Patents by Inventor Fumihito OTA

Fumihito OTA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device
    Patent number: 10923422
    Abstract: The semiconductor device SD1a includes a first wiring M2 and a second wiring M3. The semiconductor device includes a first conductor pattern DM, a first via V2 in contact with the first wiring M2 and the second wiring M3, and a second via DV1,DV2,DV3,DV4 in contact with the first conductor pattern DM and the second wiring M3. In plan view, the distance between the second via DV1 closest to the corner portion CI of the second wire M3 and the corner portion CI is shorter than the distance between the first via V2 and the corner portion CI, and the distance between the second vias adjacent to each other is shorter than the distance between the second via DV3 closest to the first via V2 and the first via V2.
    Type: Grant
    Filed: June 18, 2019
    Date of Patent: February 16, 2021
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Katsumi Eikyu, Fumihito Ota, Takashi Ipposhi
  • SEMICONDUCTOR DEVICE
    Publication number: 20190393169
    Abstract: The semiconductor device SD1a includes a first wiring M2 and a second wiring M3. The semiconductor device includes a first conductor pattern DM, a first via V2 in contact with the first wiring M2 and the second wiring M3, and a second via DV1, DV2, DV3, DV4 in contact with the first conductor pattern DM and the second wiring M3. In plan view, the distance between the second via DV1 closest to the corner portion CI of the second wire M3 and the corner portion CI is shorter than the distance between the first via V2 and the corner portion CI, and the distance between the second vias adjacent to each other is shorter than the distance between the second via DV3 closest to the first via V2 and the first via V2.
    Type: Application
    Filed: June 18, 2019
    Publication date: December 26, 2019
    Inventors: Katsumi EIKYU, Fumihito OTA, Takashi IPPOSHI