Abstract: A semiconductor module includes a first recessed portion and a second recessed portion formed in an insulating plate at positions close to a first long side and a second long side opposite to the first long side, and a first protruding portion and a second protruding portion formed on a case at bottom surfaces of a first side wall and a second side wall opposite to the first side wall. The first protruding portion and the second protruding portion are engaged with the first recessed portion and the second recessed portion with bonding adhesive in between. Thereby, a joined area between the insulating plate and the containment unit (case) increases. Accordingly, joining force between the insulating plate and the containment unit (case) increases to prevent generation of a gap between the insulating plate and the containment unit (case).

Abstract: A control terminal 14 of a semiconductor device has a recessed portion 14c. A resin case 15 is provided with a fixing member 152 engaging with and fixing a recessed portion 14c of a control terminal 14. The fixing member 152 is constituted by a resin block portion 154 having a step portion engaging with the recessed portion 14c, a nut-housing portion 153, and a beam portion 155 integrated by linking the resin block portion 154 and the nut-housing portion 153. A resin case main body 151 to which the fixing member 152 is fixed is provided with a hollow portion enabling insertion of the resin block portion 154. The nut-housing portion 153 of the fixing member 152 and the resin block portion 154 are attached to the resin case main body 151 from one direction.

Abstract: A control terminal 14 of a semiconductor device has a recessed portion 14c. A resin case 15 is provided with a fixing member 152 engaging with and fixing a recessed portion 14c of a control terminal 14. The fixing member 152 is constituted by a resin block portion 154 having a step portion engaging with the recessed portion 14c, a nut-housing portion 153, and a beam portion 155 integrated by linking the resin block portion 154 and the nut-housing portion 153. A resin case main body 151 to which the fixing member 152 is fixed is provided with a hollow portion enabling insertion of the resin block portion 154. The nut-housing portion 153 of the fixing member 152 and the resin block portion 154 are attached to the resin case main body 151 from one direction.

Abstract: An ultrasonic welding tool is used to bond end portions of an external connection terminal to circuit patterns of an insulating substrate, with a Vickers hardness not lower than 90. Bonding end portions are provided integrally with a bar in the external connection terminal. A bonding end portion located substantially in the lengthwise center of the bar is bonded first, then others are bonded alternately in order toward either end. Hardness of the bonding end portions is increased so that strength of the ultrasonic welding portions is increased, and displacement of the bonding end portion in either end from its regular position is suppressed to keep bonding strength high. Bonding strength of the ultrasonic welding portions between the external connection terminal and the circuit patterns of the insulating substrate can be increased so that long-term reliability can be secured in a semiconductor device.

Abstract: A semiconductor device, and method of manufacturing the device, having a p type diffusion layer; a V-groove including a bottom surface parallel to the rear surface and exposing the p type diffusion layer and a tapered side surface rising from the bottom surface; a p type semiconductor layer on the rear surface surrounded by the tapered side surface of the V-groove; and a p type isolation layer formed on the side surface and electrically connecting the p type diffusion layer on the front surface and the p type semiconductor layer on the rear surface. The V-groove has a chamfered configuration around the intersection between a corner part of the side surface and the bottom surface of the V-groove. An object is to prevent performance degradation due to stress concentration at the corner part of a recessed part caused by thermal history in soldering.

Abstract: An ultrasonic welding tool is used to bond end portions of an external connection terminal to circuit patterns of an insulating substrate, with a Vickers hardness not lower than 90. Bonding end portions are provided integrally with a bar in the external connection terminal. A bonding end portion located substantially in the lengthwise center of the bar is bonded first, then others are bonded alternately in order toward either end. Hardness of the bonding end portions is increased so that strength of the ultrasonic welding portions is increased, and displacement of the bonding end portion in either end from its regular position is suppressed to keep bonding strength high. Bonding strength of the ultrasonic welding portions between the external connection terminal and the circuit patterns of the insulating substrate can be increased so that long-term reliability can be secured in a semiconductor device.

Abstract: Hardness of bonding end portions of an external connection terminal to be bonded to circuit patterns of an insulating substrate which is not lower than 90 in Vickers hardness is disclosed. An ultrasonic welding tool is used. In the external connection terminal in which the bonding end portions are provided integrally with a bar, one of the bonding end portion located substantially in the lengthwise center of the bar is first bonded, and the other bonding end portions are bonded alternately in order toward either end. The hardness of the bonding end portions is increased so that strength of the ultrasonic welding portions is increased.

Abstract: A semiconductor device, and method of manufacturing the device, having a p type diffusion layer; a V-groove including a bottom surface parallel to the rear surface and exposing the p type diffusion layer and a tapered side surface rising from the bottom surface; a p type semiconductor layer on the rear surface surrounded by the tapered side surface of the V-groove; and a p type isolation layer formed on the side surface and electrically connecting the p type diffusion layer on the front surface and the p type semiconductor layer on the rear surface. The V-groove has a chamfered configuration around the intersection between a corner part of the side surface and the bottom surface of the V-groove. An object is to prevent performance degradation due to stress concentration at the corner part of a recessed part caused by thermal history in soldering.

Abstract: Hardness of bonding end portions of an external connection terminal to be bonded to circuit patterns of an insulating substrate which is not lower than 90 in Vickers hardness is disclosed. An ultrasonic welding tool is used. In the external connection terminal in which the bonding end portions are provided integrally with a bar, one of the bonding end portion located substantially in the lengthwise center of the bar is first bonded, and the other bonding end portions are bonded alternately in order toward either end. The hardness of the bonding end portions is increased so that strength of the ultrasonic welding portions is increased.

Abstract: Method for producing colored anodic oxide films on aluminum-based alloy materials comprising steps of subjecting the material having an oxide film thereon to a coloring electrolytic treatment in a bath of electrolyte containing water soluble nickel salt and boric acid. The material is applied with alternating voltage pulses having negative pulse duration which is the same as or greater than duration of positive voltage pulse.

Abstract: A method of forming an oxide film on the surface of an aluminum material by anodizing the aluminum material in an aqueous solution containing 0.5 to 10% by weight of oxalic acid and 0.05 to 1.0% by weight of sulfuric acid, in which either an electrolyzing voltage or the temperature of the aqueous solution is controlled in the range of 5 to 150V or 0.degree. to 40.degree. C, whereby the oxide film is colored in color tone from bronze to silver.

Abstract: Surface treating apparatus comprising treating bath means; a carrier bar having devices for vertically suspending workpieces; lifting means provided at the sides of the bath means for vertically conveying the carrier bar and dipping said workpieces into and out of said bath means, the lifting means also including means for conveying the carrier bar in a substantially horizontal direction; loading means rotatable between a horizontal and a vertical position and adapted to removably receive the carrier bar having workpieces attached in the horizontal position for loading the carrier bar onto the lifting means in the vertical position; unloading means rotatable between a horizontal and a vertical position and adapted to receive the carrier bar supporting finished workpieces in the vertical position, the workpieces being released from the carrier bar when the unloading means is in a horizontal position; and returning conveyor means between the loading and unloading means so that the carrier bar moves from the loa