Patents by Inventor Fumio Mitajima

Fumio Mitajima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method of manufacturing thereof
    Publication number: 20070176317
    Abstract: A method of manufacturing a semiconductor device sealed with silicone rubber, characterized by 1) placing an unsealed semiconductor device into a mold, 2) thereafter filling in spaces between the mold and the semiconductor device with a sealing silicone rubber composition, and 3) subjecting the composition to compression molding. By the utilization of this method, a sealed semiconductor device is free of voids, and a thickness of a sealing silicone rubber can be controlled.
    Type: Application
    Filed: March 25, 2004
    Publication date: August 2, 2007
    Inventors: Yoshitsugu Morita, Katsutoshi Mine, Fumio Mitajima