Patents by Inventor Fumitaka Tametani
Fumitaka Tametani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11114836Abstract: The present invention relates to a semiconductor device and it is an object of the present invention to provide a semiconductor device that makes it easy to change a specification on driving of a power semiconductor element or control of a protection operation thereof. The semiconductor device includes a power semiconductor element, a main electrode terminal of the power semiconductor element, a sensor section that emits a signal corresponding to a physical state of the power semiconductor element, a sensor signal terminal connected to the sensor section, a drive terminal that supplies power to drive the power semiconductor element and a case that accommodates the power semiconductor element, the main electrode terminal, the sensor section, the sensor signal terminal and the drive terminal, and the sensor signal terminal and the drive terminal are provided so as to be connectable from outside the case.Type: GrantFiled: April 8, 2016Date of Patent: September 7, 2021Assignee: Mitsubishi Electric CorporationInventors: Rei Yoneyama, Fumitaka Tametani, Manabu Matsumoto, Haruhiko Takemoto, Hiroshi Yoshida, Motonobu Joko
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Patent number: 10338128Abstract: A life estimation circuit includes a temperature detector configured to detect temperature of a power element unit, an inflection point detection unit configured to detect an inflection point of temperature variation in the power element unit based on an output signal from the temperature detector, an operation unit configured to determine an absolute value of a difference between the temperature of the power element unit at an inflection point detected this time and the temperature of the power element unit at an inflection point detected last time, a count circuit configured to count the number of times that the absolute value of the difference in temperature has reached a threshold temperature, and a signal generation unit configured to output, when a count value from the count circuit reaches a threshold number of times, an alarm signal indicating that the power element is about to reach the end of its life.Type: GrantFiled: June 13, 2016Date of Patent: July 2, 2019Assignee: Mitsubishi Electric CorporationInventors: Shiori Uota, Fumitaka Tametani, Takahiro Inoue, Rei Yoneyama
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Patent number: 10199340Abstract: A signal transmission insulating device includes: a first coil; a second coil opposing the first coil to form a transformer together with the first coil; a first insulating film provided between the opposing first coil and second coil and made of a first dielectric material; a second insulating film surrounding the first coil and made of a second dielectric material having a lower resistivity or a higher permittivity than the first dielectric material; and a third insulating film surrounding the second coil and made of a third dielectric material having a lower resistivity or a higher permittivity than the first dielectric material.Type: GrantFiled: August 19, 2015Date of Patent: February 5, 2019Assignee: Mitsubishi Electric CorporationInventors: Kenichi Suga, Takao Tsurimoto, Hiroki Shiota, Kenichi Morokuma, Shoichi Orita, Fumitaka Tametani, Takahiro Inoue, Shiori Uota
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Publication number: 20170278811Abstract: A signal transmission insulating device includes: a first coil; a second coil opposing the first coil to form a transformer together with the first coil; a first insulating film provided between the opposing first coil and second coil and made of a first dielectric material; a second insulating film surrounding the first coil and made of a second dielectric material having a lower resistivity or a higher permittivity than the first dielectric material; and a third insulating film surrounding the second coil and made of a third dielectric material having a lower resistivity or a higher permittivity than the first dielectric material.Type: ApplicationFiled: August 19, 2015Publication date: September 28, 2017Applicant: Mitsubishi Electric CorporationInventors: Kenichi SUGA, Takao TSURIMOTO, Hiroki SHIOTA, Kenichi MOROKUMA, Shoichi ORITA, Fumitaka TAMETANI, Takahiro INOUE, Shiori UOTA
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Publication number: 20170074921Abstract: A life estimation circuit includes a temperature detector configured to detect temperature of a power element unit, an inflection point detection unit configured to detect an inflection point of temperature variation in the power element unit based on an output signal from the temperature detector, an operation unit configured to determine an absolute value of a difference between the temperature of the power element unit at an inflection point detected this time and the temperature of the power element unit at an inflection point detected last time, a count circuit configured to count the number of times that the absolute value of the difference in temperature has reached a threshold temperature, and a signal generation unit configured to output, when a count value from the count circuit reaches a threshold number of times, an alarm signal indicating that the power element is about to reach the end of its life.Type: ApplicationFiled: June 13, 2016Publication date: March 16, 2017Applicant: Mitsubishi Electric CorporationInventors: Shiori UOTA, Fumitaka TAMETANI, Takahiro INOUE, Rei YONEYAMA
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Publication number: 20170063071Abstract: The present invention relates to a semiconductor device and it is an object of the present invention to provide a semiconductor device that makes it easy to change a specification on driving of a power semiconductor element or control of a protection operation thereof. The semiconductor device includes a power semiconductor element, a main electrode terminal of the power semiconductor element, a sensor section that emits a signal corresponding to a physical state of the power semiconductor element, a sensor signal terminal connected to the sensor section, a drive terminal that supplies power to drive the power semiconductor element and a case that accommodates the power semiconductor element, the main electrode terminal, the sensor section, the sensor signal terminal and the drive terminal, and the sensor signal terminal and the drive terminal are provided so as to be connectable from outside the case.Type: ApplicationFiled: April 8, 2016Publication date: March 2, 2017Applicant: Mitsubishi Electric CorporationInventors: Rei YONEYAMA, Fumitaka TAMETANI, Manabu MATSUMOTO, Haruhiko TAKEMOTO, Hiroshi YOSHIDA, Motonobu JOKO
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Patent number: 8004304Abstract: A life prediction wire 14 is connected to an emitter-wire bonding pad 2 of a semiconductor device 1. Wire deterioration is detected by checking whether or not an electric current flows from the life prediction wire 14 to the emitter-wire bonding pad 2. Thus, by directly checking a deterioration state of the semiconductor device, the life of the semiconductor device is predicted.Type: GrantFiled: October 6, 2006Date of Patent: August 23, 2011Assignee: Mitsubishi Electric CorporationInventors: Fumitaka Tametani, Takashi Igarashi
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Publication number: 20070296040Abstract: A life prediction wire 14 is connected to an emitter-wire bonding pad 2 of a semiconductor device 1. Wire deterioration is detected by checking whether or not an electric current flows from the life prediction wire 14 to the emitter-wire bonding pad 2. Thus, by directly checking a deterioration state of the semiconductor device, the life of the semiconductor device is predicted.Type: ApplicationFiled: October 6, 2006Publication date: December 27, 2007Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Fumitaka Tametani, Takashi Igarashi
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Patent number: 7102294Abstract: A display panel for displaying an image, a drive circuit for driving the display panel and a rear plate for supporting the display panel are provided. The drive circuit includes a circuit board fixed on the rear plate, semiconductor devices surface-mounted on the circuit board to be connected to a plurality of electrodes formed on the display panel and radiator plates attached to the other surfaces of the semiconductor devices opposite to the surfaces mounted on the circuit board so as to be almost in parallel with the rear plate.Type: GrantFiled: October 15, 2004Date of Patent: September 5, 2006Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Teruaki Nagahara, Fumitaka Tametani
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Publication number: 20050242748Abstract: A display panel for displaying an image, a drive circuit for driving the display panel and a rear plate for supporting the display panel are provided. The drive circuit includes a circuit board fixed on the rear plate, semiconductor devices surface-mounted on the circuit board to be connected to a plurality of electrodes formed on the display panel and radiator plates attached to the other surfaces of the semiconductor devices opposite to the surfaces mounted on the circuit board so as to be almost in parallel with the rear plate.Type: ApplicationFiled: October 15, 2004Publication date: November 3, 2005Applicant: Mitsubishi Denki Kabushiki KaishaInventors: Teruaki Nagahara, Fumitaka Tametani
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Patent number: 6529062Abstract: A power module is provided with an insulating substrate with a heat sink being bonded to one surface thereof and a circuit pattern being formed on the other surface. The circuit pattern is formed by an electrode layer. A switching semiconductor element and a free wheeling diode that is connected to a switching semiconductor element in anti-parallel therewith are placed on the circuit pattern. A controlling IC for controlling the switching semiconductor element is placed on the free wheeling diode. Thus, it is possible to make the entire power module compact, and it becomes possible to provide an inexpensive power module which can prevent the controlling IC from malfunctioning due to heat generated by the switching semiconductor element.Type: GrantFiled: January 23, 2001Date of Patent: March 4, 2003Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Gourab Majumdar, Mitsutaka Iwasaki, Shinji Hatae, Fumitaka Tametani, Toru Iwagami, Akihisa Yamamoto
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Publication number: 20020030532Abstract: A power module is provided with an insulating substrate with a heat sink being bonded to one surface thereof and a circuit pattern being formed on the other surface. The circuit pattern is formed by an electrode layer. A switching semiconductor element and a free wheeling diode that is connected to a switching semiconductor element in anti-parallel therewith are placed on the circuit pattern. A controlling IC for controlling the switching semiconductor element is placed on the free wheeling diode. Thus, it is possible to make the entire power module compact, and it becomes possible to provide an inexpensive power module which can prevent the controlling IC from malfunctioning due to heat generated by the switching semiconductor element.Type: ApplicationFiled: January 23, 2001Publication date: March 14, 2002Applicant: MITSUBISHI DENKI KABUSHIKI KAISHAInventors: Gourab Majumdar, Mitsutaka Iwasaki, Shinji Hatae, Fumitaka Tametani, Toru Iwagami, Akihisa Yamamoto
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Patent number: 6351399Abstract: To prevent malfunction or breakdown due to a surge voltage in a power converter for converting DC into AC or the like so as to supply electric power to a load, not only a control signal is transmitted via a level shift circuit which is provided correspondingly to each of switching semiconductor elements forming a main circuit and shifts a level of a reference potential at its output side so as to follow variations of a reference potential of the switching semiconductor element to the switching semiconductor element, but a DC control power source for supplying electric power to the level shift circuit and a negative pole of the switching semiconductor element are connected to each other through at least one of an inductor and a resistance.Type: GrantFiled: February 28, 2001Date of Patent: February 26, 2002Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Ken Takanashi, Shinji Hatae, Kazuaki Hiyama, Khalid Hassan Hussein, Fumitaka Tametani
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Publication number: 20010028572Abstract: To prevent malfunction or breakdown due to a surge voltage in a power converter for converting DC into AC or the like so as to supply electric power to a load, not only a control signal is transmitted via a level shift circuit which is provided correspondingly to each of switching semiconductor elements forming a main circuit and shifts a level of a reference potential at its output side so as to follow variations of a reference potential of the switching semiconductor element to the switching semiconductor element, but a DC control power source for supplying electric power to the level shift circuit and a negative pole of the switching semiconductor element are connected to each other through at least one of an inductor and a resistance.Type: ApplicationFiled: February 28, 2001Publication date: October 11, 2001Applicant: MITSUBISHI DENKI KABUSHIKI KAISHAInventors: Ken Takanashi, Shinji Hatae, Kazuaki Hiyama, Khalid Hassan Hussein, Fumitaka Tametani
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Patent number: 5444297Abstract: In a circuit board having four-layered conductive pattern on which a control circuit is arranged, wiring sub-patterns 133a in the first layer are divided into four areas A1-A3 and A8, for respective sets of circuit parts having same power potentials. Respective sub-patterns belonging to the areas A1-A3 are partially or fully surrounded by wiring sub-patterns PEa1 PEa3 connected to negative power potentials of circuit parts belonging to respective areas, respectively. Similarly, at least part of a wiring patten Pa2 for transmitting an input signal to a semiconductor active element is surrounded by a wiring pattern PEa4. Penetration of electric noises to the wiring patterns for the control circuit, in particular to the wiring pattern for transmitting the input signal to semiconductor element, is decreased to thereby prevent misoperation due to electric noises.Type: GrantFiled: June 11, 1993Date of Patent: August 22, 1995Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Seiichi Oshima, Fumitaka Tametani, Jun Yamagata, Ken Takanashi