Abstract: A bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate to a bonding apparatus, a first holding plate configured to hold the first substrate from an upper surface side, and a second holding plate disposed below the first holding plate and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate. The substrate transfer device includes a first holding part capable of holding the first substrate from the upper surface side, and a second holding part disposed below the first holding part and capable of holding the second substrate from the lower surface side. The first holding part and the second holding part are configured to receive and hold the first substrate and the second substrate at the same time from the first holding plate and the second holding plate.

Abstract: A substrate transfer device for transferring a first substrate and a second substrate to a bonding apparatus configured to bond the first substrate and the second substrate, includes a first holding part configured to hold the first substrate from an upper surface side, a lower surface of the first substrate serving as a bonding surface, and a second holding part provided below the first holding part and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate, a upper surface of the second substrate serving as a bonding surface to be bonded to the lower surface of the first substrate.

Abstract: A bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate to a bonding apparatus, a first holding plate configured to hold the first substrate from an upper surface side, and a second holding plate disposed below the first holding plate and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate. The substrate transfer device includes a first holding part capable of holding the first substrate from the upper surface side, and a second holding part disposed below the first holding part and capable of holding the second substrate from the lower surface side. The first holding part and the second holding part are configured to receive and hold the first substrate and the second substrate at the same time from the first holding plate and the second holding plate.

Abstract: A substrate transfer device for transferring a first substrate and a second substrate to a bonding apparatus configured to bond the first substrate and the second substrate, includes a first holding part configured to hold the first substrate from an upper surface side, a lower surface of the first substrate serving as a bonding surface, and a second holding part provided below the first holding part and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate, a upper surface of the second substrate serving as a bonding surface to be bonded to the lower surface of the first substrate.

Abstract: First to third exciting coils are arranged at a reference position. First to third detecting coils are arranged at a measuring subject position distant from the reference position. Voltages induced in the first to third detecting coils are measured when the first exciting coil is excited. Voltages induced in the first to third detecting coils are measured when the second exciting coil is excited. Voltages induced in the first to third detecting coils are measured when the third exciting coil is excited. An azimuth of the measuring subject position from the reference position based on a predetermined calculation by using all nine induced-voltages which are obtained by the first to third detecting coils.

Abstract: First to third exciting coils are arranged at a reference position. First to third detecting coils are arranged at a measuring subject position distant from the reference position. Voltages induced in the first to third detecting coils are measured when the first exciting coil is excited. Voltages induced in the first to third detecting coils are measured when the second exciting coil is excited. Voltages induced in the first to third detecting coils are measured when the third exciting coil is excited. An azimuth of the measuring subject position from the reference position based on a predetermined calculation by using all nine induced-voltages which are obtained by the first to third detecting coils.

Abstract: In order to carry out dynamic analysis of a phenomenon described by a fourth-order partial differential equation of a function, an analog arithmetic circuit includes a Poisson's circuit (11) and a Laplace's circuit (15). The Poisson's circuit (11) includes a resistor network, additional resistors (R) having one ends connected to nodes of the resistor network, respectively, and subtractor circuits (13) each of which is for subtracting a predetermined voltage from a node voltage at each node to produce an output voltage supplied to the other end of the additional resistor connected to each node. External and boundary voltages are applied to the resistor network. The Laplace's circuit (15) comprises a similar resistor network. Each of the nodes of the Laplace's circuit is connected to the corresponding one of the subtractor circuits to supply the predetermined voltage.

Abstract: In an underground information collecting apparatus which comprises a steel rod with an end to be inserted into the ground and which is for collecting on the ground underground information detected by a sensor mounted in the end, a noise receiving coil is provided to the rod in the vicinity of a main receiving coil which receives a magnetic signal transmitted from a transmitting coil through the rod and which produces a receiving signal. An amplitude and phase adjusting circuit adjusts a noise amplitude and a noise phase included in an induced noise signal obtained in the noise receiving coil to produce an adjusted noise signal having an adjusted noise amplitude and an adjusted noise phase. The adjusted noise amplitude and the adjusted noise phase are adjusted to be coincident with a noise amplitude and a noise phase contained in the receiving signal obtained in the main receiving coil, respectively.

Abstract: A method for detecting a leakage position in an impervious sheet, which comprises disposing a first and a second electrode units on an upper side and a lower side of the impervious sheet, respectively, the first electrode unit intersecting with the second electrode unit; short-circuiting all of electrodes in the first electrode unit; selecting a plurality of electrode sets one set after another set in the second electrode unit, each set comprising three electrodes adjacent to each other; supplying an AC voltage from an AC power source across a central one of each electrode set and the short circuited electrodes of the first electrode unit; measuring a potential difference between the other electrodes in the each electrode set to produce a measured voltage signal; and phase-detecting the measured voltage signal with a signal synchronized with the AC voltage from the AC power source to produce a detected signal, a series of the detected signals produced one after another changing in polarity due to a damage exi