Abstract: A System-in-Package includes a first chip to be mounted in common for a plurality of product types, a second chip having different specifications for each product type, and a wiring substrate being common to a plurality of product types, on which the first chip and the second chip are to be mounted. A setting signal is supplied from the second chip to the first chip.

Abstract: A connecting state of a signal terminal provided in a semiconductor device is confirmed by externally applying a voltage through a resistor to the signal terminal and detecting a voltage value range in which a voltage value measured at the signal terminal falls. Although the number of measurements of voltage value at the signal terminals to be tested is increased compared with the conventional method, the time necessary for each measurement is very short and it is possible to substantially reduce the total test time.

Abstract: A CMOS integrated circuit is tested by creating a database in which types of CMOS functional units of the integrated circuit are mapped to values of quiescent power supply currents which would flow through the functional units corresponding to all possible internal states of the integrated circuit. A test pattern is applied to a simulation model of the functional units of the integrated circuits and an output is detected therefrom. Corresponding to the output of the simulation model, values of the quiescent power supply currents are read from the database and a decision threshold is derived from a total sum of the read values. A power supply current of the integrated circuit is then measured while subjecting it to the test pattern and the measured current is compared with the decision threshold to produce a test result of the integrated circuit.