Patents by Inventor Fumiaki Noma

Fumiaki Noma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7081218
    Abstract: This invention relates to a method for manufacturing a large FRP member including: disposing a preform containing a reinforcing fiber on a surface of a molding die; covering a molding portion with a bagging material or a mold and providing a suction port and a resin injection port for sealing; evacuating the molding portion through the suction port; heating the molding portion; injecting a thermosetting resin from the resin injection port for impregnating the reinforcing fiber with the resin while a temperature Tm of the molding die and a temperature Tv of the bagging material or the mold are both set to room temperature or more, and a difference ?T in temperature between the Tm and the Tv is set to 10° C. or less; and curing the resin by maintaining the molding portion at a predetermined temperature Tpc which is equal to or more than room temperature.
    Type: Grant
    Filed: August 6, 2002
    Date of Patent: July 25, 2006
    Assignee: Toray Industries, Inc.
    Inventors: Toshihide Sekido, Akihiko Kitano, Eisuke Wadahara, Fumiaki Noma
  • Publication number: 20040130072
    Abstract: The present invention relates to a method for manufacturing a large FRP member and has the following structure.
    Type: Application
    Filed: April 2, 2003
    Publication date: July 8, 2004
    Inventors: Toshihide Sekido, Akihiko Kitano, Eisuke Wadahara, Fumiaki Noma
  • Patent number: 6656302
    Abstract: To provide an epoxy resin composition suitable as a matrix resin for fiber reinforcement, and a yarn prepreg suitable in unwindability, excellent in higher processability due to drapability, high in the tensile strength of the epoxy resin composition after curing, and high in efficiency of the strength of reinforcing fibers. A yarn prepreg, satisfying the following formulae (1) to (3): 50≦Wf≦80  (1) 20,000≦F≦100,000  (2) F/8,000≦d≦F/2,400  (3) where Wf is the content by weight of the fiber bundle (%), F is the number of filaments in the fiber bundle and d is the width of the prepreg (mm).
    Type: Grant
    Filed: January 11, 2001
    Date of Patent: December 2, 2003
    Assignee: Toray Industries, Inc.
    Inventors: Hajime Kishi, Masazumi Tokunoh, Tetsuyuki Kyono, Fumiaki Noma, Toyokazu Minakuchi, Shoji Yamane
  • Publication number: 20020009581
    Abstract: To provide an epoxy resin composition suitable as a matrix resin for fiber reinforcement, and a yarn prepreg suitable in unwindability, excellent in higher processability due to drapability, high in the tensile strength of the epoxy resin composition after curing, and high in efficiency of the strength of reinforcing fibers.
    Type: Application
    Filed: January 11, 2001
    Publication date: January 24, 2002
    Inventors: Hajime Kishi, Masazumi Tokunoh, Tetsuyuki Kyono, Fumiaki Noma, Toyokazu Minakuchi, Shoji Yamane
  • Patent number: 6228474
    Abstract: To provide an epoxy resin composition suitable as a matrix resin for fiber reinforcement, and a yarn prepreg suitable in unwindability, excellent in higher processability due to drapability, high in the tensile strength of the epoxy resin composition after curing, and high in efficiency of the strength of reinforcing fibers. A yarn prepreg, satisfying the following formulae (1) to (3): 50≦Wf≦80  (1) 20,000≦F≦100,000  (2) F/8,000≦d≦F/2,400  (3) where Wf is the content by weight of the fiber bundle (%), F is the number of filaments in the fiber bundle and d is the width of the prepreg (mm).
    Type: Grant
    Filed: February 17, 1998
    Date of Patent: May 8, 2001
    Assignee: Toray Industries, Inc.
    Inventors: Hajime Kishi, Masazumi Tokunoh, Tetsuyuki Kyono, Fumiaki Noma, Toyokazu Minakuchi, Shoji Yamane
  • Patent number: 5021284
    Abstract: An electroconductive integrated substrate and a process for producing the same, which comprises a porous carbonaceous plate having a large number of pores and gas permeability, and a gas unpermeable electroconductive plate laminated on the porous carbonaceous plate and integrally bonded thereto by thermoplastic resin which is present substantially only in the pores of the porous carbonaceous plate. It is preferred to use thermoplastic resin having a melting viscosity of from 10.sup.2 to 10.sup.6 poises, and a gas permeable porous carbonaceous plate having a mean pore diameter of from 20 to 150 .mu.m and a porosity of from 40 to 85%. The porous carbonaceous plate and the gas impermeable electroconductive plate are laminated one upon the other with a thermoplastic resin film interposed therebetween, and the film is melted to bond the plates together. The integrated substrate obtained has an electrical resistance of not greater than 7 m.OMEGA., preferably not greater than 1.5 m.OMEGA.
    Type: Grant
    Filed: February 24, 1989
    Date of Patent: June 4, 1991
    Assignee: Toray Industries, Inc.
    Inventors: Kishio Miwa, Hiroaki Fukui, Fumiaki Noma