Abstract: The present invention aims to provide a temporary fixing material that is easily separable even after high-temperature processing at 300° C. or higher with an adherend fixed thereon. The present invention also aims to provide a method for producing an electronic component using the temporary fixing material. Provided is a temporary fixing material containing a photocurable adhesive, the photocurable adhesive containing a reactive resin containing a resin (1) having an imide skeleton in a backbone repeating unit, the temporary fixing material having a light transmittance at 405 nm of 10% or greater and a 5% weight loss temperature of 350° C. or higher.

Abstract: The present invention aims to provide a curable resin composition that can reduce the occurrence of voids and partial detachment between the composition and a support even in high-temperature processing at 300° C. or higher with an adherend fixed to the support with the composition, and is easily separable after the high-temperature processing. The present invention also aims to provide a temporary fixing material including an adhesive layer containing the curable resin composition and a method of producing an electronic component using the temporary fixing material. Provided is a curable resin composition containing: a maleimide group-containing reactive compound (1); and a resin (2) having an imide skeleton in a backbone repeating unit.