Patents by Inventor Fumihiro Yamashita

Fumihiro Yamashita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Soldering machine
    Patent number: 6761301
    Abstract: A soldering machine using lead-free solders is provided which can uniformly heat a printed circuit board and electronic parts to be mounted thereon, and which can solder the electronic parts without thermally damaging them. A porous member having a number of holes formed therein is disposed between a blower fan and a heater for making uniform the pressure of a fluid. A radiation plate is disposed between the heater and a heating target for blowing the fluid having been heated by the heater to the heating target in the form of a turbulent flow. The heated fluid is blown to the heating target for heating the same, whereby solder is melted.
    Type: Grant
    Filed: March 15, 2002
    Date of Patent: July 13, 2004
    Assignees: Hitachi, Ltd., Tamura/FA System Co., Ltd., Hitachi Car Engineering Co., Ltd., Tamura Corporation
    Inventors: Hideki Mukuno, Kazumi Tashiro, Hideaki Arita, Kiyoshi Kanai, Teruo Okano, Fumihiro Yamashita, Shoichirou Matsuhisa, Hidekazu Imai
  • Soldering machine
    Publication number: 20020100791
    Abstract: A soldering machine using lead-free solders is provided which can uniformly heat a printed circuit board and electronic parts to be mounted thereon, and which can solder the electronic parts without thermally damaging them. A porous member having a number of holes formed therein is disposed between a blower fan and a heater for making uniform the pressure of a fluid. A radiation plate is disposed between the heater and a heating target for blowing the fluid having been heated by the heater to the heating target in the form of a turbulent flow. The heated fluid is blown to the heating target for heating the same, whereby solder is melted.
    Type: Application
    Filed: March 15, 2002
    Publication date: August 1, 2002
    Applicant: Hitachi, Ltd.
    Inventors: Hideki Mukuno, Kazumi Tashiro, Hideaki Arita, Kiyoshi Kanai, Teruo Okano, Fumihiro Yamashita, Shoichirou Matsuhisa, Hidekazu Imai
  • Soldering machine
    Patent number: 6412681
    Abstract: A soldering machine using lead-free solders is provided which can uniformly heat a printed circuit board and electronic parts to be mounted thereon, and which can solder the electronic parts without thermally damaging them. A porous member having a number of holes formed therein is disposed between a blower fan and a heater for making uniform the pressure of a fluid. A radiation plate is disposed between the heater and a heating target for blowing the fluid having been heated by the heater to the heating target in the form of a turbulent flow. The heated fluid is blown to the heating target for heating the same, whereby solder is melted.
    Type: Grant
    Filed: December 11, 2000
    Date of Patent: July 2, 2002
    Assignees: Hitachi, Ltd., Tamura Fa System Co., Ltd., Hitachi Car Engineering Co., Ltd., Tamura Corporation
    Inventors: Hideki Mukuno, Kazumi Tashiro, Hideaki Arita, Kiyoshi Kanai, Teruo Okano, Fumihiro Yamashita, Shoichirou Matsuhisa, Hidekazu Imai
  • Soldering machine
    Publication number: 20010015368
    Abstract: A soldering machine using lead-free solders is provided which can uniformly heat a printed circuit board and electronic parts to be mounted thereon, and which can solder the electronic parts without thermally damaging them. A porous member having a number of holes formed therein is disposed between a blower fan and a heater for making uniform the pressure of a fluid. A radiation plate is disposed between the heater and a heating target for blowing the fluid having been heated by the heater to the heating target in the form of a turbulent flow. The heated fluid is blown to the heating target for heating the same, whereby solder is melted.
    Type: Application
    Filed: December 11, 2000
    Publication date: August 23, 2001
    Inventors: Hideki Mukuno, Kazumi Tashiro, Hideaki Arita, Kiyoshi Kanai, Teruo Okano, Fumihiro Yamashita, Shoichirou Matsuhisa, Hidekazu Imai