Abstract: The present invention provides a method of bonding an adherend to a substrate which comprises applying a curable composition comprising at least one polymer or resin selected from the group consisting of (A) a reactive silyl group-containing polyoxyalkylene polymer, (B) a reactive silyl group-containing saturated hydrocarbon polymer, (C) a copolymer of which molecular chain is substantially made of one or more alkyl acrylate monomer unit(s) and/or alkyl methacrylate monomer unit(s) and (D) an epoxy resin and having a viscosity before curing of not lower than 10,000 Pa·s as determined on a B8U type viscometer under the following condition; rotor No. 7; number of revolutions 0.5 rpm; in an atmosphere at 23° C., according to JIS K 7117 to the adherend and/or substrate and then joining the adherend and the substrate together without temporary tacking.

Abstract: By using a high viscosity moisture-curable adhesive composition comprising at least one polymer or resin selected from the group consisting of (A) a reactive silyl group-containing polyoxyalkylene polymer, (B) a reactive silyl group-containing saturated hydrocarbon polymer, (C) a copolymer of which molecular chain is substantially made of one or more alkyl (meth)acrylate monomer unit(s) and (D) an epoxy resin, it becomes possible to bond an adherend to a substrate without open time and without temporary tacking after application.

Abstract: The present invention provides a novel sealant and a novel curable resin composition providing for sufficiently high mechanical strength, adhesive strength, rubber elasticity and good workability and a direct glazing method utilizing the composition, which comprises (I) a reactive silicon group-containing polyether oligomer such that the reactive silicon group exists exclusively at the molecular chain terminus and the introduction rate of the reactive silicon group into the molecular chain terminus is not less than 85% as determined by 1H-NMR analysis and (II) a reinforcing filler.

Abstract: The present invention provides a method of bonding an adherend to a substrate

Abstract: The invention provides a curing agent for two-pack type curable composition use having excellent storage stability, and also provides a curing agent composition which comprises a hydrolyzable silyl group-containing compound (a), a non-phthalic acid ester based plasticizer (b) having no phthalic acid ester structure in its molecule, and a bivalent tin based curing catalyst (c), that satisfies all of mechanical properties, recoverability and adhesiveness to substrate, can be mixed easily when used and has excellent storage stability, and a two-pack type curable composition which hardens when a base resin composition comprising a curable organic polymer (d) having in its molecule a functional group crosslinkable by a reaction catalyzed by a bivalent tin based curing catalyst (c), an epoxy group-containing silane compound (f) and an epoxy compound (g) is mixed with the above curing agent composition.

Abstract: By using a curable composition comprising, (A) per 100 parts by weight of an epoxy resin, (B) from 1 to 50 parts by weight of a reactive silicon group-containing polyoxyalkylene polymer, and (C) from 1 to 90 parts by weight of a curing agent for epoxy resins, the working properties of an existing rubber-modified epoxy resin are improved to thereby give stable adhesion properties (for example, improved peel strength) without worsening the shear strength.

Abstract: To provide curable resin compositions capable of exhibiting a low modulus, a high break strength, a high elongation and a satisfactory water-resistant adhesiveness to mortar. One of which includes (a) an organic polymer having at least one reactive silicon group in one molecule, (b) an amino group-substituted silane compound, and (c) an epoxy group-substituted silane compound; and another of which includes (a) an organic polymer having at least one reactive silicon group in one molecule, (b) an amino group-substituted silane compound, (c) an epoxy group-substituted silane compound, and (d) an epoxy resin.

Abstract: A process for producing a reactive silicon group-containing polyether oligomer, which comprises reacting (a) a polyether oligomer the backbone chain of which comprises a polyether and which contains in a side chain or at a terminus of its molecule at least one unsaturated group of the following general formula (1): H2C═C(R1)—R2—O—  (1) (wherein R1 represents a hydrocarbon group of not more than 10 carbon atoms; R2 represents a divalent organic group of 1 to 20 carbon atoms which contains in a side chain or at a terminus of its molecule at least one atomic species selected from the group consisting of hydrogen, oxygen and nitrogen as its constituent atom or atoms) or the general formula (2): HC(R1)═CH—R2—O—  (2) (wherein R1 represents a hydrocarbon group of not more than 10 carbon atoms; R2 represents a divalent organic group of 1 to 20 carbon atoms which contains at least one atomic species selected from the group consisting of hydrogen, ox

Abstract: The present invention has its object to provide a curable composition giving cured products improved in residual tack (reduced in stickiness), with the physical properties insuring those tensile characteristics and rubber elasticity required of sealing compositions for general architectural use being retained. The present invention provides a curable composition which comprises (I) 100 parts by weight of a reactive silicon group-containing polyether oligomer with the percentage of the number of reactive silicon groups to the number of molecular chain terminals as determined by 1H-NMR analysis being not less than 85% and (II) 1 to 500 parts by weight of a plasticizer.

Abstract: A one-pack type curable resin composition having high adhesive strength to various substrates, good storage stability and excellent restoring properties is disclosed. The one-pack type curable resin composition contains an organic polymer (a) having at least one reactive silicon group per molecule, a compound (b) having reactive silicon group in its molecule, a non-phthalate plasticizer (c) having no phthalate structure in its molecule, and a stannous curing catalyst (d).

Abstract: By using a curable composition comprising, (A) per 100 parts by weight of an epoxy resin, (B) from 1 to 50 parts by weight of a reactive silicon group-containing polyoxyalkylene polymer, and (C) from 1 to 90 parts by weight of a curing agent for epoxy resins, the working properties of an existing rubber-modified epoxy resin are improved to thereby give stable adhesion properties (for example, improved peel strength) without worsening the shear strength.

Abstract: A curable polymer composition comprising (a) an oxyalkylene polymer having a silicon-containing group which has a hydroxyl or hydrolyzable group bonded to the silicon atom and can be crosslinked through a silanol condensation reaction, and (b) a paraffinic hydrocarbon, which composition provides a cured material having improved tack which remains on the surface of the cured material.

Abstract: The invention provides a method of producing a reactive silicon group-containing polyether oligomer which comprises reacting (a) a polyether oligomer having main chain of a polyether and, in each molecule, at least one unsaturated group represented by the general formula (1): H2C═C(R1)—R2—O—  (1) (in the formula, R1 is a hydrocarbon group containing not more than 10 carbon atoms and R2 is a divalent organic group containing 1 to 20 carbon atoms and one or more species selected from the group consisting of hydrogen, oxygen and nitrogen atoms as a constituent atom) or the general formula (2): HC(R1)═CH—R2—O—  (2) on a side chain or at a terminus with (b) a reactive silicon group-containing compound in the presence of (c) a group VIII transition metal catalyst to introduce the reactive silicon group into said polyether oligomer (a), wherein the reaction is carried out in the presence of (d) a sulfur compound.

Abstract: A curable polymer composition comprising (a) an oxyalkylene polymer having a silicon-containing group which has a hydroxyl or hydrolyzable group bonded to the silicon atom and can be crosslinked through a silanol condensation reaction, and (b) a paraffinic hydrocarbon, which composition provides a cured material having improved tack which remains on the surface of the cured material.

Abstract: The present invention provides a process for the preparation of a reactive silicon group-containing polymer. A novel process for the preparation of the polymer includes allowing an alkylene oxide to undergo ring opening polymerization with an organopolysiloxane compound having an active hydrogen-containing functional group with which the alkylene oxide is reactive as an initiator in the presence of a catalyst to synthesize a polymer of organopolysiloxane and polyoxyalkylene, and then introducing a reactive silicon group into the polymer.

Abstract: A method applying a curable sealant composition comprising an oxyalkylene polymer having at least one silicon-containing group to the silicon atom of which a hydroxy group and/or a hydrolyzable group are bonded onto previously applied and cured sealant composition comprising an oxyalkylene polymer having at least one silicon-containing group to the silicon atom of which a hydroxy group and/or a hydrolyzable group are bonded, which method comprises applying a primer comprising a copolymer having at least one silicon-containing group to the silicon atom of which a hydroxy group and/or a hydrolyzable group are bonded,said copolymer having a molecular chain comprising substatially(1) a monomer unit of at least one of an alkyl acrylate and an alkyl methacrylate wherein the alkyl group has from 1 to 8 carbon atoms, and(2) a monomer unit of at least one of an alkyl acrylate and an alkyl methA method foracrylate wherein the alkylgroup has not less than 10 carbon atoms, which method afford superior adhesiveness betwee

Abstract: The present invention provides a reactive silicon group-containing polymer containing at least one reactive silicon group per molecule, the main chain of the polymer being essentially a copolymer of organopolysiloxane and polyoxyalkylene, which causes no macro phase separation during storage and gives a hardened material having an excellent weathering resistance, little residual tack and excellent coating adhesivity. The present invention provides a process for the preparation of the foregoing reactive silicon group-containing polymer. A novel process for the preparation of the polymer as defined above is provided, which comprises allowing an alkylene oxide to undergo ring opening polymerization with an organopolysiloxane compound having an active hydrogen-containing functional group with which said alkylene oxide is reactive as an initiator in the presence of a catalyst to synthesize a polymer of organopolysiloxane and polyoxyalkylene, and then introducing a reactive silicon group into said polymer.

Abstract: A curable resin composition comprising (a) an oxyalkylene polymer comprising at least one reactive silicon group per molecule and having a number average molecular weight of not less than 3000 and an Mw/Mn ratio of not higher than 1.6, (b) a curing catalyst for the oxyalkylene polymer containing at least one reactive silicon group per molecule, (c) an epoxy resin, and (d) a ketimine; and a curable resin composition further comprises (e) a reactive silicon group-containing silane compound in addition to (a) to (d).

Abstract: A curable resin composition is disclosed which is composed of (a) an oxyalkylene polymer containing at least one reactive silicon group per molecule and having a number average molecular weight of not less than 3000 and an Mw/Mn ratio of not higher than 1.6, (b) a copolymer having a molecular chain which comprises (A) an alkyl acrylate monomer unit and/or an alkyl methacrylate monomer unit each having 1 to 8 carbon atoms in the alkyl moiety thereof and (B) an alkyl acrylate monomer unit and/or an alkyl methacrylate monomer unit each having 10 or more carbon atoms wherein the total number of monomer units (A) and monomer units (B) constitutes more than 50% of the monomer units in the copolymer (b), and (c) a curing catalyst.

Abstract: A curable composition containing (a) 100 parts by weight of an oxyalkylene polymer having a silicon atom-containing group to which a hydroxyl group or a hydrolyzable group is bonded and capable of crosslinking on formation of a siloxane bond and (b) from 0.01 to 20 parts by weight of a hydrolyzable silicon compound represented by formula (1): ##STR1## wherein X represents a hydrolyzable group; R.sup.1 represents a monovalent hydrocarbon group; R.sup.2 represents a monovalent organic group containing an amino group or an imino group and having a carbon atom number to nitrogen atom number ratio (C/N ratio) of more than 3; m represents 0, 1 or 2; n represents 1, 2 or 3; and (m+n) is less than 4.