Patents by Inventor Fumihiko Hayano

Fumihiko Hayano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110010932
    Abstract: The present disclosure relates to a method of manufacturing a wiring board. The method includes: (a) preparing a first board having a pad; (b) providing an insulating member on the first board, wherein a size of the insulating member is larger than that of the first board, when viewed from the top; (c) forming a via in the insulating member such that the via is directly connected to the pad; and (d) repeatedly forming a wiring layer and an insulating layer on the insulating member in which the via is formed, thereby forming a second board.
    Type: Application
    Filed: September 27, 2010
    Publication date: January 20, 2011
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Masato TANAKA, Fumihiko Hayano, Toru Hizume
  • Publication number: 20090135574
    Abstract: The present disclosure relates to a method of manufacturing a wiring board. The method includes: (a) preparing a first board having a pad; (b) providing an insulating member on the first board, wherein a size of the insulating member is larger than that of the first board, when viewed from the top; (c) forming a via in the insulating member such that the via is directly connected to the pad; and (d) repeatedly forming a wiring layer and an insulating layer on the insulating member in which the via is formed, thereby forming a second board.
    Type: Application
    Filed: November 21, 2008
    Publication date: May 28, 2009
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Masato TANAKA, Fumihiko Hayano, Toru Hizume