydroxide of a substantially spherical particle form having an average particle size of from 5 to 500 .mu.m and a specific surface area of from 25 to 1 m.sup.2 /g.
    Type: Grant
    Filed: January 16, 1986
    Date of Patent: October 6, 1987
    Assignee: Asahi Glass Company Ltd.
    Inventors: Keiichi Nakaya, Kunio Tanaka, Fukuo Kanno, Mitaka Kobayashi
  • Patent number: 4615831
    Abstract: A fire retardant polyolefin composition comprising from 40 to 70% by weight of magnesium hydroxide and from 30 to 60% by weight of a polyolefin, wherein from 0.3 to 10% by weight, based on the magnesium hydroxide, of at least one N-hydroxyalkylamide of a higher fatty acid selected from the group represented by the general formulas: ##STR1## where R is a C.sub.11 -C.sub.17 alkyl or alkylene group and R' is C.sub.n H.sub.2n where n is an integer of 1 to 6, is incorporated.
    Type: Grant
    Filed: November 21, 1984
    Date of Patent: October 7, 1986
    Assignee: Asahi Glass Company, Ltd.
    Inventors: Fukuo Kanno, Keiichi Nakaya
  • Patent number: 4370292
    Abstract: An encapsulation of an electronic device is carried out by using a synthetic thermoplastic resin compound having low viscosity in a molding condition which comprises polyphenylene sulfide and a filler at a ratio of 1:4 to 4:1 and a tacky or adhesive polymer at a ratio of 0.1 to 50 wt. parts per 100 wt. parts of polyphenylene sulfide by a transfer molding process or an injection molding process.
    Type: Grant
    Filed: June 4, 1981
    Date of Patent: January 25, 1983
    Assignee: Asahi Glass Company, Ltd.
    Inventors: Hiroshi Yanase, Fukuo Kanno, Takeshi Abe
  • Patent number: 4274993
    Abstract: A moldable polyphenylenesulfide is obtained by a heat-treatment of a partially crosslinked or noncrosslinked polyphenylenesulfide at a temperature of higher than 290.degree. C. in an atmosphere being substantially absence of oxygen.
    Type: Grant
    Filed: May 30, 1979
    Date of Patent: June 23, 1981
    Assignee: Asahi Glass Company, Ltd.
    Inventors: Shigeyuki Narisawa, Hiroshi Yanase, Fukuo Kanno