Patents by Inventor Fumiaki Hashimoto

Fumiaki Hashimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240069297
    Abstract: In an optical fiber cable in which an optical fiber ribbon formed by parallelly arranging a plurality of optical fibers is packaged in an internal space, a core portion of each optical fiber is made of pure quartz and an effective cross-sectional area of the core portion at a wavelength of 1,550 nm is 110 ?m2 or more and 150 ?m2 or less. The optical fiber ribbon is an optical fiber ribbon in which the optical fibers are connected by continuously applying an adhesive resin between adjacent optical fibers. An occupation ratio of the optical fiber ribbon to the internal space calculated from a ratio of a cross-sectional area of the internal space to a cross-sectional area of the packaged optical fiber ribbon is 25% or more and 55% or less.
    Type: Application
    Filed: November 10, 2021
    Publication date: February 29, 2024
    Inventors: Yutaka HASHIMOTO, Fumiaki SATO, Masashi KIKUCHI, Akira SAKURAI, Yusuke YAMADA
  • Patent number: 7354031
    Abstract: A cylindrical vibration damping apparatus having an elastic body connecting an inner shaft and an outer cylinder member, and a pair of rubber stop plates disposed at axial ends of the inner shaft member. Each rubber stop plate has a mount hole that fits about the outside of the inner shaft member. Pairs of mating projections and mating recesses are provided to an interface between an inner circumferential surface of the mount hole of the each rubber stop plate and an outer circumferential surface of the corresponding axial end of the inner shaft member at three or more different intervals in a circumferential direction so that the pair of rubber stop plates are installed onto the axial ends of the inner shaft member with correct identification of a front and back and a circumferential position about the inner shaft member. A method of manufacturing the same is also disclosed.
    Type: Grant
    Filed: February 4, 2005
    Date of Patent: April 8, 2008
    Assignee: Tokai Rubber Industries, Ltd.
    Inventors: Takehiro Okanaka, Fumiaki Hashimoto
  • Publication number: 20050179181
    Abstract: A cylindrical vibration damping apparatus having an elastic body connecting an inner shaft and an outer cylinder member, and a pair of rubber stop plates disposed at axial ends of the inner shaft member. Each rubber stop plate has a mount hole that fits about the outside of the inner shaft member. Pairs of mating projections and mating recesses are provided to an interface between an inner circumferential surface of the mount hole of the each rubber stop plate and an outer circumferential surface of the corresponding axial end of the inner shaft member at three or more different intervals in a circumferential direction so that the pair of rubber stop plates are installed onto the axial ends of the inner shaft member with correct identification of a front and back and a circumferential position about the inner shaft member. A method of manufacturing the same is also disclosed.
    Type: Application
    Filed: February 4, 2005
    Publication date: August 18, 2005
    Applicant: TOKAI RUBBER INDUSTRIES, LTD
    Inventors: Takehiro Okanaka, Fumiaki Hashimoto
  • Patent number: 6859130
    Abstract: A multilayered coil is formed by inserting insulating paper 13 having either a pressure sensitive adhesive or an adhesive disposed on both faces thereof into at least one place between thin coil layers and then magnetic cores 15 are mounted to the multilayered coil from above and below. Thus, a thin transformer for a switching power supply is provided, in which variation in distance between coil 11 and coil 12, of which one is disposed over the other, variation in distance of coil 11 and coil 12 from magnetic core 15 and the like are suppressed.
    Type: Grant
    Filed: October 24, 2002
    Date of Patent: February 22, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Koji Nakashima, Satoru Taniguchi, Naoki Hashimoto, Tomio Marui, Tsukasa Suzuki, Fumiaki Hashimoto, Satoru Inaba
  • Patent number: 6799753
    Abstract: A fluid-filled elastic mount of suspension type, wherein a lower open-end of a cylindrical portion of a second mounting member is fluid-tightly closed by a first mounting member and a tapered elastic body interposed therebetween, extending from the lower open-end into the cylindrical portion. An upper open-end portion of the cylindrical portion is closed by a flexible layer for forming a fluid-filled chamber between the elastic body and the flexible layer and being divided by a partition member into a pressure-receiving chamber defined by the elastic body and an equilibrium chamber defined by the flexible layer, which are held in communication by an orifice passage An elastic restricting projection is bonded to the partition member to protrude and be located in an intermediate portion between the radially opposite elastic body and the cylindrical portion, for restricting an annular region of the intermediate portion.
    Type: Grant
    Filed: September 27, 2002
    Date of Patent: October 5, 2004
    Assignee: Tokai Rubber Industries, Ltd.
    Inventors: Takehiro Okanaka, Fumiaki Hashimoto
  • Patent number: 6737153
    Abstract: A circuit board comprising a composite resin and a metal plate, the metal plate forming circuit patterns. The composite resin comprises 70-95 parts by weight of inorganic filler, and 5-30 parts by weight of a resin composition including a thermosetting resin and a hardener. The metal plate is surface treated to reinforce the adhesion at least at one surface contacting with the composite resin. The composite resin fills spaces between the circuit patterns, and the composite resin composition and the metal plate form a plane at a side of the metal plate for mounting components. Since the resin composition including the inorganic filler is also present in the spaces between circuit patterns of a metal plate, heat dissipation characteristic of the circuit board is extremely high, and is suited for electronic apparatus containing heat generating parts such as power circuit.
    Type: Grant
    Filed: June 28, 2002
    Date of Patent: May 18, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masaki Suzumura, Fumiaki Hashimoto
  • Publication number: 20040070480
    Abstract: A multilayered coil is formed by inserting insulating paper 13 having either a pressure sensitive adhesive or an adhesive disposed on both faces thereof into at least one place between thin coil layers and, then, magnetic cores 15 are mounted to the multilayered coil from above and below.
    Type: Application
    Filed: July 23, 2003
    Publication date: April 15, 2004
    Inventors: Koji Nakashima, Satoru Taniguchi, Naoki Hashimoto, Tomio Marui, Tsukasa Suzuki, Fumiaki Hashimoto, Satoru Inaba
  • Publication number: 20030075848
    Abstract: A fluid-filled elastic mount of suspension type, wherein a lower open-end of a cylindrical portion of a second mounting member is fluid-tightly closed by a first mounting member and a tapered elastic body interposed therebetween, extending from the lower open-end into the cylindrical portion. An upper open-end portion of the cylindrical portion is closed by a flexible layer for forming a fluid-filled chamber between the elastic body and the flexible layer and being divided by a partition member into a pressure-receiving chamber defined by the elastic body and an equilibrium chamber defined by the flexible layer, which are held in communication by an orifice passage An elastic restricting projection is bonded to the partition member to protrude and be located in an intermediate portion between the radially opposite elastic body and the cylindrical portion, for restricting an annular region of the intermediate portion.
    Type: Application
    Filed: September 27, 2002
    Publication date: April 24, 2003
    Applicant: TOKAI RUBBER INDUSTRIES, LTD.
    Inventors: Takehiro Okanaka, Fumiaki Hashimoto
  • Publication number: 20020181211
    Abstract: A circuit board of the present invention comprises a composite resin and a metal plate, and the metal plate forms circuit patterns. The metal plate is preferably made of copper or copper alloys having excellent heat conductivity. The composite resin comprises 70-95 parts by weight of inorganic filler, and 5-30 parts by weight of a resin composition including a thermosetting resin and a hardener. The metal plate is surface roughened or treated to reinforce the adhesion at least at one surface contacting with the composite resin. In the circuit board of the present invention, the composite resin fills spaces between the circuit patterns, and the composite resin composition and the metal plate form a plane at the side of the metal plate for mounting components.
    Type: Application
    Filed: June 28, 2002
    Publication date: December 5, 2002
    Inventors: Masaki Suzumura, Fumiaki Hashimoto
  • Patent number: 5917712
    Abstract: An inexpensive highly reliable power supply for small-sized electronic devices, in which any high-withstand-voltage diode which has been used conventionally is not used and reverse leak currents are prevented. A series circuit of a primary-side coil (34) of a switching transformer and a switching element (35) is connected between both ends of an input power source (31) and a series circuit composed of a resistor (32) and a capacitor (33) is also connected between both ends of the power source (31). The connecting point between the resistor (32) and capacitor (33) is connected to one end of the control winding (37) of the switching transformer and the other end of the winding (37) of the transformer is connected to the control terminal of the switching element (35). A discharge circuit (40) which is driven by signals from the control winding (37) of the transformer is used as a means for discharging the capacitor (33).
    Type: Grant
    Filed: January 26, 1998
    Date of Patent: June 29, 1999
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hideki Okura, Makoto Ono, Etsuo Tsujimoto, Fumiaki Hashimoto