Patents by Inventor Fulvio Silvio Tondelli

Fulvio Silvio Tondelli has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Plated leadframes with cantilevered leads
    Patent number: 6518099
    Abstract: A metal frame patterned by die stamping has the outermost end portion of each patterned pin extending freely, without constraints, from a line of metal bridge connections (dam bar). The end face of each pin is also covered, as well as other surfaces of the frame, by a coating layer or multilayer of metals different from the metal of the die stamped frame. The coating layer or multilayer contains at least on its outer surface, a noble metal such as palladium or gold. The tip of the pins are not subject to cutting and/or trimming after plating the die stamped frame. The pins are not even cut or trimmed during separation of the patterned frame from the surrounding metal at the end of the encapsulation process, when the pins are then eventually bent into shape.
    Type: Grant
    Filed: July 5, 2001
    Date of Patent: February 11, 2003
    Assignee: STMicroelectronics S.r.l.
    Inventors: Andrea Giovanni Cigada, Fulvio Silvio Tondelli
  • Plated leadframes with cantilevered leads
    Patent number: 6323544
    Abstract: A metal frame patterned by die stamping has the outermost end portion of each patterned pin extending freely, without constraints, from a line of metal bridge connections (dam bar). The end face of each pin is also covered, as well as other surfaces of the frame, by a coating layer or multilayer of metals different from the metal of the die stamped frame. The coating layer or multilayer contains at least on its outer surface, a noble metal such as palladium or gold. The tip of the pins are not subject to cutting and/or trimming after plating the die stamped frame. The pins are not even cut or trimmed during separation of the patterned frame from the surrounding metal at the end of the encapsulation process, when the pins are then eventually bent into shape.
    Type: Grant
    Filed: March 5, 1999
    Date of Patent: November 27, 2001
    Assignee: STMicroelectronics S.r.l.
    Inventors: Andrea Giovanni Cigada, Fulvio Silvio Tondelli
  • Plated leadframes with cantilevered leads
    Publication number: 20010041385
    Abstract: A metal frame patterned by die stamping has the outermost end portion of each patterned pin extending freely, without constraints, from a line of metal bridge connections (dam bar). The end face of each pin is also covered, as well as other surfaces of the frame, by a coating layer or multilayer of metals different from the metal of the die stamped frame. The coating layer or multilayer contains at least on its outer surface, a noble metal such as palladium or gold. The tip of the pins are not subject to cutting and/or trimming after plating the die stamped frame. The pins are not even cut or trimmed during separation of the patterned frame from the surrounding metal at the end of the encapsulation process, when the pins are then eventually bent into shape.
    Type: Application
    Filed: July 5, 2001
    Publication date: November 15, 2001
    Applicant: STMicroelectronics S.r.I.
    Inventors: Andrea Giovanni Cigada, Fulvio Silvio Tondelli