Patents by Inventor Fumikazu Tagami

Fumikazu Tagami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit substrate and manufacture thereof, ceramic composition for circuit substrate, and electronics computer
    Patent number: 6118671
    Abstract: Ceramic circuit substrate which is sintered at 900 to 1,050.degree. C. and have low relative dielectric constant, thermal expansion coefficient comparable to that of silicon, and high bending strength, and a method of manufacturing are provided by using a glass with a softening point of 850 to 1,100.degree. C., that is, a glass having a composition included in an area in FIG. 1 (triangular composition diagram of SiO.sub.2 --B.sub.2 O.sub.3 --R.sub.2 O, a composition is represented by the position of a small circle, the number in a small circle represents the composition number) defined with lines connecting points representing the first, third, tenth, eleventh, and fourth compositions respectively as raw material.
    Type: Grant
    Filed: June 24, 1998
    Date of Patent: September 12, 2000
    Assignee: Hitachi, Ltd.
    Inventors: Hirayoshi Tanei, Shoichi Iwanaga, Masahide Okamoto, Masato Nakamura, Kousaku Morita, Shousaku Ishihara, Fumikazu Tagami, Norio Sengoku, Tsuyoshi Fujita, Fumiyuki Kobayashi
  • Circuit substrate and electronics computer, using sintered glass ceramics
    Patent number: 5825632
    Abstract: Ceramic circuit substrate which is sintered at 900.degree. to 1,050.degree. C. and have low relative dielectric constant, thermal expansion coefficient comparable to that of silicon, and high bending strength, and a method of manufacturing are provided by using a glass with a softening point of 850.degree. to 1,100.degree. C., that is, a glass having a composition included in an area in FIG. 1 (triangular composition diagram of SiO.sub.2 --B.sub.2 O.sub.3 --R.sub.2 O, a composition is represented by the position of a small circle, the number in a small circle represents the composition number) defined with lines connecting points representing the first, third, tenth, eleventh, and fourth compositions respectively as raw material.
    Type: Grant
    Filed: August 8, 1995
    Date of Patent: October 20, 1998
    Assignee: Hitachi, Ltd.
    Inventors: Hirayoshi Tanei, Shoichi Iwanaga, Masahide Okamoto, Masato Nakamura, Kousaku Morita, Shousaku Ishihara, Fumiyuki Kobayashi, Fumikazu Tagami, Norio Sengoku, Tsuyoshi Fujita