Patents by Inventor Fumihiko Kawano

Fumihiko Kawano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6202653
    Abstract: In this processing solution supplying apparatus, when restarting the hydrophobic process, the air in the supply pipe is exhausted outside before performing the hydrophobic process by using a transfer gas, bypassing the process chamber. Thus, a large-sized mist of HMDS staying inside the supply pipe is not supplied to the wafer as it is, and after restarting the hydrophobic process after a prolonged stoppage of the adhesion apparatus, the vapor or mist of HMDS can be supplied uniformly to the wafer.
    Type: Grant
    Filed: March 17, 1999
    Date of Patent: March 20, 2001
    Assignee: Tokyo Electron Ltd.
    Inventors: Koji Harada, Fumihiko Kawano
  • Patent number: 5876280
    Abstract: The present invention provides a substrate treating system for successively treating a plurality of substrates W under an air-conditioned environment.
    Type: Grant
    Filed: May 29, 1997
    Date of Patent: March 2, 1999
    Assignee: Tokyo Electron Limited
    Inventors: Junichi Kitano, Hiroshi Shinya, Takayuki Katano, Hidetami Yaegashi, Yasunori Kawakami, Fumihiko Kawano
  • Patent number: D481934
    Type: Grant
    Filed: December 12, 2002
    Date of Patent: November 11, 2003
    Assignee: Kondotec Inc.
    Inventors: Shigeo Horie, Satoshi Sotoma, Fumihiko Kawano, Harunobu Enami