Patents by Inventor Fumikazu Tateishii

Fumikazu Tateishii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayer wiring board embedded with transmission line conductor
    Patent number: 6683260
    Abstract: Transmission line structure is composed of a pair of signal conductors which are embedded in one wiring region of a dielectric layer and a thickness in height of the signal conductor is larger than a width, and is constituted so that a coupling impedance between the adjacent signal conductors is lower than a coupling impedance between the signal conductor and another conductor formed in another wiring region, and thus to provide a multi-layer wiring board having a transmission line structure of high wiring density and excellent transmission characteristic.
    Type: Grant
    Filed: July 3, 2001
    Date of Patent: January 27, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takeshi Shimamoto, Kazufumi Yamaguchi, Masahide Tsukamoto, Fumikazu Tateishii, Yutaka Taguchi
  • Transmission line assembly chip and a manufacturing method thereof in a multi-chip module
    Publication number: 20020041009
    Abstract: In a transmission line assembly chip for connection between semiconductor chips, strap-like metallic films and dielectric films are alternately arranged in parallel in a transverse direction, so that an aspect ratio of each transmission line conductor is larger than 1. The assembly chip is formed by laminating metallic foils and dielectric films and cutting the same into a specified thickness to achieve favorable matching of characteristic impedances of the transmission lines.
    Type: Application
    Filed: July 3, 2001
    Publication date: April 11, 2002
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., Ltd
    Inventors: Kazufumi Yamaguchi, Takeshi Shimamoto, Fumikazu Tateishii, Masahide Tsukamoto, Takeo Ukai
  • Multilayer wiring board embedded with transmission line conductor
    Publication number: 20020017963
    Abstract: Transmission line structure is composed of a pair of signal conductors which are embedded in one wiring region of a dielectric layer and a thickness in height of the signal conductor is larger than a width, and is constituted so that a coupling impedance between the adjacent signal conductors is lower than a coupling impedance between the signal conductor and another conductor formed in another wiring region, and thus to provide a multi-layer wiring board having a transmission line structure of high wiring density and excellent transmission characteristic.
    Type: Application
    Filed: July 3, 2001
    Publication date: February 14, 2002
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., Ltd.
    Inventors: Takeshi Shimamoto, Kazufumi Yamaguchi, Masahide Tsukamoto, Fumikazu Tateishii, Yutaka Taguchi