Patents by Inventor Fumio Sanda

Fumio Sanda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7022779
    Abstract: A one-pack moisture-curing epoxy resin composition which can be cured at ordinary temperatures and is improved in storage stability without impairing the quickness of curing, i.e., is excellent in two properties incompatible with each other. This composition includes one ore more members selected from the group consisting of vinyl carboxylates of the general formula (1) and epoxy-containing silyl compounds of the general formula (2), one or more members selected from the group consisting of ketimines and oxazolidines, and an epoxy resin.
    Type: Grant
    Filed: December 17, 2001
    Date of Patent: April 4, 2006
    Assignee: Konishi Co., Ltd.
    Inventors: Takeshi Endo, Fumio Sanda, Hisakazu Horii, Kentaro Suzuki, Nobuki Matsuura
  • Publication number: 20040019140
    Abstract: A one-pack moisture-curable epoxy resin composition which includes: a carbonyl compound represented by the chemical formula (1) consisting of a carbonyl group and bonded thereto two C2-6 alkyl groups which are the same or different; a ketimine compound represented by the chemical formula (2) synthesized from an amine compound having at least one primary amino group per molecule; and an epoxy resin. The composition combines excellent curability with satisfactory storage stability.
    Type: Application
    Filed: April 4, 2003
    Publication date: January 29, 2004
    Inventors: Takeshi Endo, Fumio Sanda, Kentaro Suzuki, Hisakazu Horii, Nobuki Matsuura
  • Publication number: 20040019161
    Abstract: A one-pack moisture-curing epoxy resin composition which can be cured at ordinary temperatures and is improved in storage stability without impairing the quickness of curing, i.e., is excellent in two properties incompatible with each other. This composition includes one ore more members selected from the group consisting of vinyl carboxylates of the general formula (1) and epoxy-containing silyl compounds of the general formula (2), one or more members selected from the group consisting of ketimines and oxazolidines, and an epoxy resin.
    Type: Application
    Filed: April 4, 2003
    Publication date: January 29, 2004
    Inventors: Takeshi Endo, Fumio Sanda, Hisakazu Horii, Kentaro Suzuki, Nobuki Matsuura
  • Patent number: 5298631
    Abstract: An asymmetric spiroorthocarbonate compound having one exomethylene group and represented by the following general formula (1) ##STR1## wherein A represents a group selected from the group consisting of: ##STR2## wherein R.sup.1, R.sup.2, R.sup.3 and R.sup.4 each represents a hydrogen atom, a lower alkyl group having not more than 8 carbon atoms, an alkoxy group, a halogen group, a nitro group, a cyano group, an amino group, an amide group, a hydroxyl group or an alkyl ester group having not more than 20 carbon atoms; and R.sup.5, R.sup.6, R.sup.7 and R.sup.8, R.sup.9 through R.sup.14, R.sup.15 through R.sup.22, R.sup.23 through R.sup.28 and R.sup.29 through R.sup.36 each represents a hydrogen atom or a lower alkyl group having not more than 8 carbon atoms; and copolymers containing units therefrom.
    Type: Grant
    Filed: March 12, 1992
    Date of Patent: March 29, 1994
    Assignee: Kuraray Co., Ltd.
    Inventors: Fumio Sanda, Junichi Yamauchi, Toshikazu Takata, Takeshi Endo
  • Patent number: 5122561
    Abstract: Disposable moldings comprising a polymer (A) having a repeating structure unit in the main chain represented by the formula (I) ##STR1## wherein R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5 and R.sup.6 are respectively a hydrogen atom or a lower alkyl, and a polymer composition comprising the polymer (A). The moldings of the present invention disintegrate themselves due to decomposition of the polymer (A) in atmosphere, soil or water and do not cause any environmental pollution.
    Type: Grant
    Filed: December 21, 1990
    Date of Patent: June 16, 1992
    Assignee: Kuraray Co., Ltd.
    Inventors: Mitsuo Matsumoto, Fumio Sanda, Shigeru Sasaki, Masaki Okazaki