Abstract: To allow an electronic control unit to be replaced with good work efficiency and prevent foreign matter from entering a casing during maintenance work, the connector connection structure includes an internal connector positioned inside a casing, an external connector positioned outside the casing and an electronic control unit electrically connected between the external connector and the electronic control unit wherein the electronic control unit includes a main part that opposes an opening formed in the casing when the internal connector is connected thereto, and a first conductive connection portion and a second conductive connection portion provided on either end of the main part and configured to be connected to the internal connector and the external connector respectively, and a first seal member is provided on an outer periphery of the main part, the first seal member closing the opening when the external connector is not connected to the electronic control unit and the internal connector is connected

Abstract: To prevent electric conductance impairment of an electric connecting part between an electronic control unit and an internal connector in a reliable manner even when the electric connecting part between the electronic control unit and the internal connector is placed in an environment where oil mist or electroconductive substances are present, the electronic control unit includes a main part, a first conductive connection portion provided at a lower end of the main part and configured to be electrically connected to the internal connector, and an outer shell member extending downward so as to surround the first conductive connection portion, and to be open only at a lower end thereof, and wherein the internal connector is provided with a housing including a part defining an annular recess opened upward on an outer periphery thereof, the lower end of the outer shell member being received in the annular recess when the electronic control unit is connected to the internal connector.

Abstract: The electronic device unit includes: a control target device; and an electronic control device, the control target device including: a control target housing; a control target component; and an inner connector, the electronic control device including: an electronic circuit including a circuit board and an electronic control component; and a first connector, which is electrically connected to the electronic control component. The control target housing has formed therein an opening, which allows the electronic control device to be placed in and taken out of the control target housing. When the first connector is connected to the inner connector, the electronic control device is located inside the control target housing.

Abstract: The electronic device unit includes: a control target device; and an electronic control device, the control target device including: a control target housing; a control target component; and an inner connector, the electronic control device including: an electronic circuit including a circuit board and an electronic control component; and a first connector, which is electrically connected to the electronic control component. The control target housing has formed therein an opening, which allows the electronic control device to be placed in and taken out of the control target housing. When the first connector is connected to the inner connector, the electronic control device is located inside the control target housing.

Abstract: An electronic device unit includes a circuit board having: a sealing resin portion in which a region in which an electronic component is mounted is sealed by a sealing resin; and a board end portion exposed from a side of the sealing resin portion. A plurality of connection terminals are provided on the board end portion so as to be aligned in a direction of the side of the sealing resin portion, and a resin portion thicker than the board end portion and having a wall-like projection shape is provided at at least one of side surfaces of the board end portion in the direction of the side. The resin portion is integrally molded with the sealing resin portion of the circuit board and a side surface of the resin portion is press-fitted into an insertion chamber of a connector.

Abstract: An electronic device unit includes a circuit board having: a sealing resin portion in which a region in which an electronic component is mounted is sealed by a sealing resin; and a board end portion exposed from a side of the sealing resin portion. A plurality of connection terminals are provided on the board end portion so as to be aligned in a direction of the side of the sealing resin portion, and a resin portion thicker than the board end portion and having a wall-like projection shape is provided at at least one of side surfaces of the board end portion in the direction of the side. The resin portion is integrally molded with the sealing resin portion of the circuit board and a side surface of the resin portion is press-fitted into an insertion chamber of a connector.

Abstract: To prevent an increase of the number of kinds of components required for offset arrangement, an increase in risk of assembly error and extra time and effort for parts management, in a connector including mutually facing terminal members with contacting portions being offset in the insertion direction. Mutually facing terminal members 20 are formed on components identical in shape. The mutually facing terminal members 20 are secured to a connector housing 12 while being offset in an insertion direction of a double-sided card edge 102 inserted into a receptacle compartment 14 of the connector housing 12.

Abstract: A plurality of pairs of contact terminals accommodated in a card edge connector include back surface members having one ends to which lead wires are connected and another ends being folded to form movable members. Until a circuit board of a control unit is inserted, end portions of the movable members are held in conductive contact with each other. When the circuit board is inserted, the movable members are separated and brought into contact with copper foil terminals. When the circuit board is removed, the movable members plastically deform and are opposed to each other with an initial gap smaller than a thickness dimension of the circuit board. With this arrangement, wiring inspection may be performed with opposed movable members shorted to one another, but for subsequent circuit board insertion at the second or subsequent insertion and removal of the circuit board, the movable members will be slightly separated by a gap to suppress slide abrasion during insertion.

Abstract: To prevent an increase of the number of kinds of components required for offset arrangement, an increase in risk of assembly error and extra time and effort for parts management, in a connector including mutually facing terminal members with contacting portions being offset in the insertion direction. Mutually facing terminal members 20 are formed on components identical in shape. The mutually facing terminal members 20 are secured to a connector housing 12 while being offset in an insertion direction of a double-sided card edge 102 inserted into a receptacle compartment 14 of the connector housing 12.

Abstract: A circuit board with circuit components mounted thereon is integrally molded with a sealing resin having a sealed end face part that is a thermosetting resin. A cylindrical intermediate adapter is bonded and fixed to the sealed end face part with an opening into which a receptacle body of a connector housing is inserted. A resilient contact connected to a lead wire is caused to be in electrical contact with a copper foil trace terminal of the circuit board. The connector housing and the intermediate adapter are made of a thermoplastic resin resistant to crack failure, which improves handling capability for inserting and withdrawing a connector.

Abstract: An electronic equipment unit includes a multi-layer circuit board. A part arrangement region on which circuit parts are mounted and a terminal region are provided on the multi-layer circuit board. The part arrangement region is encapsulated with resin. An outline region is formed from a solder resist film surrounding the part arrangement region to prevent the resin from flowing into the terminal region. A non-solder resist region is provided so as to surround the outline region and formation of the solder resist film is inhibited in the non-solder resist region. A clamp abutting surface which is pressed by a mold and surrounds the terminal region and thereby prevents the resin from flowing into the terminal region is a partial region of the multi-layer circuit board where a surface layer circuit pattern is absent.

Abstract: A control unit is stored in an airtight housing constituted by a base, an annular peripheral wall member, a cover, and first and second interior packings, second wiring conductors connected to input/output equipment and first wiring conductors connected to a host controller through a control signal connector are brought into press-contact with input/output control terminals of the control unit by first and second pressing elastic mats, the relative positions of associated components are regulated by positioning pins passing through from the cover to the base, and the cover is opened by loosening blockade screws without causing an assembly dimension error or sliding wear of conductive contact portions due to thermal deformation, whereby the control unit is detached.

Abstract: An electronic equipment unit includes a multi-layer circuit board. A part arrangement region on which circuit parts are mounted and a terminal region are provided on the multi-layer circuit board. The part arrangement region is encapsulated with resin. An outline region is formed from a solder resist film surrounding the part arrangement region to prevent the resin from flowing into the terminal region. A non-solder resist region is provided so as to surround the outline region and formation of the solder resist film is inhibited in the non-solder resist region. A clamp abutting surface which is pressed by a mold and surrounds the terminal region and thereby prevents the resin from flowing into the terminal region is a partial region of the multi-layer circuit board where a surface layer circuit pattern is absent.

Abstract: In an electronic device unit, each of the contact terminals includes a first member coupled to a press-fitting and fixing portion through intermediation of an elastically deformable portion, and a second member being coupled to the first member through intermediation of a folding portion and including a pressure bending portion formed at a terminal end of the second member. An end surface covering resin formed on the circuit board presses a pressure bending portion so that a conductive contact portion formed at the folding portion of the first member is pressed against the board-side terminal substantially in a right-angle direction. Thus, sliding contact between the conductive contact portion and the board-side terminal is diminished.

Abstract: A control unit is stored in an airtight housing constituted by a base, an annular peripheral wall member, a cover, and first and second interior packings, second wiring conductors connected to input/output equipment and first wiring conductors connected to a host controller through a control signal connector are brought into press-contact with input/output control terminals of the control unit by first and second pressing elastic mats, the relative positions of associated components are regulated by positioning pins passing through from the cover to the base, and the cover is opened by loosening blockade screws without causing an assembly dimension error or sliding wear of conductive contact portions due to thermal deformation, whereby the control unit is detached.

Abstract: In an electronic device unit, each of the contact terminals includes a first member coupled to a press-fitting and fixing portion through intermediation of an elastically deformable portion, and a second member being coupled to the first member through intermediation of a folding portion and including a pressure bending portion formed at a terminal end of the second member. An end surface covering resin formed on the circuit board presses a pressure bending portion so that a conductive contact portion formed at the folding portion of the first member is pressed against the board-side terminal substantially in a right-angle direction. Thus, sliding contact between the conductive contact portion and the board-side terminal is diminished.

Abstract: A standard characteristic which is an average characteristic of multiple samples is approximated in a polygonal-line fashion by first to third lines. The coordinate-point positions of the first and second lines at comparison adjustment points are stored as standard data in a data memory of an electronic control apparatus. An actual-product characteristic as a calibration target is approximated in a polygonal-line fashion by first to third lines. The resistance value of a label resistor is adjusted to a value corresponding to ratios of monitoring outputs. The electronic control apparatus reads the resistance values of one or two label resistors, combines them with the stored standard characteristic, and interpolates a third line portion, thereby restoring and generating the actual-product characteristic.

Abstract: In a linear solenoid 107n, an electromagnetic coil 71n, a pressure sensor 72n, and label resistors 73n and 74n for correcting an inherent variation in a pressure detection characteristic are integrated; the standard characteristic of the pressure sensor 72n is stored in a control module 120M; when driving is started, the resistance values of the label resistors 73n and 74n are read, the pressure detection characteristic of the utilized pressure sensor 72n is corrected, and an excitation current for the electromagnetic coil 71n is controlled in such a way that a target adjusted hydraulic pressure is obtained. Even when due to a change in the oil temperature, the valve opening characteristic of the linear solenoid 107n changes, the adjusted hydraulic pressure is controlled to be constant.

Abstract: A standard characteristic which is an average characteristic of multiple samples is approximated in a polygonal-line fashion by first to third lines 315a, 325a, and 335a. The coordinate-point positions of the first and second lines at comparison adjustment points are stored as standard data in a data memory of an electronic control apparatus. An actual-product characteristic as a calibration target is approximated in a polygonal-line fashion by first to third lines 315b, 325b, and 335b. The resistance value of a first label resistor is adjusted to a value corresponding to ratios (V10n/V10, V20n/V20) of monitoring outputs. The resistance value of a second label resistor is adjusted to a value corresponding to ratios (V30n/V30, V40n/V40) of monitoring outputs. The electronic control apparatus reads the resistance values of the label resistors, combines them with the stored standard characteristic, and interpolates a third line portion, thereby restoring and generating the actual-product characteristic.

Abstract: A resin-sealed electronic controller obtained by bonding and fixing a circuit board to a thermally-conductive base plate, and integrating circuit components with a molding resin so as to reduce the size. A base plate includes a first exposed portion, a second exposed portion, and an adjacent flat portion adjacent to a central window hole. First circuit components which are low-heat-generating components with large height are located in the central window hole. Second circuit components which are high-heat-generating components with small height are provided on an area corresponding to the adjacent flat portion. A height dimension of the first circuit components at least partially overlaps a thickness dimension of the base plate, to reduce a total thickness dimension. The high-heat-generating components and the low-heat-generating components being provided separately from each other permits increased mounting density of low-heat-generating components, reducing an area of the circuit board.