Abstract: An electronic-component lead terminal includes a lead terminal one end of which is connectable to an electronic component and the other end of which is connectable to an electrode, and a solder-wicking prevention area formed on a surface of the lead terminal so as to intersect a solder-wicking direction oriented from the other end toward the one end, the solder-wicking prevention area including a plurality of portions projecting to a downstream side in the solder-wicking direction.

Abstract: An electronic component lead manufacturing method includes irradiating a first laser beam to a second layer with a solder wettability higher than a first layer, the second layer being laminated on the outside of the first layer of the lead used by the electronic component, and exposing the first layer from the second layer based on the irradiating of the first laser beam, and forming a projecting part near a region irradiated by a second laser beam by irradiating the second laser beam to the exposed first layer.

Abstract: An electronic component includes: an electronic component body; and a lead secured to the electric component and including a projection portion defined by first and second inclined portions facing each other. The solder wettability of the first inclined portion is smaller than the solder wettability of the second inclined portion.

Abstract: An electronic-component lead terminal includes a lead terminal one end of which is connectable to an electronic component and the other end of which is connectable to an electrode, and a solder-wicking prevention area formed on a surface of the lead terminal so as to intersect a solder-wicking direction oriented from the other end toward the one end, the solder-wicking prevention area including a plurality of portions projecting to a downstream side in the solder-wicking direction.

Abstract: A polishing apparatus to simultaneously polish both surfaces of a work, and includes a pair of stools rotating in opposite directions, a pair of detecting units to detect rotation rates of the stools, a pressurizing unit to compress the work between the pair of the stools, a slurry supply unit to supply a slurry to the stools, and a control unit to reduce, when determining that a frictional force between the polishing surface and the work exceeds a threshold, at least one of a load applied by the pressurizing unit, the rotation rate of the stools, and a supply amount of the slurry.

Abstract: A lead configured to join to a signal line of an electronic part through solder is disposed in an opposing relationship to the signal line and extends for sliding movement. A first opposing face section including a pair of faces having wettability to the solder is formed on surfaces of the signal line and the lead. Further, a second opposing face section including a pair of faces having wettability lower than the wettability of the first opposing face section is formed on the surfaces of the signal line and the lead along an extending direction of the lead.

Abstract: A lead configured to join to a signal line of an electronic part through solder is disposed in an opposing relationship to the signal line and extends for sliding movement. A first opposing face section including a pair of faces having wettability to the solder is formed on surfaces of the signal line and the lead. Further, a second opposing face section including a pair of faces having wettability lower than the wettability of the first opposing face section is formed on the surfaces of the signal line and the lead along an extending direction of the lead.

Abstract: A method of processing a film substrate includes removing a portion of the film substrate; and fusing a part of the film substrate around the removed portion to seal scraps of the film substrate, which are generated when removing the portion of the film substrate, in the fused part of the film substrate.

Abstract: An electronic component includes: an electronic component body; and a lead secured to the electric component and including a projection portion defined by first and second inclined portions facing each other. The solder wettability of the first inclined portion is smaller than the solder wettability of the second inclined portion.

Abstract: An electronic component lead manufacturing method includes irradiating a first laser beam to a second layer with a solder wettability higher than a first layer, the second layer being laminated on the outside of the first layer of the lead used by the electronic component, and exposing the first layer from the second layer based on the irradiating of the first laser beam, and forming a projecting part near a region irradiated by a second laser beam by irradiating the second laser beam to the exposed first layer.

Abstract: A probe cleaning apparatus includes a cleaning-conditions database. The probe cleaning apparatus removes contamination from a probe by irradiating the probe by a laser beam, refers to the cleaning-conditions database based on information about the probe, such as material and shape, and controls properties of the laser beam, such as output intensity, pulse interval, wavelength, and pulse width, so that the probe cleaning apparatus removes the contamination from the probe without damaging the probe by heat.

Abstract: A polishing apparatus is configured to simultaneously polish both surfaces of a work, and includes a pair of stools rotating in opposite directions, a pair of detecting units configured to detect rotation rates of the stools, a pressurizing unit configured to compress the work between the pair of the stools, a slurry supply unit configured to supply a slurry to the stool, and a control unit configured to reduce, when determining that a frictional force between the polishing surface and the work exceeds a threshold, at least one of a load applied by the pressurizing unit, the rotation rate of the stool, and a supply amount of the slurry supplied by the slurry supply unit.

Abstract: A polishing method configured to simultaneously polish both surfaces of a work includes the steps of inserting the work into a hole in a carrier and fixing the work with a fixing member, attaching the carrier to a polishing apparatus, polishing both surfaces of the work simultaneously, and detaching the carrier from the polishing apparatus after the polishing step, and attaching the carrier to an immediate cleaning apparatus.

Abstract: A polishing apparatus is configured to simultaneously polish both surfaces of a work and includes a sun gear provided around a rotational axis of one of a pair of polishing surfaces, a carrier having a hole configured to house the work, and including teeth so as to serve as a planetary gear which rotates and revolves around the sun gear, and a first dustproof mechanism that includes a first elastic member that contacts one surface of the carrier opposite to one of the polishing surfaces between the sun gear and the hole in the carrier.

Abstract: According to an aspect of an embodiment, a method for fabricating a workpiece comprises the steps of: irradiating the workpiece with a laser light to raise a temperature of the workpiece at an elevated level under which at least a part of the workpiece is melted, and maintaining at least a part of the workpiece to be melted until the part of the workpiece is separated.

Abstract: A device manufacturing method is disclosed that includes the steps of moving a device at a constant speed while irradiating a laser beam on the device, and processing a part of the device with the laser beam.

Abstract: A fluid filling apparatus allows a stage to receive a plate on a fluid spreading over a surface of the stage. A driving mechanism drives the plate along the surface of the stage. Relative movement is induced between through holes, formed in the plate, and the fluid. Since the through holes open to the fluid, the openings of the through holes are rubbed against the fluid. The edges of the openings serve to scrape the fluid. The scraped fluid penetrates into the through holes. The through holes are thus simultaneously filled with the fluid in a significantly facilitated manner. In addition, since the through holes can be filled with the solder material without application of a large pressure, a large-scale apparatus is not required. Moreover, the alignment of the through holes is not required.

Abstract: A method for manufacturing a slider including a head for recording data into and reproducing data from a record carrier, and a floatation surface that floats above the record carrier includes the steps of setting an orthogonal coordinate system having an origin as a center of the floatation surface, and regulating a shape of the floatation surface by using laser to scan a rear surface of the floatation surface so that a flatness at each of plural positions set by the orthogonal coordinate system.

Abstract: A laser irradiation device and a method thereof for irradiating a laser beam onto a workpiece for bending processing are disclosed. The laser irradiation device includes a light condensing unit configured to condense an incident laser beam; a shaping optical unit configured to change the condensed laser beam from the light condensing unit to a laser beam having an elongated elliptic cross section, and irradiate the shaped laser beam onto the workpiece; and a control unit configured to adjust a relative position between the shaping optical unit and the workpiece so that a long axis of the cross section of the shaped laser beam is in coincidence with a reference line on the workpiece.

Abstract: A method for manufacturing a slider including a head for recording data into and reproducing data from a record carrier, and a floatation surface that floats above the record carrier includes the steps of setting an orthogonal coordinate system having an origin as a center of the floatation surface, and regulating a shape of the floatation surface by using laser to scan a rear surface of the floatation surface so that a flatness at each of plural positions set by the orthogonal coordinate system.