Patents by Inventor Fuminori Tateishi
Fuminori Tateishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8519404Abstract: The present invention provides a display device and a manufacturing method thereof that can simplify manufacturing steps and enhance efficiency in the use of materials, and further, a manufacturing method that can enhance adhesiveness of a pattern. One feature of the invention is that at least one or more patterns needed for manufacturing a display panel, such as a conductive layer forming a wiring or an electrode or a mask for forming a desired pattern is/are formed by a method capable of selectively forming a pattern, thereby manufacturing a display panel.Type: GrantFiled: September 18, 2009Date of Patent: August 27, 2013Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Osamu Nakamura, Gen Fujii, Fuminori Tateishi
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Patent number: 8492172Abstract: A compact sensor with which particles floating in the air can be easily detected. A sensor having a microstructure which detects a detection object by contact is used. A microstructure has an opening to be a detection hole corresponding to the size of a detection object, and a pair of electrodes having a bridge structure are provided thereabove or thereunder so as to partially contact with each other.Type: GrantFiled: October 30, 2009Date of Patent: July 23, 2013Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Mayumi Yamaguchi, Konami Izumi, Fuminori Tateishi
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Publication number: 20120202324Abstract: The present invention provides a manufacturing apparatus of a semiconductor device, having a pattern-forming apparatus using a droplet-discharging method that is suitable for a large substrate in mass production. A plurality of pattern-forming apparatuses using a droplet-discharging method and a plurality of heat-treatment chambers are provided, and each of which is connected to one transfer chamber, which is a multi-chamber system. Discharging and baking are conducted efficiently to improve productivity. A gas is blown in the same direction as the scanning direction (or a scanning direction of a discharging head) on a substrate just after a droplet is landed, by providing a blowing means in the pattern-forming apparatus, and a heater is provided in a gas-flow path for local baking.Type: ApplicationFiled: April 20, 2012Publication date: August 9, 2012Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.Inventors: Fuminori TATEISHI, Hideaki Kuwabara
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Publication number: 20120043594Abstract: It is an object of the present invention to provide a micro-electro-mechanical-device having a microstructure and a semiconductor element over one surface. In particular, it is an object of the present invention to provide a method for simplifying the process of forming the microstructure and the semiconductor element over one surface. A space in which the microstructure is moved, that is, a movable space for the microstructure is formed by procecssing an insulating layer which is formed in a process of forming the semiconductor element. The movable space can be formed by forming the insulating layer having a plurality of openings and making the openings face each other to be overlapped each other.Type: ApplicationFiled: November 2, 2011Publication date: February 23, 2012Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.Inventors: Fuminori TATEISHI, Konami IZUMI, Mayumi YAMAGUCHI
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Patent number: 8093088Abstract: A method of forming a microstructure body and a semiconductor element for controlling the microstructure body over the same substrate to reduce manufacturing cost, for mass-production of micromachines having a microstructure. In manufacturing a micromachine, a sacrifice layer is formed using a mask material for forming a pattern of a film, and removal of the mask in a region for forming a semiconductor element and removal of the sacrifice layer and the mask in a region for forming a microstructure body are performed by the same step. Specifically, a manufacturing method of a micro-electro-mechanical device is provided wherein a sacrifice layer is selectively formed over an insulating substrate, a semiconductor layer is formed to cover the sacrifice layer, a mask is formed over the semiconductor layer, the semiconductor layer is etched using the mask, and the mask and the sacrifice layer are removed by the same step.Type: GrantFiled: September 24, 2010Date of Patent: January 10, 2012Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventor: Fuminori Tateishi
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Patent number: 8058145Abstract: It is an object of the present invention to provide a micro-electro-mechanical-device having a microstructure and a semiconductor element over one surface. In particular, it is an object of the present invention to provide a method for simplifying the process of forming the microstructure and the semiconductor element over one surface. A space in which the microstructure is moved, that is, a movable space for the microstructure is formed by processing an insulating layer which is formed in a process of forming the semiconductor element. The movable space can be formed by forming the insulating layer having a plurality of openings and making the openings face each other to be overlapped each other.Type: GrantFiled: July 23, 2010Date of Patent: November 15, 2011Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Fuminori Tateishi, Konami Izumi, Mayumi Yamaguchi
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Patent number: 7910007Abstract: It is an object of the present invention, in performing cooling treatment of a waste liquid, to provide a mechanism which safely treats the waste liquid by cooling, without increasing cost and without providing large equipment. A treatment method of a waste liquid is proposed, in which a chemical liquid is supplied from a chemical liquid supply portion to a chemical liquid treatment portion; water is supplied from a water supply portion to a water treatment portion; a first waste liquid discharged from the chemical liquid treatment portion is made to flow into an inner pipe through a waste chemical portion, concurrently with making a second waste liquid discharged from the water treatment portion flow through a waste water portion into an outer pipe which is disposed outside the inner pipe; and the second waste liquid has a lower temperature than the first waste liquid.Type: GrantFiled: September 19, 2006Date of Patent: March 22, 2011Assignee: Semiconductor Energy laboratory Co., Ltd.Inventor: Fuminori Tateishi
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Patent number: 7875483Abstract: To provide a method of easily forming a three-dimensional structure typified by a cantilever by using a thin film formed over an insulating surface, and provide a microelectromechanical system formed by such a method. A three-dimensional structure typified by a cantilever is formed by using a mask having a nonuniform thickness. Specifically, a microstructure is manufactured by processing a structural layer formed over a sacrificial layer by using a mask having a nonuniform thickness and then removing the sacrificial layer. The sacrificial layer can be formed by using a silicon layer or a metal layer.Type: GrantFiled: August 3, 2006Date of Patent: January 25, 2011Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Konami Izumi, Mayumi Yamaguchi, Fuminori Tateishi
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Publication number: 20110012111Abstract: A method of forming a microstructure body and a semiconductor element for controlling the microstructure body over the same substrate to reduce manufacturing cost, for mass-production of micromachines having a microstructure. In manufacturing a micromachine, a sacrifice layer is formed using a mask material for forming a pattern of a film, and removal of the mask in a region for forming a semiconductor element and removal of the sacrifice layer and the mask in a region for forming a microstructure body are performed by the same step. Specifically, a manufacturing method of a micro-electro-mechanical device is provided wherein a sacrifice layer is selectively formed over an insulating substrate, a semiconductor layer is formed to cover the sacrifice layer, a mask is formed over the semiconductor layer, the semiconductor layer is etched using the mask, and the mask and the sacrifice layer are removed by the same step.Type: ApplicationFiled: September 24, 2010Publication date: January 20, 2011Applicant: Semiconductor Energy Laboratory Co., Ltd.Inventor: Fuminori TATEISHI
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Publication number: 20110006784Abstract: It is an object to provide a test method of a process, an electric characteristic, and a mechanical characteristic of a structure body in a micromachine without contact. A structure body including a first conductive layer, a second conductive layer provided in parallel to the first conductive layer, and a sacrifice layer or a space provided between the first conductive layer and the second conductive layer is provided; an antenna connected to the structure body is provided; electric power is supplied to the structure body wirelessly through the antenna; and an electromagnetic wave generated from the antenna is detected as a characteristic of the structure body.Type: ApplicationFiled: September 23, 2010Publication date: January 13, 2011Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.Inventors: Mayumi Yamaguchi, Konami Izumi, Fuminori TATEISHI
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Publication number: 20100285209Abstract: An object is to provide a chemical solution application apparatus capable of applying a chemical solution evenly and without irregularity by a spin coating method. A plurality of nozzles are provided for applying a chemical solution to an application object that is fixed over a stage. Each of the nozzles is individually mobile in vertical and horizontal directions. For this reason, controlling a discharging point or pattern is possible, and application responding to a wider viscosity range of chemical solutions is possible. By implementing the present invention, a chemical solution application apparatus equipped with a discharging method of a chemical solution by which a coating film having a small film thickness distribution over an entire substrate and an even thickness can be obtained, as well as for which use efficiency is improved by cutting down on waste of a chemical solution to be discharged.Type: ApplicationFiled: July 23, 2010Publication date: November 11, 2010Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.Inventor: Fuminori TATEISHI
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Publication number: 20100285627Abstract: It is an object of the present invention to provide a micro-electro-mechanical-device having a microstructure and a semiconductor element over one surface. In particular, it is an object of the present invention to provide a method for simplifying the process of forming the microstructure and the semiconductor element over one surface. A space in which the microstructure is moved, that is, a movable space for the microstructure is formed by procecssing an insulating layer which is formed in a process of forming the semiconductor element. The movable space can be formed by forming the insulating layer having a plurality of openings and making the openings face each other to be overlapped each other.Type: ApplicationFiled: July 23, 2010Publication date: November 11, 2010Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.Inventors: Fuminori TATEISHI, Konami Izumi, Mayumi Yamaguchi
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Patent number: 7820470Abstract: A method of forming a microstructure body and a semiconductor element for controlling the microstructure body over the same substrate to reduce manufacturing cost, for mass-production of micromachines having a microstructure. In manufacturing a micromachine, a sacrifice layer is formed using a mask material for forming a pattern of a film, and removal of the mask in a region for forming a semiconductor element and removal of the sacrifice layer and the mask in a region for forming a microstructure body are performed by the same step. Specifically, a manufacturing method of a micro-electro-mechanical device is provided wherein a sacrifice layer is selectively formed over an insulating substrate, a semiconductor layer is formed to cover the sacrifice layer, a mask is formed over the semiconductor layer, the semiconductor layer is etched using the mask, and the mask and the sacrifice layer are removed by the same step.Type: GrantFiled: July 11, 2006Date of Patent: October 26, 2010Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventor: Fuminori Tateishi
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Patent number: 7808253Abstract: It is an object to provide a test method of a process, an electric characteristic, and a mechanical characteristic of a structure body in a micromachine without contact. A structure body including a first conductive layer, a second conductive layer provided in parallel to the first conductive layer, and a sacrifice layer or a space provided between the first conductive layer and the second conductive layer is provided; an antenna connected to the structure body is provided; electric power is supplied to the structure body wirelessly through the antenna; and an electromagnetic wave generated from the antenna is detected as a characteristic of the structure body.Type: GrantFiled: November 30, 2006Date of Patent: October 5, 2010Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Mayumi Yamaguchi, Konami Izumi, Fuminori Tateishi
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Patent number: 7770535Abstract: An object is to provide a chemical solution application apparatus capable of applying a chemical solution evenly and without irregularity by a spin coating method. A plurality of nozzles are provided for applying a chemical solution to an application object that is fixed over a stage. Each of the nozzles is individually mobile in vertical and horizontal directions. For this reason, controlling a discharging point or pattern is possible, and application responding to a wider viscosity range of chemical solutions is possible. By implementing the present invention, a chemical solution application apparatus equipped with a discharging method of a chemical solution by which a coating film having a small film thickness distribution over an entire substrate and an even thickness can be obtained, as well as for which use efficiency is improved by cutting down on waste of a chemical solution to be discharged.Type: GrantFiled: May 25, 2006Date of Patent: August 10, 2010Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventor: Fuminori Tateishi
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Patent number: 7767543Abstract: It is an object of the present invention to provide a micro-electro-mechanical-device having a microstructure and a semiconductor element over one surface. In particular, it is an object of the present invention to provide a method for simplifying the process of forming the microstructure and the semiconductor element over one surface. A space in which the microstructure is moved, that is, a movable space for the microstructure is formed by processing an insulating layer which is formed in a process of forming the semiconductor element. The movable space can be formed by forming the insulating layer having a plurality of openings and making the openings face each other to be overlapped each other.Type: GrantFiled: August 31, 2006Date of Patent: August 3, 2010Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Fuminori Tateishi, Konami Izumi, Mayumi Yamaguchi
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Publication number: 20100141278Abstract: A compact sensor with which particles floating in the air can be easily detected. A sensor having a microstructure which detects a detection object by contact is used. A microstructure has an opening to be a detection hole corresponding to the size of a detection object, and a pair of electrodes having a bridge structure are provided thereabove or thereunder so as to partially contact with each other.Type: ApplicationFiled: October 30, 2009Publication date: June 10, 2010Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.Inventors: Mayumi YAMAGUCHI, Konami IZUMI, Fuminori TATEISHI
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Publication number: 20100006846Abstract: The present invention provides a display device and a manufacturing method thereof that can simplify manufacturing steps and enhance efficiency in the use of materials, and further, a manufacturing method that can enhance adhesiveness of a pattern. One feature of the invention is that at least one or more patterns needed for manufacturing a display panel, such as a conductive layer forming a wiring or an electrode or a mask for forming a desired pattern is/are formed by a method capable of selectively forming a pattern, thereby manufacturing a display panel.Type: ApplicationFiled: September 18, 2009Publication date: January 14, 2010Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.Inventors: Osamu NAKAMURA, Gen FUJII, Fuminori TATEISHI
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Publication number: 20090272321Abstract: The present invention provides a manufacturing apparatus of a semiconductor device, having a pattern-forming apparatus using a droplet-discharging method that is suitable for a large substrate in mass production. A plurality of pattern-forming apparatuses using a droplet-discharging method and a plurality of heat-treatment chambers are provided, and each of which is connected to one transfer chamber, which is a multi-chamber system. Discharging and baking are conducted efficiently to improve productivity. A gas is blown in the same direction as the scanning direction (or a scanning direction of a discharging head) on a substrate just after a droplet is landed, by providing a blowing means in the pattern-forming apparatus, and a heater is provided in a gas-flow path for local baking.Type: ApplicationFiled: July 14, 2009Publication date: November 5, 2009Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.Inventors: Fuminori TATEISHI, Hideaki KUWABARA
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Patent number: 7610794Abstract: A compact sensor with which particles floating in the air can be easily detected. A sensor having a microstructure which detects a detection object by contact is used. A microstructure has an opening to be a detection hole corresponding to the size of a detection object, and a pair of electrodes having a bridge structure are provided thereabove or thereunder so as to partially contact with each other.Type: GrantFiled: August 25, 2006Date of Patent: November 3, 2009Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Mayumi Yamaguchi, Konami Izumi, Fuminori Tateishi