Patents by Inventor Fumikachi Kurosawa

Fumikachi Kurosawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device and manufacturing same
    Patent number: 7134196
    Abstract: In a method of manufacturing an electronic device, an electronic component and a mount substrate are disposed such that one of surfaces of the electronic component faces toward one of surfaces of the mount substrate, and a connection electrode of the electronic component is electrically connected and mechanically bond to a patterned conductor of the mount substrate. A resin film is then disposed on the electronic component and the mount substrate. A gas captured in between the resin film and the electronic component is sucked through a hole provided in the mount substrate from a side of the mount substrate opposite to the electronic component. The resin film is thereby deformed to closely contact the electronic component and the mount substrate. The resin film is then heated and adhered to the mount substrate.
    Type: Grant
    Filed: March 30, 2004
    Date of Patent: November 14, 2006
    Assignee: TDK Corporation
    Inventors: Bunji Moriya, Seiichi Tajima, Fumikachi Kurosawa, Shinichiro Hayashi
  • Electronic device and manufacturing same
    Publication number: 20040177498
    Abstract: In a method of manufacturing an electronic device, an electronic component and a mount substrate are disposed such that one of surfaces of the electronic component faces toward one of surfaces of the mount substrate, and a connection electrode of the electronic component is electrically connected and mechanically bond to a patterned conductor of the mount substrate. A resin film is then disposed on the electronic component and the mount substrate. A gas captured in between the resin film and the electronic component is sucked through a hole provided in the mount substrate from a side of the mount substrate opposite to the electronic component. The resin film is thereby deformed to closely contact the electronic component and the mount substrate. The resin film is then heated and adhered to the mount substrate.
    Type: Application
    Filed: March 30, 2004
    Publication date: September 16, 2004
    Applicant: TDK CORPORATION
    Inventors: Bunji Moriya, Seiichi Tajima, Fumikachi Kurosawa, Shinichiro Hayashi
  • Electronic device and manufacturing same
    Publication number: 20020097562
    Abstract: In a method of manufacturing an electronic device, an electronic component and a mount substrate are disposed such that one of surfaces of the electronic component faces toward one of surfaces of the mount substrate, and a connection electrode of the electronic component is electrically connected and mechanically bond to a patterned conductor of the mount substrate. A resin film is then disposed on the electronic component and the mount substrate. A gas captured in between the resin film and the electronic component is sucked through a hole provided in the mount substrate from a side of the mount substrate opposite to the electronic component. The resin film is thereby deformed to closely contact the electronic component and the mount substrate. The resin film is then heated and adhered to the mount substrate.
    Type: Application
    Filed: December 11, 2001
    Publication date: July 25, 2002
    Applicant: TDK CORPORATION
    Inventors: Bunji Moriya, Seiichi Tajima, Fumikachi Kurosawa, Shinichiro Hayashi