Abstract: A surplus ball removing apparatus including a substrate stage, a substrate including a connection pad, a mask with opening to supply conductive ball onto the substrate, a surplus ball adhering head for removing surplus ball mounted on the substrate, adhering head moving system, an image processing portion, an adhesive material stage, and a ball recovering stage.

Abstract: A conductive ball mounting method of the present invention, includes a step of, arranging a mask in which an opening portion is provided, on a substrate including a connection pad, arranging a conductive ball on the connection pad through the opening portion of the mask by supplying the conductive ball onto the mask, separating the substrate and the mask, in the step, an extra conductive ball left on the mask drops through the opening portion of the mask, thereby a surplus ball is mounted on the substrate, and removing the surplus ball on the substrate by making the surplus ball adhere onto an adhering head.