Abstract: The invention provides a method for producing a modified conjugated diene (co)polymer, the method including comprising: a modification reaction step including causing an organic silane compound to react with a conjugated diene (co)polymer having an active site at the active site, the organic silane compound having a characteristic group for forming a silanol group through hydrolysis and, in the vicinity of the characteristic group, (i) a functional group which binds the organic silane compound to the conjugated diene (co)polymer via addition to or substitution at the active site and which promotes reaction between the silanol group and a reinforcing filler after the addition or substitution reaction, or (ii) a functional group which promotes reaction between the silanol group and a reinforcing filler, and a hydrolyzation step performed after the modification reaction step; a modified conjugated diene (co)polymer having, at a molecular end of the conjugated diene (co)polymer, a silanol group, and a functional

Abstract: A run flat tire which comprises a ply layer (4) disposed extending toroidally between a pair of bead cores and comprising ply coating rubber and ply cords, an inner liner layer (5) disposed circumferentially at an inner side of the ply layer, side reinforcing rubber layers (6) having an approximately crescent-shaped cross section and disposed in side portions of the tire between the ply layer and the inner liner layer and rubber sheets (7) disposed extending at interface of the ply layer and the side reinforcing rubber layer, wherein relations of t90>tp10 and t10<ts90 are satisfied when characteristic values of vulcanization obtained in accordance with JIS K6300-2 are represented by tp10 and tp90 for the ply coating rubber, ts10, and ts90 for the side reinforcing rubber and t10 and t90 for the rubber for a sheet.

Abstract: A resin composition of the present invention is used for providing a spacer 104 having a grid-like shape at a planar view thereof between a semiconductor wafer 101? and a transparent substrate 102. The resin composition includes a constituent material containing an alkali soluble resin, a thermosetting resin and a photo initiator. In the case where a semiconductor wafer 101? and a transparent substrate 102 are bonded together through a spacer 104 formed on a substantially overall surface thereof to obtain a bonded body 2000, and then the semiconductor wafer makes one-fifth thickness, a warpage of the bonded body 2000 is 3,000 ?m or less. Further, it is preferred that the warpage of the bonded body 2000 before the process thereof is 500 ?m or less, and an increasing ratio of the warpage of the bonded body 2000 after the process thereof is 600% or less.

Abstract: A method of manufacturing a semiconductor wafer bonding product according to the present invention includes: a step of preparing a spacer formation film including a support base having a sheet-like shape and a spacer formation layer provided on the support base and having photosensitivity; a step of attaching the spacer formation layer to a semiconductor wafer having one surface from a side of the one surface; a step of forming a spacer by subjecting the spacer formation layer to exposure and development to be patterned and removing the support base; and a step of bonding a transparent substrate to a region of the spacer where the removed support base was provided so that transparent substrate is included within the region. This makes it possible to manufacture a semiconductor wafer bonding product in which the semiconductor wafer and the transparent substrate are bonded together through the spacer uniformly and reliably.

Abstract: A method of manufacturing a semiconductor wafer bonding product according to the present invention includes: a step of preparing a spacer formation film including a support base having a sheet-like shape and a spacer formation layer provided on the support base and having photosensitivity; a step of attaching the spacer formation layer to a semiconductor wafer having one surface from a side of the one surface; a step of forming a spacer by subjecting exposure and development to the spacer formation layer to be patterned and removing the support base; a step of bonding a transparent substrate to a region of the spacer, with which the removed support base made contact, so as to be included within the region. This makes it possible to manufacture a semiconductor wafer bonding product in which the semiconductor wafer and the transparent substrate are bonded together through the spacer uniformly and reliably.

Abstract: According to one aspect of the present invention, a film for a resin spacer (10) comprises an adhesive layer (12) made of a resin composition and a cover film (14) covering a surface of the adhesive layer (12). In the above-described film for a resin spacer (10), an adhesion force C1 between the adhesive layer (12) and the cover film (14) and an adhesion force D between the adhesive layer (12) and a silicone resin are set so as to satisfy the condition C1>D. Consequently, it is possible to reduce resin adherence to a cutting table at the time of cutting the film for a resin spacer (10).

Abstract: A method of manufacturing a semiconductor wafer bonding product according to the present invention, including: a step of preparing a spacer formation film including a support base and a spacer formation layer; a step of attaching the spacer formation layer of the spacer formation film to a semiconductor wafer; a step of selectively exposing the spacer formation layer with an exposure light via a mask, which is placed at a side of the support base of the spacer formation film, so as to be passed through the support base; a step of removing the support base; a step of developing the spacer formation layer to form a spacer on the semiconductor wafer; and a step of bonding a transparent substrate to a surface of the spacer opposite to the semiconductor wafer.

Abstract: A spacer formation film is adapted to be used for forming a spacer defining air-gap portions on a side of one surface of a semiconductor wafer and by being cut into a desired shape, the spacer formation film includes: a support base having a sheet-like shape; a spacer formation layer provided on the support base and having a bonding property, the spacer formation layer formed of a material containing an alkali soluble resin, a thermosetting resin and a photo polymerization initiator; and a cutting line along which the spacer formation film is to be cut, wherein the spacer formation layer is provided inside the cutting line so that a peripheral edge thereof is not overlapped to the cutting line.

Abstract: An object of the present invention is to provide a photosensitive resin composition which leaves a small amount of resin residues after patterning by light-exposure and development and can reduce condensation between the semiconductor wafer and the transparent substrate under a high temperature and high humidity environment, an adhesive film made of the photosensitive resin composition and a light-receiving device including the adhesive film. The photosensitive resin composition of the present invention contains an alkali soluble resin (A), a photopolymerization initiator (B) and a compound (C) having a phenolic hydroxyl group and a carboxyl group.

Abstract: A semiconductor wafer bonding product according to the present invention includes: a semiconductor wafer; a transparent substrate provided at a side of a functional surface of the semiconductor wafer; a spacer provided between the semiconductor wafer and the transparent substrate; and a bonded portion continuously provided along a periphery of the semiconductor wafer, the transparent substrate being bonded to the semiconductor wafer through the bonded portion. It is preferred that a minimum width of the bonded portion is 50 ?m or more.

Abstract: A photosensitive resin composition includes (A) an alkali-soluble resin, (B) an epoxy resin, and (C) a photopolymerization initiator, the epoxy resin (B) being an epoxy resin having a naphthalene skeleton and/or an epoxy resin having a triphenylmethane skeleton. A semiconductor device including a semiconductor wafer, a transparent substrate, and a spacer formed by a photosensitive adhesive film produced using the photosensitive resin composition does not suffer from condensation of dew. A light-receiving device having excellent reliability can also be obtained.

Abstract: The invention provides a method for producing a modified conjugated diene (co)polymer, the method including comprising: a modification reaction step including causing an organic silane compound to react with a conjugated diene (co)polymer having an active site at the active site, the organic silane compound having a characteristic group for forming a silanol group through hydrolysis and, in the vicinity of the characteristic group, (i) a functional group which binds the organic silane compound to the conjugated diene (co)polymer via addition to or substitution at the active site and which promotes reaction between the silanol group and a reinforcing filler after the addition or substitution reaction, or (ii) a functional group which promotes reaction between the silanol group and a reinforcing filler, and a hydrolyzation step performed after the modification reaction step; a modified conjugated diene (co)polymer having, at a molecular end of the conjugated diene (co)polymer, a silanol group, and a functional

Abstract: There is provided a device including at least one light-receiving unit 11, a base substrate 12A provided with the light-receiving unit 11, a transparent base substrate 13A disposed facing the base substrate 12A and the light-receiving unit 11, and a frame member 14A disposed around the light-receiving unit 11 between the base substrate 12A and the transparent substrate 13A. The frame member 14A consists of a cured resin composition. The resin composition contains an alkali-soluble resin, a photopolymerizable resin and an inorganic filler in 9% or less by weight. The photopolymerizable resin contains an acrylic polyfunctional monomer. The frame member 14A has a moisture permeability of 12 [g/m2·24 h] or more and an elastic modulus of 100 Pa or more at 80 degrees C.

Abstract: Disclosed is a photosensitive resin composition which is used as a photosensitive resin spacer for forming a cavity section between a substrate and a semiconductor element, including (A) an alkali-soluble resin, (B) a photopolymerizable resin, (C) a filler and (D) a photosensitizing agent, wherein the average particle diameter of said filler is in the range of 5 to 25 nm and the content of said filler is in the range of 1 to 15 weight %. Also disclosed is a film for a photosensitive resin spacer which is composed of the photosensitive resin composition described above.

Abstract: The present invention provides a rubber composition which comprises a rubber component comprising 50% by mass or more of an isocyanate-modified diene rubber having a content of vinyl bond of 20% by mass or greater in the diene component and, based on 100 parts by mass of the rubber component, 2 to 20 parts by mass of a phenolic resin and 0.5 to 5 parts by mass of a curing agent for the resin and a run flat tire in which the rubber composition is used for the side reinforcing layer and/or the bead filler. Durability under the run flat condition is improved without adverse effects on ride quality during driving under the normal condition.

Abstract: A run flat tire which comprises a ply layer (4) disposed extending toroidally between a pair of bead cores and comprising ply coating rubber and ply cords, an inner liner layer (5) disposed circumferentially at an inner side of the ply layer, side reinforcing rubber layers (6) having an approximately crescent-shaped cross section and disposed in side portions of the tire between the ply layer and the inner liner layer and rubber sheets (7) disposed extending at interface of the ply layer and the side reinforcing rubber layer, wherein relations of t90>tp10 and t10<ts90 are satisfied when characteristic values of vulcanization obtained in accordance with JIS K6300-2 are represented by tp10 and tp90 for the ply coating rubber, ts10, and ts90 for the side reinforcing rubber and t10 and t90 for the rubber for a sheet.

Abstract: A rubber composition comprises 0.1-10 parts by mass of at least one of non-ionic surfactants having a special structure based on 100 parts by mass of at least one rubber component selected from natural rubber and synthetic diene rubbers.

Abstract: A rubber composition comprises 0.1-10 parts by mass of at least one of non-ionic surfactants having a special structure based on 100 parts by mass of at least one rubber component selected from natural rubber and synthetic diene rubbers.