Patents by Inventor Fumiko Arakawa

Fumiko Arakawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing a semiconductor device to provide a plurality of test element groups (TEGs) in a scribe region
    Patent number: 6881597
    Abstract: Disclosed is a technique capable of improving a yield of a semiconductor device by measuring a plurality of TEGs arranged in a scribe region. A first electrode pad connected to each terminal of a TEG is formed as a rectangular, minute, isolated pattern having a side length of about 0.5 ?m or shorter and constituted of an uppermost layer wiring on a semiconductor substrate, and therefore, a great number of TEGs can be laid in a first scribe region. The characteristic evaluation or the failure analysis is performed by contacting a nanoprobe having a tip radius of curvature of 0.05 ?m to 0.8 ?m to the first electrode pad.
    Type: Grant
    Filed: January 22, 2002
    Date of Patent: April 19, 2005
    Assignee: Renesas Technology Corp.
    Inventors: Kyoichiro Asayama, Yasuhiro Mitsui, Fumiko Arakawa, Shiro Kamohara, Yuzuru Ohji
  • Semiconductor device, method of measuring the same, and method of manufacturing the same
    Publication number: 20030006795
    Abstract: Disclosed is a technique capable of improving a yield of a semiconductor device by measuring a plurality of TEGs arranged in a scribe region. A first electrode pad connected to each terminal of a TEG is formed as a rectangular, minute, isolated pattern having a side length of about 0.5 &mgr;m or shorter and constituted of an uppermost layer wiring on a semiconductor substrate, and therefore, a great number of TEGs can be laid in a first scribe region. The characteristic evaluation or the failure analysis is performed by contacting a nanoprobe having a tip radius of curvature of 0.05 &mgr;m to 0.8 &mgr;m to the first electrode pad.
    Type: Application
    Filed: January 22, 2002
    Publication date: January 9, 2003
    Inventors: Kyoichiro Asayama, Yasuhiro Mitsui, Fumiko Arakawa, Shiro Kamohara, Yuzuru Ohji