Patents by Inventor Fumio Kakuhata

Fumio Kakuhata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Soldering apparatus
    Patent number: 4568012
    Abstract: A soldering apparatus has a base, and a solder tank and a nozzle arranged in tandem with the base. A partition plate is arranged in the solder tank. The partition plate, a bottom plate disposed at the bottom of the solder tank, and a lower plate covering the bottom of the solder tank define a channel communicating with a portion of the solder tank remote form the nozzle and the interior of the nozzle. A moving magnetic field generating mechanism for exerting a force toward the nozzle to a solder in the channel is arranged in the base to extend along the channel under the partition wall. That portion of the solder tank at the side of the nozzle constitutes a wide portion of the same width as that of the nozzle while the remaining portion of the solder tank constitutes a narrow portion.
    Type: Grant
    Filed: December 23, 1982
    Date of Patent: February 4, 1986
    Assignee: Toshiba Seiki Co., Ltd.
    Inventors: Fumio Kakuhata, Junzo Taguchi