Abstract: An electronic chip component for measurement formed by bending a plate material into a structure having an end face substantially in the shape of a square C comprises a cross-link section at the top portion thereof, leg sections formed individually on the opposite sides of the cross-link section, and foot sections formed by individually bending the respective lower end portions of the leg sections inward and each having a bent proximal end and a bent distal end, the respective distal ends of the foot sections facing each other across a space, and an the respective undersurfaces of the foot sections individually constituting joint surfaces to be bonded to the terminal surface, at least the lower parts of the respective outer surfaces of the leg sections and the respective outer surfaces of the foot sections being subjected to surface treatment for soldering.