Abstract: In related art, when a location to be analyzed is selected from inspection data, a relatively highly critical defect among entire defects is not selected as a defect to be analyzed. Further, when a mark is placed in a fixed position associated with a defect, the mark affects the defect itself depending on the shape and size of the defect, which is problematic in the following analysis made in an analysis apparatus. Moreover, in the case of a wafer with no pattern, a defect invisible to a SEM cannot be marked. To select a highly critical defect as a defect to be analyzed, an automatic classification result from a review SEM is used to select a defect to be analyzed. Further, to avoid an effect on a defect itself, a mark is placed in a position associated with the defect with the distance from the defect to the marking position changed on a defect basis.

Abstract: The objective is to improve a classification standard. Classification standard data, in which is registered image data information that is the standard when image data is classified, and classification data, in which is registered image data information that is the result when newly input image data is classified using the classification standard data, are stored in a storage unit. An image classification device is characterized in that when any image data information of the image data that is registered in the classification data is selected by means of an input unit, and an instruction to additionally register the selected image data information in the classification standard data is input by means of the input unit, the selected image data information is additionally registered in the classification standard data.

Abstract: A defect detected by a wafer inspection tool is reliably captured by a defect review tool. A defect review condition in the defect review tool is varied depending on defect attributes provided by the wafer inspection tool so as to optimize the review process. For example, review magnification is varied depending on the size of the defect, or the frame addition number is varied depending on the maximum gray level difference.

Abstract: The objective is to improve a classification standard. Classification standard data, in which is registered image data information that is the standard when image data is classified, and classification data, in which is registered image data information that is the result when newly input image data is classified using the classification standard data, are stored in a storage unit. An image classification device is characterized in that when any image data information of the image data that is registered in the classification data is selected by means of an input unit, and an instruction to additionally register the selected image data information in the classification standard data is input by means of the input unit, the selected image data information is additionally registered in the classification standard data.

Abstract: A defect detected by a wafer inspection tool is reliably captured by a defect review tool. A defect review condition in the defect review tool is varied depending on defect attributes provided by the wafer inspection tool so as to optimize the review process. For example, review magnification is varied depending on the size of the defect, or the frame addition number is varied depending on the maximum gray level difference.

Abstract: A defect review apparatus comprises a storage for receiving and storing defect information concerning an inspection objective captured by a wafer inspection system, an image acquisition unit for capturing images concerning the inspection objective and a process unit for acquiring data for defect review based on the defect information by using the image acquisition unit. The process unit makes a decision as to whether a cluster representative of a set or gang of defects exists in the defect information read out of the storage unit and when the presence of the cluster is determined, acquires an image of a defective portion forming part of the cluster and additional data in respect of the inspection objective by using the image acquisition unit on the basis of a distributive feature of the cluster.

Abstract: To provide a device that analyzes the matching data upon determining conditions for the inspection using data processing equipment and that analyzes differences between inspection tools, thereby significantly improving and upgrading the operability of data importing and improving the usability, the present invention comprises data processing equipment connected through a communication line to a plurality of appearance inspection tools for detecting defects in a plurality of samples and a plurality of review tools for acquiring images of the defects to acquire features of the defects, wherein inspection data related to the defects in the plurality of samples from the plurality of appearance inspection tools and review data acquired by the plurality of review tools with respect to the defects are displayed on a display of the data processing equipment, and, in response to an instruction for acquiring data other than the inspection data or the review data displayed on the display, the data processing equipment a

Abstract: A defect detected by a wafer inspection tool is reliably captured by a defect review tool. A defect review condition in the defect review tool is varied depending on defect attributes provided by the wafer inspection tool so as to optimize the review process. For example, review magnification is varied depending on the size of the defect, or the frame addition number is varied depending on the maximum gray level difference.

Abstract: In a high-performance semiconductor integrated circuit, the standby current is reduced by preventing current leakage in a semiconductor integrated circuit device, for example, the memory cell of an SRAM. A gate electrode G is formed on semiconductor substrate 1 and n+-type semiconductor regions 17 (source/drain regions) are formed in the semiconductor substrate on both sides of this gate electrode. Within the same apparatus and under near-vacuum conditions, a depth of 2.5 nm or less is etched away from the surfaces of the source/drain regions and gate electrode, a film of Co is then formed on the source/drain regions, and thermal processing is applied to form CoSi2 layer 19a. As a result, current leakage in the memory cell can be prevented and this method can be applied to semiconductor integrated circuit devices that have low current consumption or are battery-driven.

Abstract: A semiconductor device producing method and a semiconductor device producing system employs a processing apparatus provided with a dust particle detecting apparatus. The dust particle detecting apparatus measures the condition of adhesion of dust particles adhering to a work at least before or after processing the work, manages the condition of incremental adhesion of dust particles to the work resulting from processing for each lot of works or for each work on the basis of the measured condition of adhesion of dust particles measured before or after processing the work, and determines the time when the processing apparatus is to be cleaned or the cycle of cleaning the processing apparatus on the basis of the managed condition of adhesion of dust particles.

Abstract: An apparatus which can solve the problem of participation of NO in hypotension in dialysis, hypoxia in dialysis, and the like during artificial dialysis by continuously monitoring fluctuation in a blood gas, an ionic component, or the like in body fluid such as blood and by suppressing these diseases, and quality evaluating means of an artificial dialyzer and dialyzing fluid are provided. An apparatus for an artificial kidney comprises a measurement monitor for continuously measuring nitric oxide as a component of body fluid or liquid for treatment. Further, an apparatus for an artificial kidney comprises a measurement monitor for measuring a component of body fluid or liquid for treatment, a display means for comparing a measurement measured by the measurement monitor with a control value, and when the measurement equals the control value, displays the equality, and oxygen supplying means.

Abstract: To provide a high-performance semiconductor integrated circuit in which the standby current is reduced by preventing current leakage in a semiconductor integrated circuit device, for example, the memory cell of an SRAM.

Abstract: An apparatus which can solve the problem of participation of NO in hypotension in dialysis, hypoxia in dialysis, and the like during artificial dialysis by continuously monitoring fluctuation in a blood gas, an ionic component, or the like in body fluid such as blood and by suppressing these diseases, and quality evaluating means of an artificial dialyzer and dialyzing fluid are provided. An apparatus for an artificial kidney comprises a measurement monitor for continuously measuring nitric oxide as a component of body fluid or liquid for treatment. Further, an apparatus for an artificial kidney comprises a measurement monitor for measuring a component of body fluid or liquid for treatment, a display means for comparing a measurement measured by the measurement monitor with a control value, and when the measurement equals the control value, displays the equality, and oxygen supplying means.

Abstract: A thermoplastic polymer composition containing a protease inhibiting substance and medical devices entirely or partly made of the thermoplastic polymer composition.Various medical devices having a good compatibility with blood can be made easily by melt-molding the thermoplastic polymer composition. The anti-thrombotic property of the medical devices lasts for a longer time because the protease inhibiting substance exudes out to the surface if rubbed off.

Abstract: A method and apparatus for detecting a defect in a circuit pattern by detecting a gray image signal from each of a plurality of circuit patterns as objects of inspection, which circuit patterns have been fabricated so as to be identical with one another, and detecting a defect as a difference of edge position between two circuit patterns by comparing the detected gray image signal of one circuit pattern with the detected gray image signal of another circuit pattern.