Patents by Inventor Fumio Tabata

Fumio Tabata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070253317
    Abstract: A mark is formed on a resist disk according to set values of indexes representing magnitudes of causes that affect deterioration in a quality of a playback signal at the time of signal playback. A ROM media is manufactured using the resist disk.
    Type: Application
    Filed: January 31, 2007
    Publication date: November 1, 2007
    Inventors: Tetsuo Hosokawa, Takeshi Mitsutani, Fumio Tabata, Katsunori Miyata
  • Patent number: 5534740
    Abstract: An electrostatic actuator incorporates a sensor for detecting both position and the state of distribution of charges and is efficiently driven in high-speed operation. A first member has a plurality of driving electrodes thereon, each having the shape of a strip, a second member is placed in contact with the first member, and a control means is provided for changing the voltages applied to the driving electrodes to produce relative movement of the first member and the second member. Detecting electrodes are arranged on the first member at predetermined phases, independently of the driving electrodes, and a detecting unit detects the position of the second member and the state of charges induced on the second member, through the detection of electric signals induced in the detecting electrodes by the charges distributed on the second member.
    Type: Grant
    Filed: January 27, 1993
    Date of Patent: July 9, 1996
    Assignees: Fujitsu Limited, Toshiro Higuchi
    Inventors: Toshiro Higuchi, Saku Egawa, Toshiki Niino, Katsuhide Natori, Fumio Tabata
  • Patent number: 5355755
    Abstract: It is an object of the present invention to provide a circuit board trimming apparatus and method used, in which apparatus and method a wiring pattern on a printed circuit board is trimmed, and to provide a circuit board trimming apparatus and method, in which apparatus and method a wiring pattern is trimmed efficiently while damage to the circuit board is minimized.A force exerted by a cutter against the circuit board is measured when the wiring pattern is cut by pressing an ultrasonic cutter against the wiring pattern on the circuit board and by moving the circuit board and the cutter relative to each other, a shape of the wiring pattern being determined on the basis of the force thus measured and a cutting process being controlled in accordance with the shape of the wiring pattern.
    Type: Grant
    Filed: June 3, 1993
    Date of Patent: October 18, 1994
    Assignee: Fujitsu Limited
    Inventors: Yuji Sakata, Hidenori Sekiguchi, Fumio Tabata
  • Patent number: 5207554
    Abstract: A supporting device comprising a first member which supports a springy means for resiliently supporting a second member. The supporting device comprises a detection means for detecting displacement of the springy means with respect to the first member in accordance with the movement of the second member and a biasing means which applies a force to the springy means from the same direction as or from a direction opposite to that of the displacement for changing the elasticity of the springy means in accordance with the movement of the second member.
    Type: Grant
    Filed: July 3, 1990
    Date of Patent: May 4, 1993
    Assignee: Fujitsu Limited
    Inventors: Kazuo Asakawa, Fumiaki Akiya, Fumio Tabata
  • Patent number: 4979195
    Abstract: A vertical stepper transfers a circuit pattern formed on a mask onto a wafer using synchrotron radiation instead of a light source. The vertical stepper includes a wafer stage for having the wafer mounted thereon in the vertical direction and a mask stage for having the mask mounted thereon in the vertical direction. The wafer stage includes a coarse X-Y stage, a transfer member, and a wafer mounting member. The wafer mounting member is provided with a fine X-Y stage. The wafer mounting member is moved in the horizontal direction between a first position mounted on the coarse X-Y stage and a second position mounted on the mask stage by the transfer member. When exposed to the synchrotron radiation, the wafer mounting member is integrated with the mask stage. After the wafer and the mask are strictly correctly positioned by the fine X-Y stage, the wafer mounting member, integrated with the mask stage, is stepped and repeat exposed by scanning in the vertical direction.
    Type: Grant
    Filed: September 20, 1989
    Date of Patent: December 18, 1990
    Assignee: Fujitsu Limited
    Inventors: Fumio Tabata, Hidenori Sekiguchi, Toru Kamada, Yuji Sakata
  • Patent number: 4921396
    Abstract: A supporting device including a first member which supports a springy means for resiliently supporting a second member. The supporting device includes a detection for detecting displacements of the springy with respect to the first member in accordance with the movement of the second member and a biasing which applies a force to the springy from the same direction as or from a direction opposite to that of the displacement for changing the elasticity of the springy in accordance with the movement of the second member.
    Type: Grant
    Filed: February 16, 1988
    Date of Patent: May 1, 1990
    Assignee: Fujitsu Limited
    Inventors: Kazuo Asakawa, Fumiaki Akiya, Fumio Tabata
  • Patent number: 4488242
    Abstract: A method for controlling the locus of an arm of an arm type robot or the like, wherein a control system which drives a first arm of a two-joint arm under open-loop control and a second arm under feedback control is provided. A bang-bang drive system is used for positioning the first arm in a minimum time. The position of the tip of the second arm can be detected either from the rotational angle of each arm or by means of a position recognizing device. Furthermore, an arm positioning method for rapidly bringing the tip of a multi-joint arm to a desired position while detecting the positions of its tip and its joints by simple calculations is disclosed.
    Type: Grant
    Filed: December 21, 1981
    Date of Patent: December 11, 1984
    Assignee: Fujitsu Limited
    Inventors: Fumio Tabata, Kazuo Asakawa, Hitoshi Komoriya