Patents by Inventor Fumihiro Itoigawa
Fumihiro Itoigawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230158604Abstract: Provided is a laser processing apparatus configured to machine a corner portion of a sample by causing the corner portion to relatively approach a laser, the laser being emitted such that an optical axis of the laser extends in a predetermined direction, the corner portion being formed by a plurality of adjacent surfaces of the sample, the laser processing apparatus including: a detection unit provided at a position at least outside an irradiation region of the laser, the irradiation region extending in a tubular shape in a plan view intersecting the optical axis, the detection unit being configured to detect intensity of light reaching the position; approach control means for controlling an actuator relatively displacing the sample along a direction intersecting the optical axis such that the sample relatively approaches the optical axis; value acquisition means for acquiring the intensity of the light defined as a value detected by the detection unit in a predetermined positional relationship in which a tipType: ApplicationFiled: March 4, 2021Publication date: May 25, 2023Inventors: Fumihiro Itoigawa, Osamu Konda, Sho Fujiwara, Shotaro Yasuda
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Publication number: 20220347791Abstract: Provided is a laser processing apparatus configured to machine a corner portion of a machining target object by causing the corner portion to be relatively displaced toward a laser, the laser having an optical axis extending in a predetermined direction, the corner portion being formed by a plurality of adjacent surfaces of the machining target object and including a coating layer comprising a light-transmissive material, the laser processing apparatus including: displacement control means for controlling an actuator such that the machining target object becomes relatively close to or away from the optical axis; a detection unit provided at a position at least outside an irradiation region of the laser, the irradiation region extending in a tubular shape in a plan view intersecting the optical axis, the detection unit being configured to detect intensity of light reaching the position; and detection means for detecting a distance of relative displacement of the machining target object between points of detectType: ApplicationFiled: February 26, 2021Publication date: November 3, 2022Inventors: Fumihiro Itoigawa, Osamu Konda, Sho Fujiwara, Shotaro Yasuda
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Publication number: 20220305563Abstract: A rotation mechanism 9 rotates a spindle 2a to which a workpiece 6 is attached. A feed mechanism 8 feeds a cutting edge 4a positioned obliquely relative to a rotation axis of the workpiece 6 in a direction containing a cutting direction component orthogonal to the rotation axis with the cutting edge 4a cutting into the workpiece 6 to machine a surface of the workpiece 6. The cutting edge 4a of a cutting tool 4 has been formed by scanning a cylindrical irradiation region including a focused spot of laser light over a diamond-coated layer of a chip base material.Type: ApplicationFiled: August 18, 2020Publication date: September 29, 2022Inventors: Eiji SHAMOTO, Fumihiro ITOIGAWA, Ryuzo MORI
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Patent number: 11440147Abstract: A controller performs a first process of scanning a cylindrical irradiation region including a focused spot of laser light emitted from a laser light emitter to machine a flank face side of a workpiece to manufacture a cutting tool having a plurality of cutting edges arranged in line. In the first process, the controller scans the cylindrical irradiation region along a scanning path that has periodicity and changes a machining depth to form the plurality of cutting edges. The controller further performs a second process of scanning the cylindrical irradiation region including the focused spot of the laser light emitted in a direction different from an irradiation direction of the laser light in the first process to machine a rake face side of the workpiece.Type: GrantFiled: February 25, 2020Date of Patent: September 13, 2022Assignees: National University Corporation Tokai National Higher Education and Research System, Nagoya Institute of TechnologyInventors: Eiji Shamoto, Fumihiro Itoigawa
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Publication number: 20210346981Abstract: A tool holder attached to a main spindle of a machine tool is provided. The tool holder includes a main body that has a tubular shape and extends in a direction away from the main spindle with the tool holder attached to the main spindle; an optically pumped laser that is installed inside the main body and configured to radiate a laser light by using an exciting light provided by a light source; an optical system that guides the laser light radiated by the optically pumped laser so that the laser light is emitted from a leading end of the main body in an extending direction of the main body; and a light-guiding path that guides the exciting light from an outside of the main body to the optically pumped laser.Type: ApplicationFiled: March 15, 2019Publication date: November 11, 2021Inventor: Fumihiro Itoigawa
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Publication number: 20200269366Abstract: A controller performs a first process of scanning a cylindrical irradiation region including a focused spot of laser light emitted from a laser light emitter to machine a flank face side of a workpiece to manufacture a cutting tool having a plurality of cutting edges arranged in line. In the first process, the controller scans the cylindrical irradiation region along a scanning path that has periodicity and changes a machining depth to form the plurality of cutting edges. The controller further performs a second process of scanning the cylindrical irradiation region including the focused spot of the laser light emitted in a direction different from an irradiation direction of the laser light in the first process to machine a rake face side of the workpiece.Type: ApplicationFiled: February 25, 2020Publication date: August 27, 2020Inventors: Eiji SHAMOTO, Fumihiro ITOIGAWA
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Patent number: 10293415Abstract: A shaft portion and a blade portion provided on a side surface of the shaft portion are included, and the blade portion includes cutting blades arranged in a plurality of lines on a side surface of the shaft portion along a peripheral direction, and arranged in a plurality of stages in an extending direction of a shaft center of the shaft portion in each line. Further, the cutting blade has a radial-direction clearance angle, a tip end-side clearance angle, and a base end-side clearance angle.Type: GrantFiled: March 14, 2017Date of Patent: May 21, 2019Assignees: NAGOYA INSTITUTE OF TECHNOLGY, SUMITOMO ELECTRIC INDUSTRIES, LTD., DMG MORI CO., LTD., Mitsubishi Heavy Industries Aero Engines, Ltd.Inventors: Makoto Yamasaki, Shiro Nagami, Junichi Marui, Yoshiki Nishioka, Fumihiro Itoigawa, Kiichi Meguro, Yohei Oda
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Publication number: 20170266739Abstract: A shaft portion and a blade portion provided on a side surface of the shaft portion are included, and the blade portion includes cutting blades arranged in a plurality of lines on a side surface of the shaft portion along a peripheral direction, and arranged in a plurality of stages in an extending direction of a shaft center of the shaft portion in each line. Further, the cutting blade has a radial-direction clearance angle, a tip end-side clearance angle, and a base end-side clearance angle.Type: ApplicationFiled: March 14, 2017Publication date: September 21, 2017Inventors: Makoto YAMASAKI, Shiro NAGAMI, Junichi MARUI, Yoshiki NISHIOKA, Fumihiro ITOIGAWA, Kiichi MEGURO, Yohei ODA
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Publication number: 20150231738Abstract: A laser processing method includes steps of providing a mask material of which thickness is equal to or greater than 10 ?m onto an object, and forming a hole in the object or cutting the object in a state where the mask material is provided on the object, in a manner that an ultrashort-pulse laser light is irradiated from above the object and an opening portion is formed at the mask material to penetrate the mask material while ablation processing is performed to a portion of the object by the ultrashort-pulse laser light, the portion of the object being below the opening portion.Type: ApplicationFiled: February 18, 2015Publication date: August 20, 2015Applicant: AISIN SEIKI KABUSHIKI KAISHAInventors: Michiharu OTA, Hidetomo TAKAHASHI, Shinya SAKAKIBARA, Fumihiro ITOIGAWA, Shingo ONO
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Patent number: 9067265Abstract: There is provided a cutting method for cutting a work by rotating a rotary tool with a circular cutting edge around an axis while a cutting fluid is supplied thereto. Cutting is performed by means of the rotary tool which is rotated in the same rotational direction as an outflow direction of chips, and the rotary tool is rotated at a rotational speed of the rotary tool at which a circumferential speed of the cutting edge is higher than an outflow speed of the chips. Thus, the area of direct solid contact between the rotary tool and the chips is reduced with the aid of a dynamic pressure effect, and the abrasion of the rotary tool is suppressed.Type: GrantFiled: January 20, 2011Date of Patent: June 30, 2015Assignees: Okuma Corporation, National University Corporation Nagoya Institute of Technology, Aichi-Prefectural GovernmentInventors: Takashi Norihisa, Fumihiro Itoigawa, Keiichi Kawata, Kazumasa Ishikawa
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Publication number: 20110188958Abstract: There is provided a cutting method for cutting a work by rotating a rotary tool with a circular cutting edge around an axis while a cutting fluid is supplied thereto. Cutting is performed by means of the rotary tool which is rotated in the same rotational direction as an outflow direction of chips, and the rotary tool is rotated at a rotational speed of the rotary tool at which a circumferential speed of the cutting edge is higher than an outflow speed of the chips. Thus, the area of direct solid contact between the rotary tool and the chips is reduced with the aid of a dynamic pressure effect, and the abrasion of the rotary tool is suppressed.Type: ApplicationFiled: January 20, 2011Publication date: August 4, 2011Applicants: Okuma Corporation, National University Corporation Nagoya Institute of Technology, Aichi Prefectural GovernmentInventors: Takashi Norihisa, Fumihiro Itoigawa, Keiichi Kawata, Kazumasa Ishikawa
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Patent number: 4963074Abstract: A swash plate type compressor has a rotary shaft, an inclined swash plate for rotation with the shaft, and a plurality of pistons connected to the swash plate. Each piston defines at both ends thereof a pair of working chambers. The piston reciprocates while being subjected to a swing motion concomitant with the rotation of the swash plate, to suck a fluid into the working chambers for compression. The swash plate is mounted on the shaft through a support unit which serves to selectively vary the inclination of the swash plate and shift the center of rotation of the swash plate along the shaft. The fluid is introduced from a suction passage through and around the swash plate to suction chambers formed adjacent the working chambers. A bypass passage is formed to directly communicate the suction passage with the suction chamber on one side of the shaft while bypassing the swash plate.Type: GrantFiled: January 4, 1990Date of Patent: October 16, 1990Assignees: Nippondenso Co., Ltd., Nippon Soken, Inc.Inventors: Masami Sanuki, Fumihiro Itoigawa, Akikazu Kojima, Mitsuo Inagaki, Masanori Yasuda, Yoshiki Kurokawa, Kazuhito Miyagawa, Seiichiro Suzuki, Shigeki Iwanami, Shiro Kawasaki, Nobuhiro Miura
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Patent number: 4932843Abstract: A variable displacement swash-plate type compressor has a swash plate rockably carried by a shaft, and a spool for changing the angle of tilt of the swash plate and also the position of the center of the swash plate, thereby to vary the displacement of the compressor. The compressor has a control valve which determines a control pressure to be supplied to a control pressure chamber behind the spool, between the level of a low-pressure introduced from a low-pressure side of the compressor and a high-pressure introduced from a high-pressure side of the compressor.Type: GrantFiled: January 11, 1989Date of Patent: June 12, 1990Assignees: Nippondenso Co., Ltd., Nippon Soken, Inc.Inventors: Fumihiro Itoigawa, Mitsuo Inagaki, Shigeki Iwanami, Yoshiki Kurokawa, Akikazu Kojima