Abstract: The present invention provides an electronic component sealing lid that suppresses detachment caused by reflow treatment, wherein the sealing lid is formed from a resin composition containing a liquid crystal polymer and an inorganic substance, and satisfies either the following formula (a) or formula (b). (a): T1/T2<0.9, (b): T1/T2>1.

Abstract: The present invention provides an electronic component sealing lid which contains a liquid crystal polymer and suppresses detachment caused by reflow treatment. The electronic component sealing lid (10) according to the present invention includes a substrate that is formed from a liquid crystal polymer and includes a base section (11) and a wall section (12), and an inorganic substance (30) contained in the wall section (12), wherein the exposed area percentage for the inorganic substance (30) at a bonding surface (10a) of the wall section (12) is at least 5%.

Abstract: The present invention provides an optical element, an optical element wafer and a method of manufacturing the same. The optical element comprises a optical film adhered on an substrate of the optical element. The method for manufacturing the optical element wafer comprising the steps of dividing a base material of a optical film into a plurality of optical films, separating the optical film base material by removing sections where no optical film is to be formed, adhering the divided optical films on the substrate base material, and a plurality of optical elements are obtained by dividing the substrate base material with the optical film adhered on one surface of the individual substrate.

Abstract: An adhesive tape for electronic parts which comprises a metal substrate and an adhesive layer A and an adhesive layer B and an adhesive layer C laminated in order wherein said adhesive A comprises a polyimide consisting of 100-20% by mol of the repeating unit represented by the following formula-(1a) and 0-80% by mol of the repeating unit represented by the following formula (1b), said adhesive B comprises a polyimide consisting of 100-40% by mol of the repeating unit represented by the following formula (1a) and 0-60% by mol of the repeating unit represented by the following formula (2), and the adhesive layer A and the adhesive layer B have each a different glass transition temperature: wherein Ar represents a divalent group selected from the specified structures containing aromatic rings, R is an alkylene group having 1 to 10 carbon atoms or —CH2OC6H4—, the methylene group of which attaches to Si, and n means an integer of 1 to 20.

Abstract: This invention provide an adhesive tape for electronic parts having sufficient thermal resistance and reliability. The adhesive tape comprises a metal substrate, an adhesive layer A and an adhesive layer B laminated in order, wherein said adhesive layers A and B are resin layers composed of 100-40% by mol of at least a polyimide comprising the repeating unit represented by the formula (1) and 0-60% by mol of the repeating unit represented by the formula (2), said two adhesive layers having each a different glass transition temperature: wherein X is —SO2— and/or —C(=O)—OCH2CH2O—C(=O)—, Ar is a divalent group containing aromatic rings, and R is an alkylene group having 1 to 10 carbon atoms or —CH2OC6H4—, and n means an integer of 1 to 20.

Abstract: An adhesive tape for electronic parts which comprises a metal substrate and an adhesive layer A and an adhesive layer B laminated in order on at least one side of said metal substrate, wherein said adhesive A comprises a polyimide consisting of 100 -20% by mol of the repeating unit represented by the following formula (1a) and 0-80% by mol of the repeating unit represented by the following formula (1b), said adhesive B comprises a polyimide consisting of 100-40% by mol of the repeating unit represented by the following formula (1a) and 0-60% by mol of the repeating unit represented by the following formula (2), and the adhesive layer A and the adhesive layer B have each a different glass transition temperature: ##STR1## wherein Ar represents a divalent group selected from the specified structures containing aromatic rings, R is an alkylene group having 1 to 10 carbon atoms or --CH.sub.2 OC.sub.6 H.sub.4 --, the methylene group of which attaches to Si, and n means an integer of 1 to 20.