Patents by Inventor Fumihiko Iida
Fumihiko Iida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10055067Abstract: [Object] To provide a sensor device capable of detecting an operation position and a pressing force with high accuracy. [Solution] A sensor device includes a first conductor layer, an electrode substrate, and a plurality of first structural bodies configured to separate the first conductor layer from the electrode substrate. At least one of the first conductor layer and the electrode substrate has flexibility. The electrode substrate includes a plurality of first electrodes and a plurality of second electrodes intersecting the plurality of first electrodes. At least one of the first and second electrodes includes a plurality of sub-electrodes.Type: GrantFiled: February 6, 2014Date of Patent: August 21, 2018Assignee: Sony CorporationInventors: Shogo Shinkai, Kei Tsukamoto, Tomoko Katsuhara, Hiroto Kawaguchi, Hayato Hasegawa, Fumihiko Iida, Takayuki Tanaka, Tomoaki Suzuki, Taizo Nishimura, Hiroshi Mizuno, Yasuyuki Abe
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Patent number: 10007382Abstract: This information processing apparatus includes: a display panel; a sensor panel that is superimposed on the display panel and detects coordinates designated by a user; and a control unit that sets, with a region detectable by the sensor panel being a first region, a second region in at least a part of the first region and invalidates the coordinates detected in the second region.Type: GrantFiled: July 9, 2014Date of Patent: June 26, 2018Assignee: SONY CORPORATIONInventors: Fumihiko Iida, Hideo Tanaka, Kazuyuki Yamamoto
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Publication number: 20180088709Abstract: There is provided a sensor device includes a sheet-like first conductor layer and an electrode substrate. The electrode substrate includes a plurality of first electrode wires, a plurality of second electrode wires, capacity sensors being formed at paired portions of the first and second electrode wires, and a sheet substrate that supports the first and second electrode wires. The sensor device also includes a first supporting body including a plurality of first structures that connect the first conductor layer and the electrode substrate.Type: ApplicationFiled: October 14, 2017Publication date: March 29, 2018Applicant: Sony CorporationInventors: Takashi Itaya, Shogo Shinkai, Hiroto Kawaguchi, Fumihiko Iida, Hayato Hasegawa, Kei Tsukamoto, Takayuki Tanaka, Tomoko Katsuhara, Tomoaki Suzuki, Taizo Nishimura, Hiroshi Mizuno, Yasuyuki Abe
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Publication number: 20170364182Abstract: The sensor device includes a first conductive layer, a second conductive layer, an electrode substrate, a first support, and a second support. The first conductive layer is formed to be deformable sheet-shaped. The second conductive layer is disposed to be opposed to the first conductive layer. The electrode substrate includes multiple first electrode wires and multiple second electrode wires and is disposed to be deformable between the first conductive layer and the second conductive layer, the multiple second electrode wires being disposed to be opposed to the multiple first electrode wires and intersecting with the multiple first electrode wires. The first support includes multiple first structures, the multiple first structures connecting the first conductive layer and the electrode substrate. The second support includes multiple second structures, the multiple second structures connecting the second conductive layer and the electrode substrate.Type: ApplicationFiled: September 1, 2017Publication date: December 21, 2017Applicant: Sony CorporationInventors: Hiroto Kawaguchi, Shogo Shinkai, Kei Tsukamoto, Tomoko Katsuhara, Hayato Hasegawa, Fumihiko Iida, Takayuki Tanaka, Tomoaki Suzuki, Taizo Nishimura, Hiroshi Mizuno, Yasuyuki Abe
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Patent number: 9811226Abstract: There is provided a sensor device that includes a flexible first conductor layer and an electrode substrate. The electrode substrate includes a plurality of first electrode wires, a plurality of second electrode wires, capacity sensors being formed at capacitively coupled portions of the first and second electrode wires, and a flexible substrate that supports the first and second electrode wires. The sensor device also includes a first supporting body including a plurality of first structures that connect the first conductor layer and the electrode substrate.Type: GrantFiled: August 22, 2014Date of Patent: November 7, 2017Assignee: Sony CorporationInventors: Takashi Itaya, Shogo Shinkai, Hiroto Kawaguchi, Fumihiko Iida, Hayato Hasegawa, Kei Tsukamoto, Takayuki Tanaka, Tomoko Katsuhara, Tomoaki Suzuki, Taizo Nishimura, Hiroshi Mizuno, Yasuyuki Abe
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Patent number: 9785297Abstract: The sensor device includes a first conductive layer, a second conductive layer, an electrode substrate, a first support, and a second support. The first conductive layer is formed to be deformable sheet-shaped. The second conductive layer is disposed to be opposed to the first conductive layer. The electrode substrate includes multiple first electrode wires and multiple second electrode wires and is disposed to be deformable between the first conductive layer and the second conductive layer, the multiple second electrode wires being disposed to be opposed to the multiple first electrode wires and intersecting with the multiple first electrode wires. The first support includes multiple first structures, the multiple first structures connecting the first conductive layer and the electrode substrate. The second support includes multiple second structures, the multiple second structures connecting the second conductive layer and the electrode substrate.Type: GrantFiled: December 6, 2013Date of Patent: October 10, 2017Assignee: Sony CorporationInventors: Hiroto Kawaguchi, Shogo Shinkai, Kei Tsukamoto, Tomoko Katsuhara, Hayato Hasegawa, Fumihiko Iida, Takayuki Tanaka, Tomoaki Suzuki, Taizo Nishimura, Hiroshi Mizuno, Yasuyuki Abe
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Patent number: 9759840Abstract: An optical element with an antireflection function is provided with a substrate having a surface and a plurality of structures formed from convex portions or concave portions and arranged in large numbers on the surface of the substrate with a minute pitch less than or equal to the wavelength of the visible light, wherein the modulus of elasticity of the material forming the structures is 1 MPa or more, and 1,200 MPa or less, and the aspect ratio of the structure is 0.6 or more, and 1.5 or less.Type: GrantFiled: August 30, 2010Date of Patent: September 12, 2017Assignee: DEXERIALS CORPORATIONInventors: Hidetoshi Takahashi, Fumihiko Iida, Hiroyuki Kiso, Yu Nomura, Hiroshi Tazawa, Ryo Nishimura
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Patent number: 9760183Abstract: An input apparatus including a deformable sheet-like operational member having a plurality of key areas.Type: GrantFiled: December 16, 2013Date of Patent: September 12, 2017Assignee: Sony CorporationInventors: Hiroto Kawaguchi, Tetsuro Goto, Toshio Kano, Hideo Tanaka, Hayato Hasegawa, Takashi Itaya, Takayuki Tanaka, Fumihiko Iida, Tomoaki Suzuki, Taizo Nishimura, Yuji Takahashi, Yasushi Itoshiro, Shogo Shinkai
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Publication number: 20170115792Abstract: A sensor panel includes a sensor section that detects magnetic force of a contacting surface or a region in the vicinity of the contacting surface on a basis of a change in capacitance and is allowed to output a signal depending on the change in capacitance along with information on a position where the change in capacitance has occurred.Type: ApplicationFiled: April 15, 2015Publication date: April 27, 2017Inventors: TAIZO NISHIMURA, HIROTO KAWAGUCHI, HIROSHI MIZUNO, SHOGO SHINKAI, FUMIHIKO IIDA, AKIRA EBISUI, KEI TSUKAMOTO, TOMOKO KATSUHARA
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Patent number: 9632637Abstract: A sensor device includes: a first sensor including a first electrode board including a plurality of first capacitive elements arranged in a matrix, a first conductor layer facing the first electrode board, a first support layer arranged between the first electrode board and the first conductor layer, the first support layer being deformable, and a first operation input surface provided on the first electrode board or the first conductor layer, the first electrode board and/or the first conductor layer being flexible; and a second sensor layered on the first sensor, the second sensor including a second electrode board including a plurality of second capacitive elements, a second conductor layer facing the second electrode board, and a second support layer arranged between the second electrode board and the second conductor layer, the second support layer being deformable, the second electrode board and/or the second conductor layer being flexible.Type: GrantFiled: August 19, 2014Date of Patent: April 25, 2017Assignee: Sony CorporationInventors: Shogo Shinkai, Hayato Hasegawa, Hiroto Kawaguchi, Tomoko Katsuhara, Fumihiko Iida, Kei Tsukamoto, Takayuki Tanaka, Tomoaki Suzuki, Taizo Nishimura, Hiroshi Mizuno, Yasuyuki Abe
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Patent number: 9618657Abstract: An optical element has a base material having a surface and a plurality of structures which are arranged on the surface of the base material at a fine pitch equal to or shorter than the wavelength of visible light and which each includes a convex or concave portion. The elastic modulus of the material forming the structures is 1 MPa or more and 1200 MPa or less, and the surface on which the structures are formed are hydrophilic.Type: GrantFiled: March 30, 2012Date of Patent: April 11, 2017Assignee: DEXERIALS CORPORATIONInventors: Tomoo Fukuda, Sung-kil Lee, Mitsuo Arima, Fumihiko Iida, Hiroyuki Kiso, Yu Nomura
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Publication number: 20160202800Abstract: There is provided a sensor device that includes a flexible first conductor layer and an electrode substrate. The electrode substrate includes a plurality of first electrode wires, a plurality of second electrode wires, capacity sensors being formed at capacitively coupled portions of the first and second electrode wires, and a flexible substrate that supports the first and second electrode wires. The sensor device also includes a first supporting body including a plurality of first structures that connect the first conductor layer and the electrode substrate.Type: ApplicationFiled: August 22, 2014Publication date: July 14, 2016Applicant: SONY CORPORATIONInventors: Takashi Itaya, Shogo Shinkai, Hiroto Kawaguchi, Fumihiko Iida, Hayato Hasegawa, Kei Tsukamoto, Takayuki Tanaka, Tomoko Katsuhara, Tomoaki Suzuki, Taizo Nishimura, Hiroshi Mizuno, Yasuyuki Abe
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Publication number: 20160179288Abstract: This information processing apparatus includes: a display panel; a sensor panel that is superimposed on the display panel and detects coordinates designated by a user; and a control unit that sets, with a region detectable by the sensor panel being a first region, a second region in at least a part of the first region and invalidates the coordinates detected is the second region.Type: ApplicationFiled: July 9, 2014Publication date: June 23, 2016Inventors: FUMIHIKO IIDA, HIDEO TANAKA, KAZUYUKI YAMAMOTO
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Publication number: 20160179248Abstract: A sensor device includes: a sensor layer provided at a position facing a surface, of a substrate having an operation surface, opposite to the operation surface, and configured to detect a contacted position or a pressed position on the operation surface; and a gap layer located in a gap between the substrate and the sensor layer. The gap layer includes a bonding region bonding the substrate to the sensor layer, and a relaxation region relaxing stress applied from the substrate to the sensor layer.Type: ApplicationFiled: July 23, 2014Publication date: June 23, 2016Inventors: Taizo Nishimura, Fumihiko Iida, Hiroshi Mizuno, Yasuyuki Abe, Takayuki Tanaka, Hayato Hasegawa, Shogo Shinkai
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Publication number: 20150363023Abstract: The sensor device includes a first conductive layer, a second conductive layer, an electrode substrate, a first support, and a second support. The first conductive layer is formed to be deformable sheet-shaped. The second conductive layer is disposed to be opposed to the first conductive layer. The electrode substrate includes multiple first electrode wires and multiple second electrode wires and is disposed to be deformable between the first conductive layer and the second conductive layer, the multiple second electrode wires being disposed to be opposed to the multiple first electrode wires and intersecting with the multiple first electrode wires. The first support includes multiple first structures, the multiple first structures connecting the first conductive layer and the electrode substrate. The second support includes multiple second structures, the multiple second structures connecting the second conductive layer and the electrode substrate.Type: ApplicationFiled: December 6, 2013Publication date: December 17, 2015Applicant: SONY CORPORATIONInventors: Hiroto Kawaguchi, Shogo Shinkai, Kei Tsukamoto, Tomoko Katsuhara, Hayato Hasegawa, Fumihiko Iida, Takayuki Tanaka, Tomoaki Suzuki, Taizo Nishimura, Hiroshi Mizuno, Yasuyuki Abe
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Patent number: 9201105Abstract: A sensor unit is provided and includes a first substrate, first and second electrodes, an input portion disposed so that a gap exists between the substrate and the input portion, a plurality of first structures disposed in the gap and extending at least partially between the first substrate and the input portion, and a second insulating structure disposed on a side of the first structures that is away from the input portion, or between adjacent first structures. The sensor unit is configured to detect a change in capacitance between the first and second electrodes upon a change in position of the input portion relative to the first substrate.Type: GrantFiled: March 6, 2013Date of Patent: December 1, 2015Assignee: Sony CorporationInventors: Fumihiko Iida, Hiroto Kawaguchi, Hayato Hasegawa, Takashi Itaya, Toshio Kano, Takayuki Tanaka, Kei Tsukamoto
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Publication number: 20150277626Abstract: Provided is a sensor device, including: a deformable first surface; a second surface facing the first surface; an electrode board between the first surface and the second surface, the electrode board including a plurality of capacitive elements arranged in a matrix; a support including a first support layer and a second support layer, the first support layer including a plurality of first columns, the second support layer being layered on the first support layer, the support being deformable following deformation of the first surface, the support connecting at least one of the first surface and the second surface to the electrode board; and a conductor layer supported by the support.Type: ApplicationFiled: March 18, 2015Publication date: October 1, 2015Applicant: Sony CorporationInventors: Shogo Shinkai, Hiroto Kawaguchi, Hiroshi Mizuno, Taizo Nishimura, Fumihiko Iida, Kei Tsukamoto, Hayato Hasegawa, Tomoko Katsuhara
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Patent number: 8998429Abstract: A printed material includes a printed material body with a surface, and an optical element disposed on the surface of the printed material body. The optical element includes multiple structures formed at a pitch not longer than the wavelength of visible light. The structures have an aspect ratio of 0.6 or more and 5.0 or less.Type: GrantFiled: March 30, 2012Date of Patent: April 7, 2015Assignee: Sony CorporationInventors: Tomoo Fukuda, Mitsuo Arima, Sung-kil Lee, Yu Nomura, Hiroyuki Kiso, Fumihiko Iida
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Publication number: 20150070306Abstract: A sensor device includes: a first sensor including a first electrode board including a plurality of first capacitive elements arranged in a matrix, a first conductor layer facing the first electrode board, a first support layer arranged between the first electrode board and the first conductor layer, the first support layer being deformable, and a first operation input surface provided on the first electrode board or the first conductor layer, the first electrode board and/or the first conductor layer being flexible; and a second sensor layered on the first sensor, the second sensor including a second electrode board including a plurality of second capacitive elements, a second conductor layer facing the second electrode board, and a second support layer arranged between the second electrode board and the second conductor layer, the second support layer being deformable, the second electrode board and/or the second conductor layer being flexible.Type: ApplicationFiled: August 19, 2014Publication date: March 12, 2015Inventors: Shogo SHINKAI, Hayato HASEGAWA, Hiroto KAWAGUCHI, Tomoko KATSUHARA, Fumihiko IIDA, Kei TSUKAMOTO, Takayuki TANAKA, Tomoaki SUZUKI, Taizo NISHIMURA, Hiroshi MIZUNO, Yasuyuki ABE
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Publication number: 20150070600Abstract: A sensor device includes: a first base material and a second base material disposed apart to face each other; a plurality of first adhesion sections that are two-dimensionally arranged in a gap between the first base material and the second base material and have elasticity; and a mitigation section configured to mitigate an increase in contact area of each of the first adhesion sections to one of the first base material and the second base material, the contact area increasing as the gap narrows.Type: ApplicationFiled: September 3, 2014Publication date: March 12, 2015Inventors: Hiroto KAWAGUCHI, Fumihiko IIDA, Tomoaki SUZUKI, Takayuki TANAKA, Shogo SHINKAI, Hayato HASEGAWA, Tomoko KATSUHARA, Taizo NISHIMURA, Hiroshi MIZUNO, Yasuyuki ABE