Patents by Inventor Fumiko Yagi
Fumiko Yagi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8790529Abstract: A gas supply system for supplying a gas into a processing chamber for processing a substrate to be processed includes: a processing gas supply unit; a processing gas supply line; a first and a second branch line; a branch flow control unit; an additional gas supply unit; an additional gas supply line; and a control unit. The control unit performs, before processing the substrate to be processed, a processing gas supply control and an additional gas supply control by using the processing gas supply unit and the additional gas supply unit, respectively, wherein the additional gas supply control includes a control that supplies the additional gas at an initial flow rate greater than a set flow rate and then at the set flow rate after a lapse of a period of time.Type: GrantFiled: January 24, 2011Date of Patent: July 29, 2014Assignee: Tokyo Electron LimitedInventors: Shinichiro Hayasaka, Ken Horiuchi, Fumiko Yagi, Takeshi Yokouchi
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Patent number: 8190281Abstract: A substrate processing apparatus includes a substrate processing unit for performing a process on substrates; a recipe protection unit for prohibiting processing conditions for the process from being changed while the process is being performed on a specific number of substrates; a protection cancellation unit for canceling a prohibition of a change in the process to allow the processing conditions to be changed while the process is being performed on the specific number of substrates; and a modifying unit for modifying the processing conditions. Further, a method for examining substrate processing conditions includes a protection cancellation step of canceling a prohibition of a change in the process to allow the processing conditions to be changed while the process is being performed on the specific number of substrates; and a modifying step of modifying the processing conditions.Type: GrantFiled: March 6, 2007Date of Patent: May 29, 2012Assignee: Tokyo Electron LimitedInventors: Takeshi Yokouchi, Fumiko Yagi
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Publication number: 20110224818Abstract: A substrate processing apparatus includes a setting unit for setting substrate processing conditions for a substrate in a substrate processing unit for performing a process on the substrate; a detection unit for detecting an abnormality of the substrate processing unit while the substrate processing unit performs the process on the substrate under the substrate processing conditions; a stopping unit for stopping the process on the substrate of the substrate processing unit if the abnormality is detected; and a modifying unit for modifying the substrate processing conditions for a substrate on which the process is stopped to be performed by the stopping unit. Further, a method for modifying substrate processing conditions includes the steps of setting processing conditions; detecting an abnormality of the substrate processing unit; stopping the process if the abnormality is detected; and modifying the processing conditions for a substrate on which the process is stopped.Type: ApplicationFiled: May 25, 2011Publication date: September 15, 2011Applicant: TOKYO ELECTRON LIMITEDInventors: Takeshi YOKOUCHI, Fumiko Yagi
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Publication number: 20110190924Abstract: An EC includes a substrate processing execution unit that executes an etching process on a product substrate, a dummy processing execution unit that executes a dummy process on a dummy substrate and a decision-making unit that makes a decision as to whether the dummy process is to be executed based upon a temperature-related condition. The decision-making unit obtains temperature-related information to be used to regulate the atmosphere inside the individual PM processing containers and makes a decision as to whether the temperature status inside each processing container is regulated based upon the obtained temperature information. If it is decided by the decision-making unit that the temperature status in the processing container has been regulated, the substrate processing execution unit executes the etching process on a product substrate without executing the dummy process.Type: ApplicationFiled: December 2, 2010Publication date: August 4, 2011Applicant: TOKYO ELECTRON LIMITEDInventors: Takeshi Yokouchi, Fumiko Yagi
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Publication number: 20110120563Abstract: A gas supply system for supplying a gas into a processing chamber for processing a substrate to be processed includes: a processing gas supply unit; a processing gas supply line; a first and a second branch line; a branch flow control unit; an additional gas supply unit; an additional gas supply line; and a control unit. The control unit performs, before processing the substrate to be processed, a processing gas supply control and an additional gas supply control by using the processing gas supply unit and the additional gas supply unit, respectively, wherein the additional gas supply control includes a control that supplies the additional gas at an initial flow rate greater than a set flow rate and then at the set flow rate after a lapse of a period of time.Type: ApplicationFiled: January 24, 2011Publication date: May 26, 2011Applicant: TOKYO ELECTRON LIMITEDInventors: Shinichiro HAYASAKA, Ken Horiuchi, Fumiko Yagi, Takeshi Yokouchi
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Patent number: 7896967Abstract: A gas supply system for supplying a gas into a processing chamber for processing a substrate to be processed includes: a processing gas supply unit; a processing gas supply line; a first and a second branch line; a branch flow control unit; an additional gas supply unit; an additional gas supply line; and a control unit. The control unit performs, before processing the substrate to be processed, a processing gas supply control and an additional gas supply control by using the processing gas supply unit and the additional gas supply unit, respectively, wherein the additional gas supply control includes a control that supplies the additional gas at an initial flow rate greater than a set flow rate and then at the set flow rate after a lapse of a period of time.Type: GrantFiled: February 5, 2007Date of Patent: March 1, 2011Assignee: Tokyo Electron LimitedInventors: Shinichiro Hayasaka, Ken Horiuchi, Fumiko Yagi, Takeshi Yokouchi
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Patent number: 7535688Abstract: The present invention provides a substrate processing apparatus that executes electrical discharge processing before detaching a substrate held onto an electrostatic chuck of a lower electrode constituting a stage and undergoing a specific type of processing from the electrostatic chuck. Before electrically discharging the substrate, a decision is made as to whether or not the specific type of processing on the substrate has ended normally, and electrical discharge conditions are set based upon regular electrical discharge condition information stored at a regular electrical discharge condition information storage means if the substrate processing is judged to have ended normally, whereas electrical discharge conditions are set based upon non-regular electrical discharge condition information stored at a non-regular electrical discharge condition information storage means if the substrate processing is judged not to have ended normally.Type: GrantFiled: March 13, 2006Date of Patent: May 19, 2009Assignee: Tokyo Electron LimitedInventors: Takeshi Yokouchi, Fumiko Yagi
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Publication number: 20070227658Abstract: An EC 200 includes a substrate processing execution unit 280 that executes an etching process on a product substrate, a dummy processing execution unit 275 that executes a dummy process on a dummy substrate and a decision-making unit 270 that makes a decision as to whether the dummy process is to be executed based upon a temperature-related condition. The decision-making unit 270 obtains temperature-related information to be used to regulate the atmosphere inside the individual PM processing containers and makes a decision as to whether the temperature status inside each processing container is regulated based upon the obtained temperature information. If it is decided by the decision-making unit 270 that the temperature status in the processing container has been regulated, the substrate processing execution unit 280 executes the etching process on a product substrate without executing the dummy process.Type: ApplicationFiled: March 28, 2007Publication date: October 4, 2007Applicant: TOKYO ELECTRON LIMITEDInventors: Takeshi Yokouchi, Fumiko Yagi
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Publication number: 20070212846Abstract: A substrate processing apparatus includes a substrate processing unit for performing a process on substrates; a recipe protection unit for prohibiting processing conditions for the process from being changed while the process is being performed on a specific number of substrates; a protection cancellation unit for canceling a prohibition of a change in the process to allow the processing conditions to be changed while the process is being performed on the specific number of substrates; and a modifying unit for modifying the processing conditions. Further, a method for examining substrate processing conditions includes a protection cancellation step of canceling a prohibition of a change in the process to allow the processing conditions to be changed while the process is being performed on the specific number of substrates; and a modifying step of modifying the processing conditions.Type: ApplicationFiled: March 6, 2007Publication date: September 13, 2007Applicant: TOKYO ELECTRON LIMITEDInventors: Takeshi Yokouchi, Fumiko Yagi
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Publication number: 20070199655Abstract: A substrate processing apparatus includes a setting unit for setting substrate processing conditions for a substrate in a substrate processing unit for performing a process on the substrate; a detection unit for detecting an abnormality of the substrate processing unit while the substrate processing unit performs the process on the substrate under the substrate processing conditions; a stopping unit for stopping the process on the substrate of the substrate processing unit if the abnormality is detected; and a modifying unit for modifying the substrate processing conditions for a substrate on which the process is stopped to be performed by the stopping unit. Further, a method for modifying substrate processing conditions includes the steps of setting processing conditions; detecting an abnormality of the substrate processing unit; stopping the process if the abnormality is detected; and modifying the processing conditions for a substrate on which the process is stopped.Type: ApplicationFiled: February 27, 2007Publication date: August 30, 2007Applicant: TOKYO ELECTRON LIMITEDInventors: Takeshi Yokouchi, Fumiko Yagi
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Publication number: 20070181255Abstract: A gas supply system for supplying a gas into a processing chamber for processing a substrate to be processed includes: a processing gas supply unit; a processing gas supply line; a first and a second branch line; a branch flow control unit; an additional gas supply unit; an additional gas supply line; and a control unit. The control unit performs, before processing the substrate to be processed, a processing gas supply control and an additional gas supply control by using the processing gas supply unit and the additional gas supply unit, respectively, wherein the additional gas supply control includes a control that supplies the additional gas at an initial flow rate greater than a set flow rate and then at the set flow rate after a lapse of a period of time.Type: ApplicationFiled: February 5, 2007Publication date: August 9, 2007Applicant: TOKYO ELECTRON LIMITEDInventors: Shinichiro HAYASAKA, Ken Horiuchi, Fumiko Yagi, Takeshi Yokouchi
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Publication number: 20060215338Abstract: The present invention provides a substrate processing apparatus that executes electrical discharge processing before detaching a substrate held onto an electrostatic chuck of a lower electrode constituting a stage and undergoing a specific type of processing from the electrostatic chuck. Before electrically discharging the substrate, a decision is made as to whether or not the specific type of processing on the substrate has ended normally, and electrical discharge conditions are set based upon regular electrical discharge condition information stored at a regular electrical discharge condition information storage means if the substrate processing is judged to have ended normally, whereas electrical discharge conditions are set based upon non-regular electrical discharge condition information stored at a non-regular electrical discharge condition information storage means if the substrate processing is judged not to have ended normally.Type: ApplicationFiled: March 13, 2006Publication date: September 28, 2006Applicant: TOKTO ELECTRON LIMITEDInventors: Takeshi Yokouchi, Fumiko Yagi