Patents by Inventor Fumiaki Hayashi

Fumiaki Hayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240219391
    Abstract: Disclosed is a bone marrow aspirate analysis method that includes: measuring a sample containing bone marrow aspirate and a fluorescent dye that can stain nucleic acid, by flow cytometry, and obtaining optical information including fluorescence signal information for a particle in the sample; counting particles for which the fluorescence signal information indicates a threshold value or more, as target cells; and obtaining a screening index for a hematopoietic tumor based on a number of the target cells.
    Type: Application
    Filed: December 27, 2023
    Publication date: July 4, 2024
    Inventors: Fumiaki HAYASHI, Michiko YOSHIMOTO, Shinichiro OGUNI, Takaaki NAGAI, Yuya NAGAI, Hayato MARUOKA
  • Publication number: 20230273609
    Abstract: Disclosed is a method for applying a control reference value regarding a quality control sample to a specimen analyzer by a computer, the method comprising: generating the control reference value on the basis of a measurement result of the quality control sample measured by the specimen analyzer; and applying the control reference value to the specimen analyzer.
    Type: Application
    Filed: February 21, 2023
    Publication date: August 31, 2023
    Applicant: Sysmex Corporation
    Inventors: Kei SHIRASUNA, Daigo Fukuma, Yuto Nagao, Fumiaki Hayashi, Kanako Kiso, Tomomi Kohno
  • Publication number: 20090325104
    Abstract: An operation for forming a trench after forming a via hole includes an operation for exposing a region for forming the via hole to light and an operation for exposing a region for forming the interconnect trench. More specifically, even if chemically amplified resist is buried in the via hole after the via hole is formed, then the region for forming of via hole is exposed to light again, so that the inside of the via hole is fully exposed to light. This allows removing the buried resist from the regions in via hole exposed to light, or namely the region and the region, with a developing solution, exposing at least a portion of the inner wall of the via hole to obtain the trench having a desired structure.
    Type: Application
    Filed: June 25, 2009
    Publication date: December 31, 2009
    Applicant: NEC Electronics Corporation
    Inventor: Fumiaki Hayashi