Patents by Inventor Fuminori Moritake

Fuminori Moritake has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6691832
    Abstract: The diaphragm is supported by the frame at the outer edge thereof. The pair of terminal members is mounted on the frame, and a pair of lead wire drawn from the voice coil is fixed to the land portion of the terminal member for electrical continuity. Since the land portion is disposed on the upper side of the frame, fixation of the lead wire can be performed without turning the frame upside down. This simplifies the manufacturing process of the speaker and also prevents a breakage of the lead wire that conventionally happens when the frame is turned upside down. Further, this prevents the operator from touching the lead wire since no part of the lead wire is exposed outside the frame after the fixation.
    Type: Grant
    Filed: May 9, 2002
    Date of Patent: February 17, 2004
    Assignee: Star Micronics Co., Ltd.
    Inventors: Fuminori Moritake, Shigeru Sugiyama, Naohiro Fujinami, Tomoyuki Sato, Yoshio Imahori
  • Patent number: 6674872
    Abstract: A pair of lead wire drawn from a voice coil is fixed to a land portion of a pair of terminal member by thermo-compression bonding. The pair of terminal member is integrally formed with the frame by insert molding. The frame made of synthetic resin has a pair of circular holes on the back side of the land portion to expose the land portion to the back space of the frame. In thermo-compression bonding, a supporting jig is pressed against the back side of the land portion via the circular hole. Thereby, generated heat is immediately transmitted to the supporting jig, preventing melting part of the frame around the land portion. Pressing force of a thermo-compression jig is received by the supporting jig, preventing sinking of the land portion in the frame.
    Type: Grant
    Filed: May 21, 2002
    Date of Patent: January 6, 2004
    Assignee: Star Micronics Co., Ltd.
    Inventors: Naohiro Fujinami, Fuminori Moritake, Tomoyuki Sato
  • Publication number: 20020176596
    Abstract: A pair of lead wire drawn from a voice coil is fixed to a land portion of a pair of terminal member by thermo-compression bonding. The pair of terminal member is integrally formed with the frame by insert molding. The frame made of synthetic resin has a pair of circular holes on the back side of the land portion to expose the land portion to the back space of the frame. In thermo-compression bonding, a supporting jig is pressed against the back side of the land portion via the circular hole. Thereby, generated heat is immediately transmitted to the supporting jig, preventing melting part of the frame around the land portion. Pressing force of a thermo-compression jig is received by the supporting jig, preventing sinking of the land portion in the frame.
    Type: Application
    Filed: May 21, 2002
    Publication date: November 28, 2002
    Applicant: STAR MICRONICS CO., LTD.
    Inventors: Naohiro Fujinami, Fuminori Moritake, Tomoyuki Sato
  • Publication number: 20020175021
    Abstract: The diaphragm is supported by the frame at the outer edge thereof. The pair of terminal members is mounted on the frame, and a pair of lead wire drawn from the voice coil is fixed to the land portion of the terminal member for electrical continuity. Since the land portion is disposed on the upper side of the frame, fixation of the lead wire can be performed without turning the frame upside down. This simplifies the manufacturing process of the speaker and also prevents a breakage of the lead wire that conventionally happens when the frame is turned upside down. Further, this prevents the operator from touching the lead wire since no part of the lead wire is exposed outside the frame after the fixation.
    Type: Application
    Filed: May 9, 2002
    Publication date: November 28, 2002
    Applicant: STAR MICRONICS CO., LTD.
    Inventors: Fuminori Moritake, Shigeru Sugiyama, Naohiro Fujinami, Tomoyuki Sato, Yoshio Imahori