Abstract: A parameter measurement unit measures intrinsic parameters of a plurality of used secondary batteries. A degradation degree calculation unit calculates degradation degrees of the plurality of used secondary batteries from the intrinsic parameter. A target degradation degree determination unit determines a target degradation degree from the degradation degrees of the plurality of used secondary batteries. An aging condition determination unit determines aging conditions of the plurality of used secondary batteries using the degradation degrees of the plurality of used secondary batteries and the target degradation degree. The aging processing unit performs aging processing on the plurality of used secondary batteries under the aging condition for each of the plurality of used secondary batteries.

Abstract: A circuit module equipped with a primary coil of a step-down transformer formed by primary coils of a plurality of transformer elements connected in series with each other and a secondary coil formed by secondary coils of the transformer elements connected in series with each other, includes a printed substrate on which the transformer elements are mounted in a lengthwise direction, a connection terminal coupled to a first end of the primary coil of the step-down transformer and connection terminals coupled to the secondary coil of the step-down transformer, the connection terminals are positioned such that the transformer elements are interposed therebetween. As a result, provided are a transformer module that reduces the effect of a high-voltage portion on a low-voltage portion by securing a distance between the high-voltage portion and the low-voltage portion, and a power reception device and a power transmission device equipped with the transformer module.

Abstract: A circuit module equipped with a primary coil of a step-down transformer formed by primary coils of a plurality of transformer elements connected in series with each other and a secondary coil formed by secondary coils of the transformer elements connected in series with each other, includes a printed substrate on which the transformer elements are mounted in a lengthwise direction, a connection terminal coupled to a first end of the primary coil of the step-down transformer and connection terminals coupled to the secondary coil of the step-down transformer, the connection terminals are positioned such that the transformer elements are interposed therebetween. As a result, provided are a transformer module that reduces the effect of a high-voltage portion on a low-voltage portion by securing a distance between the high-voltage portion and the low-voltage portion, and a power reception device and a power transmission device equipped with the transformer module.

Abstract: A circuit module and a manufacturing method for the same, reduce a possibility that a defect area where an electrically conductive resin is not coated may occur in a shield layer. A mother board is prepared. A plurality of electronic components are mounted on a principal surface of the mother board. An insulator layer is arranged so as to cover the principal surface of the mother board and the electronic components. The insulator layer is cut such that grooves and projections are formed in and on the principal surface of the insulator layer and the insulator layer has a predetermined thickness H. An electrically conductive resin is coated on the principal surface of the insulator layer to form a shield layer. The mother board including the insulator layer and the shield layer both formed thereon is divided to obtain a plurality of circuit modules.

Abstract: A circuit module and a manufacturing method for the same, reduce a possibility that a defect area where an electrically conductive resin is not coated may occur in a shield layer. A mother board is prepared. A plurality of electronic components are mounted on a principal surface of the mother board. An insulator layer is arranged so as to cover the principal surface of the mother board and the electronic components. The insulator layer is cut such that grooves and projections are formed in and on the principal surface of the insulator layer and the insulator layer has a predetermined thickness H. An electrically conductive resin is coated on the principal surface of the insulator layer to form a shield layer. The mother board including the insulator layer and the shield layer both formed thereon is divided to obtain a plurality of circuit modules.

Abstract: A circuit module and a manufacturing method for the same, reduce a possibility that a defect area where an electrically conductive resin is not coated may occur in a shield layer. A mother board is prepared. A plurality of electronic components are mounted on a principal surface of the mother board. An insulator layer is arranged so as to cover the principal surface of the mother board and the electronic components. The insulator layer is cut such that grooves and projections are formed in and on the principal surface of the insulator layer and the insulator layer has a predetermined thickness H. An electrically conductive resin is coated on the principal surface of the insulator layer to form a shield layer. The mother board including the insulator layer and the shield layer both formed thereon is divided to obtain a plurality of circuit modules.

Abstract: A circuit module and a manufacturing method for the same, reduce a possibility that a defect area where an electrically conductive resin is not coated may occur in a shield layer. A mother board is prepared. A plurality of electronic components are mounted on a principal surface of the mother board. An insulator layer is arranged so as to cover the principal surface of the mother board and the electronic components. The insulator layer is cut such that grooves and projections are formed in and on the principal surface of the insulator layer and the insulator layer has a predetermined thickness H. An electrically conductive resin is coated on the principal surface of the insulator layer to form a shield layer. The mother board including the insulator layer and the shield layer both formed thereon is divided to obtain a plurality of circuit modules.