Abstract: A stress sensor includes a circuit board having a stress sensitive structure, a pointing stick and a metallic back plate. The stress sensitive structure includes a stress deformation region and multiple resistors located on the stress deformation region. The pointing stick is disposed on a top of the circuit board and connected to the stress sensitive structure. The metallic back plate includes at least one fixing material coating region, and thus the fixing edges of the circuit board are fixed on the corresponding fixing material coating region. An assembly method for the stress sensor is also provided.

Abstract: A stress sensor includes a circuit board having a stress sensitive structure, a pointing stick and a metallic back plate. The stress sensitive structure includes a stress deformation region and multiple resistors located on the stress deformation region. The pointing stick is disposed on a top of the circuit board and connected to the stress sensitive structure. The metallic back plate includes at least one fixing material coating region, and thus the fixing edges of the circuit board are fixed on the corresponding fixing material coating region. An assembly method for the stress sensor is also provided.

Abstract: The integrated structure of the stress sensor section with the control section facilitates the confirmation of the matching of both sections before the input device is incorporated into an electronic device. For example, it is possible to select only the input device which exhibits favorable matching as a result of the confirmation and to incorporate it in the electronic device. Therefore, with the above-described structure of the present invention, an input device that enables constantly favorable matching of both the stress sensor section and the control section can be provided.

Abstract: The integrated structure of the stress sensor section with the control section facilitates the confirmation of the matching of both sections before the input device is incorporated into an electronic device. For example, it is possible to select only the input device which exhibits favorable matching as a result of the confirmation and to incorporate it in the electronic device. Therefore, with the above-described structure of the present invention, an input device that enables constantly favorable matching of both the stress sensor section and the control section can be provided.

Abstract: A stress sensor in which the direction and magnitude of a stress being applied to a post bonded to or integrated with an insulating board can be grasped from variation in the resistance of resistor elements being stimulated by application of the stress while suppressing variation in the shape of each resistor. The resistor element comprises a resistor formed, by screen print, between a pair of electrodes for the resistor element, i.e. circuit pattern electrodes, arranged on the surface of the insulating board. The electrode is connected, through a conductor, with a board terminal part arranged at one end of the insulating board. The electrode and the conductor or a print accuracy adjusting member have a constant height from the surface of the insulating board. Arrangement of the conductor, electrode and print accuracy adjusting member is entirely identical or similar for the resistor elements in the vicinity thereof.

Abstract: The integrated structure of the stress sensor section with the control section facilitates the confirmatin of the matching of both sections before the input device is incorporated into an electronic device. For example, it is possible to select only the input device which exhibits favorable matching as a result of the confirmation and to incorporate it in the electronic device. Therefore, with the above-described structure of the present invention, and input device that enables constantly favorable matching of both the stress section and the control section can be provided.

Abstract: A stress sensor in which the direction and magnitude of a stress being applied to a post (6) bonded to or integrated with the surface of an insulating board (3) can be grasped from variation in the resistance of a plurality of resistor elements (8) being stimulated by application of the stress while suppressing variation in the shape of each resistor (2). The resistor element (8) comprises a resistor (4) formed, by screen print, between a pair of electrodes for the resistor element, i.e. circuit pattern electrodes (1), arranged on the surface of the insulating board (3). The electrode is connected, through a conductor (9), with a board terminal part (5) arranged at one end of the insulating board (3). The electrode (1) and the conductor (9) or a print accuracy adjusting member (7) have a constant height from the surface of the insulating board (3).

Abstract: A method of manufacturing a wiring board is provided. The method includes performing a plating process to a land, in a condition that a resist film having an opening for exposing at least the center of the land is formed on a substrate with wires having the land formed thereon, so that a fist portion of an edge of the opening is disposed on the substrate and a second portion of the edge is disposed on the land.

Abstract: A stress sensor in which the direction and magnitude of a stress being applied to a post bonded to or integrated with an insulating board can be grasped from variation in the resistance of resistor elements being stimulated by application of the stress while suppressing variation in the shape of each resistor. The resistor element comprises a resistor formed, by screen print, between a pair of electrodes for the resistor element, i.e. circuit pattern electrodes, arranged on the surface of the insulating board. The electrode is connected, through a conductor, with a board terminal part arranged at one end of the insulating board. The electrode and the conductor or a print accuracy adjusting member have a constant height from the surface of the insulating board. Arrangement of the conductor, electrode and print accuracy adjusting member is entirely identical or similar for the resistor elements in the vicinity thereof.

Abstract: The invention provides a method of manufacturing a semiconductor that improves the productivity and the yield of a product, and grinds a semiconductor substrate so that it has almost uniform thickness. The method can include forming a protrusion on a semiconductor substrate having a first area and a second area surrounding the first area. The protrusion protruding above first area. A support being disposed on a surface on which the protrusion is formed, of the semiconductor substrate so that a through hole of the support overlaps with the first area. The semiconductor substrate can be grinded from a surface opposite to the surface on which the protrusion is formed.

Abstract: A stress sensor enduring against long-term use is provided. Accordingly, a substrate (4), which is used as both a sensor part (1) and a supporting part (2), functions as a stress sensor, in which the sensor part (1) has means for deforming a part thereof in response to a given stress and strain gauges (5) having a function for varying electric properties in response to the deformation, and in which the deforming part has a stress dispersing means (10).

Abstract: A stress sensor in which the direction and magnitude of a stress being applied to a post (6) bonded to or integrated with the surface of an insulating board (3) can be grasped from variation in the resistance of a plurality of resistor elements (8) being stimulated by application of the stress while suppressing variation in the shape of each resistor (2). The resistor element (8) comprises a resistor (4) formed, by screen print, between a pair of electrodes for the resistor element, i.e. circuit pattern electrodes (1), arranged on the surface of the insulating board (3). The electrode is connected, through a conductor (9), with a board terminal part (5) arranged at one end of the insulating board (3). The electrode (1) and the conductor (9) or a print accuracy adjusting member (7) have a constant height from the surface of the insulating board (3).

Abstract: (PROBLEM) To improve the productivity and the yield of a product, and to grind a semiconductor substrate so that it has almost uniform thickness. (MEANS TO SOLVE THE PROBLEM) A protrusion 40 is formed on a semiconductor substrate 10 having a first area 20 and a second area 30 surrounding the first area 20, the protrusion 40 protruding above first area 20. A support 60 is disposed on a surface on which the protrusion 40 is formed, of the semiconductor substrate 10 so that a through hole 61 of the support 60 overlaps with the first area 20. The semiconductor substrate 10is grinded from a surface opposite to the surface on which the protrusion 40 is formed.

Abstract: A method of manufacturing a wiring board is provided. The method includes performing a plating process to a land, in a condition that a resist film having an opening for exposing at least the center of the land is formed on a substrate with wires having the land formed thereon, so that a fist portion of an edge of the opening is disposed on the substrate and a second portion of the edge is disposed on the land.

Abstract: An input device which enables a constantly favorable matching of both a stress sensor section (10) and a control section (11). To provide this device, the stress sensor section (10) which generates a change in characteristic values of a strain gauge (14) due to stress application to a post (2) arranged on one face of a board (sensor section board (1)) is integrated with the control section (11) which converts the change in characteristic values into data on a direction and intensity of the stress. For example, a resistance element (12) is used for the strain gauge (4) arranged on the sensor section board (1). The control section (11) keeps necessary ICs and electronic components mounted on the face of the control section board (3).

Abstract: A stress sensor enduring against long-term use is provided. Accordingly, a substrate (4), which is used as both a sensor part (1) and a supporting part (2), functions as a stress sensor, in which the sensor part (1) has means for deforming a part thereof in response to a given stress and strain gauges (5) having a function for varying electric properties in response to the deformation, and in which the deforming part has a stress dispersing means (10).