Patents by Inventor Fumigi Koyama

Fumigi Koyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF SOLDERING AN ELECTRONIC COMPONENT
    Publication number: 20110072655
    Abstract: A soldering method of an electronic component includes inserting pins of the electronic component into through-holes provided in a printed circuit board; preheating interiors of the through-holes with an inert fluid; and bonding the pins to the through-holes by exposing molten solder to the preheated through-holes.
    Type: Application
    Filed: September 28, 2010
    Publication date: March 31, 2011
    Applicant: FUJITSU LIMITED
    Inventors: Fumigi KOYAMA, Osamu Higashi
  • SOLDERING METHOD, ELECTRONIC PART, AND PART-EXCHANGING METHOD
    Publication number: 20100001048
    Abstract: A soldering method for soldering an electronic part on a substrate by reflow soldering is disclosed that includes the steps of applying a solder paste on the substrate; mounting the electronic part on the substrate by using the solder paste; disposing a heat capacity enhancing member on the electronic part, the heat capacity enhancing member including a gel-like material able to enhance the heat capacity of the electronic part; and soldering the electronic part onto the substrate by reflow soldering with the heat capacity enhancing member being applied thereon.
    Type: Application
    Filed: September 11, 2009
    Publication date: January 7, 2010
    Applicant: FUJITSU LIMITED
    Inventors: Tsuyoshi Yamamoto, Akiomi Hiruma, Fumigi Koyama
  • Soldering method, electronic part, and part-exchanging method
    Publication number: 20060266806
    Abstract: A soldering method for soldering an electronic part on a substrate by reflow soldering is disclosed that includes the steps of applying a solder paste on the substrate; mounting the electronic part on the substrate by using the solder paste; disposing a heat capacity enhancing member on the electronic part, the heat capacity enhancing member including a gel-like material able to enhance the heat capacity of the electronic part; and soldering the electronic part onto the substrate by reflow soldering with the heat capacity enhancing member being applied thereon.
    Type: Application
    Filed: August 23, 2005
    Publication date: November 30, 2006
    Applicant: FUJITSU LIMITED
    Inventors: Tsuyoshi Yamamoto, Akiomi Hiruma, Fumigi Koyama