Patents by Inventor Fumitaka Takagi
Fumitaka Takagi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9480156Abstract: A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching resist, etching to reduce thickness of the plated-metal film exposed from the etching resist, removing the resists, and forming a wiring having a pad and a conductive circuit thinner than the pad by removing the metal film exposed through the removing of the plating resist, a solder-resist layer on the surface of the board and wiring, in the layer an opening exposing the pad and a portion of the circuit contiguous to the pad, a solder film on the pad and portion of the circuit exposed through the opening, and a solder bump on the pad by solder reflow.Type: GrantFiled: February 28, 2012Date of Patent: October 25, 2016Assignee: IBIDEN CO., LTD.Inventors: Toru Furuta, Kotaro Takagi, Michio Ido, Fumitaka Takagi
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Patent number: 9185806Abstract: A printed wiring board includes an interlayer resin insulation layer, a pad structure formed on the interlayer resin insulation layer and positioned to mount a semiconductor device, and a solder-resist layer formed on the interlayer resin insulation layer and having an opening portion exposing a portion of the pad structure from the solder-resist layer. The opening portion of the solder-resist layer has a bottom surface such that the bottom surface of the opening portion is exposing an upper surface and a portion of a side surface of the pad structure.Type: GrantFiled: September 30, 2013Date of Patent: November 10, 2015Assignee: IBIDEN CO., LTD.Inventors: Fumitaka Takagi, Nobuhisa Kuroda, Mariko Kimura
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Patent number: 8927875Abstract: A wiring board includes an interlayer insulation layer, conductive patterns formed on the interlayer insulation layer, and a solder-resist layer formed on the interlayer insulation layer and having an opening partially exposing the conductive patterns. The solder-resist layer has an edge portion bordering the opening and intersecting the conductive patterns, and the edge portion of the solder-resist layer has a concavo-convex shape having convex portions and concave portions such that the convex portions and the concave portions are alternately intersecting the conductive patterns.Type: GrantFiled: July 31, 2012Date of Patent: January 6, 2015Assignee: IBIDEN Co., Ltd.Inventors: Toru Furuta, Fumitaka Takagi
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Publication number: 20140090877Abstract: A printed wiring board includes an interlayer resin insulation layer, a pad structure formed on the interlayer resin insulation layer and positioned to mount a semiconductor device, and a solder-resist layer formed on the interlayer resin insulation layer and having an opening portion exposing a portion of the pad structure from the solder-resist layer. The opening portion of the solder-resist layer has a bottom surface such that the bottom surface of the opening portion is exposing an upper surface and a portion of a side surface of the pad structure.Type: ApplicationFiled: September 30, 2013Publication date: April 3, 2014Applicant: IBIDEN CO., LTD.Inventors: Fumitaka TAKAGI, Nobuhisa Kuroda, Mariko Kimura
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Patent number: 8592691Abstract: A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching resist, etching to reduce thickness of the plated-metal film exposed from the etching resist, removing the etching and plating resists, and forming a wiring having a pad for wire-bonding an electrode of an electronic component and a conductive circuit thinner than the pad by removing the metal film exposed after the plating resist is removed, a solder-resist layer on the surface of the board and wiring, an opening in the layer exposing the pad and a portion of the circuit contiguous to the pad, and a metal coating on the pad and portion of the circuit exposed through the opening.Type: GrantFiled: January 12, 2010Date of Patent: November 26, 2013Assignee: Ibiden Co., Ltd.Inventors: Toru Furuta, Kotaro Takagi, Michio Ido, Akihiro Miyata, Fumitaka Takagi
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Publication number: 20130192877Abstract: A wiring board includes an interlayer insulation layer, conductive patterns formed on the interlayer insulation layer, and a solder-resist layer formed on the interlayer insulation layer and having an opening partially exposing the conductive patterns. The solder-resist layer has an edge portion bordering the opening and intersecting the conductive patterns, and the edge portion of the solder-resist layer has a concavo-convex shape having convex portions and concave portions such that the convex portions and the concave portions are alternately intersecting the conductive patterns.Type: ApplicationFiled: July 31, 2012Publication date: August 1, 2013Applicant: IBIDEN CO., LTD.Inventors: Toru FURUTA, Fumitaka TAKAGI
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Patent number: 8410374Abstract: A printed wiring board has an insulative board having a first surface and a second surface on the opposite side of the first surface, a wiring formed on the first surface of the insulative board and having a pad and a conductive circuit contiguous to the pad, and a metal film formed on the pad. The pad is provided to mount an electronic component having a gold bump. The pad has a thickness which is greater than a thickness of the conductive circuit.Type: GrantFiled: October 20, 2009Date of Patent: April 2, 2013Assignee: Ibiden Co., Ltd.Inventors: Toru Furuta, Kotaro Takagi, Michio Ido, Fumitaka Takagi
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Publication number: 20120151764Abstract: A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching resist, etching to reduce thickness of the plated-metal film exposed from the etching resist, removing the resists, and forming a wiring having a pad and a conductive circuit thinner than the pad by removing the metal film exposed through the removing of the plating resist, a solder-resist layer on the surface of the board and wiring, in the layer an opening exposing the pad and a portion of the circuit contiguous to the pad, a solder film on the pad and portion of the circuit exposed through the opening, and a solder bump on the pad by solder reflow.Type: ApplicationFiled: February 28, 2012Publication date: June 21, 2012Applicant: IBIDEN CO., LTD.Inventors: Toru FURUTA, Kotaro Takagi, Michio Ido, Fumitaka Takagi
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Publication number: 20120103931Abstract: A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching resist, etching to reduce thickness of the plated-metal film exposed from the etching resist, removing the etching and plating resists, and forming a wiring having a pad for wire-bonding an electrode of an electronic component and a conductive circuit thinner than the pad by removing the metal film exposed after the plating resist is removed, a solder-resist layer on the surface of the board and wiring, an opening in the layer exposing the pad and a portion of the circuit contiguous to the pad, and a metal coating on the pad and portion of the circuit exposed through the opening.Type: ApplicationFiled: January 10, 2012Publication date: May 3, 2012Applicant: IBIDEN CO., LTD.Inventors: Toru Furuta, Kotaro Takagi, Michio Ido, Akihiro Miyata, Fumitaka Takagi
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Patent number: 8153905Abstract: A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching resist, etching to reduce thickness of the plated-metal film exposed from the etching resist, removing the resists, and forming a wiring having a pad and a conductive circuit thinner than the pad by removing the metal film exposed through the removing of the plating resist, a solder-resist layer on the surface of the board and wiring, in the layer an opening exposing the pad and a portion of the circuit contiguous to the pad, a solder film on the pad and portion of the circuit exposed through the opening, and a solder bump on the pad by solder reflow.Type: GrantFiled: January 12, 2010Date of Patent: April 10, 2012Assignee: Ibiden Co., Ltd.Inventors: Toru Furuta, Kotaro Takagi, Michio Ido, Fumitaka Takagi
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Publication number: 20100218986Abstract: A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching resist, etching to reduce thickness of the plated-metal film exposed from the etching resist, removing the resists, and forming a wiring having a pad and a conductive circuit thinner than the pad by removing the metal film exposed through the removing of the plating resist, a solder-resist layer on the surface of the board and wiring, in the layer an opening exposing the pad and a portion of the circuit contiguous to the pad, a solder film on the pad and portion of the circuit exposed through the opening, and a solder bump on the pad by solder reflow.Type: ApplicationFiled: January 12, 2010Publication date: September 2, 2010Applicant: IBIDEN CO., LTDInventors: Toru Furuta, Kotaro Takagi, Michio Ido, Fumitaka Takagi
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Publication number: 20100218980Abstract: A printed wiring board has an insulative board having a first surface and a second surface on the opposite side of the first surface, a wiring formed on the first surface of the insulative board and having a pad and a conductive circuit contiguous to the pad, and a metal film formed on the pad. The pad is provided to mount an electronic component having a gold bump. The pad has a thickness which is greater than a thickness of the conductive circuit.Type: ApplicationFiled: October 20, 2009Publication date: September 2, 2010Applicant: IBIDEN CO., LTD.Inventors: Toru Furuta, Kotaro Takagi, Michio Ido, Fumitaka Takagi
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Publication number: 20100221414Abstract: A method for manufacturing a printed wiring board includes preparing insulative board having first and second surfaces, forming metal film on the first surface, plating resist on the metal film and plated-metal film on the metal film exposed by the plating resist, covering portion of the plated-metal film with etching resist, etching to reduce thickness of the plated-metal film exposed by the etching resist, removing the etching and plating resists, by removing the metal film exposed after removing the plating resist, forming wiring comprising pad for electronic component having gold bump and conductive circuit which is thinner than the pad, forming solder-resist layer on the first surface and the wiring, and forming opening in the solder-resist layer to expose the pad and portion of the conductive circuit contiguous to the pad and metal coating on the pad and portion of the conductive circuit, which are exposed through the opening.Type: ApplicationFiled: June 25, 2009Publication date: September 2, 2010Applicant: IBIDEN CO., LTDInventors: Toru Furuta, Kotaro Takagi, Michio Ido, Fumitaka Takagi
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Publication number: 20100218983Abstract: A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching resist, etching to reduce thickness of the plated-metal film exposed from the etching resist, removing the etching and plating resists, and forming a wiring having a pad for wire-bonding an electrode of an electronic component and a conductive circuit thinner than the pad by removing the metal film exposed after the plating resist is removed, a solder-resist layer on the surface of the board and wiring, an opening in the layer exposing the pad and a portion of the circuit contiguous to the pad, and a metal coating on the pad and portion of the circuit exposed through the opening.Type: ApplicationFiled: January 12, 2010Publication date: September 2, 2010Applicant: IBIDEN CO., LTD.Inventors: Toru Furuta, Kotaro Takagi, Michio Ido, Akihiro Miyata, Fumitaka Takagi