Patents by Inventor Fumikazu Ito

Fumikazu Ito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050142347
    Abstract: An object is to provide a composite board of plaster and inorganic fiber excellent in fire resistance, provided with sound-absorbing property, which is absent from a plasterboard, and heat insulating property, light in weight, and high in dimensional stability to humidity change. The composite board of plaster and inorganic fiber is provided, which is characterized in that the proportion of the inorganic fiber ranges 20 to 70% by weight with respect to the total weight of the composite board. Since the composite board of the present invention contains inorganic fiber, it becomes a lightweight plasterboard and excellent in sound absorbing property. In addition, since the composite board of the present invention uses plaster, which is excellent in dimensional stability, as a binder, it is excellent in dimensional stability to humidity change compared to a rock wool decorative sound-absorbing board using a large amount of starch as a binder.
    Type: Application
    Filed: March 15, 2002
    Publication date: June 30, 2005
    Inventors: Akira Takahara, Fumikazu Ito, Takumi Fujita, Hidetaka Honda
  • Patent number: 5883437
    Abstract: A method and apparatus for inspecting wirings of an electronic circuit substrate to detect a defect in the wiring and for enabling correction thereof. The inspection method and apparatus include electrostatically coupling at least one electrode to a wiring pattern, applying a time varying voltage between the electrode and wiring pattern at different locations so as to detect a current flow and determine a defect by a variation in the detected current flow at the different locations and a portion of the defect. A defect in the form of a disconnected or half-disconnected point of the wiring may be corrected by supplying a solution of a metal complex to the disconnected or half-disconnected point, heating the solution and end point areas of the disconnected or half-disconnected point by laser light and precipitating a metal thin film establishing a connection of the wiring.
    Type: Grant
    Filed: December 28, 1995
    Date of Patent: March 16, 1999
    Assignee: Hitachi, Ltd.
    Inventors: Shigenobu Maruyama, Mikio Hongo, Satoru Todoroki, Masaaki Okunaka, Hideo Matsuzaki, Takanori Ninomiya, Kazushi Yoshimura, Fumikazu Ito