Patents by Inventor Fumitaka UENO

Fumitaka UENO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11903316
    Abstract: A thermoelectric module includesa plurality of electrodes (high temperature side electrodes and low temperature side electrodes, thermoelectric conversion elements (p-type element and n-type element) arranged between the two electrodes, and a bonding layer disposed between the electrodes and the thermoelectric conversion elements. The bonding layer includes copper-containing particles, copper balls each having a particle diameter of 30 ?m or more, an intermetallic compound of copper and tin, and a fired resin.
    Type: Grant
    Filed: October 4, 2019
    Date of Patent: February 13, 2024
    Assignee: KELK Ltd.
    Inventors: Toshihiko Kishizawa, Shinichi Fujimoto, Manabu Ishii, Hideaki Yamagishi, Fumitaka Ueno
  • Publication number: 20210351333
    Abstract: A thermoelectric module 1 includes: a plurality of electrodes (high temperature side electrodes 11 and low temperature side electrodes 12); thermoelectric conversion elements (p-type element 21 and n-type element 22) arranged between the two electrodes; and a bonding layer 30 disposed between the electrodes and the thermoelectric conversion elements. The bonding layer 30 contains copper-containing particles, copper balls each having a particle diameter of 30 ?m or more, an intermetallic compound of copper and tin, and a fired resin.
    Type: Application
    Filed: October 4, 2019
    Publication date: November 11, 2021
    Inventors: Toshihiko KISHIZAWA, Shinichi FUJIMOTO, Manabu ISHII, Hideaki YAMAGISHI, Fumitaka UENO
  • Publication number: 20200071488
    Abstract: A composition includes metal particles capable of transient liquid phase sintering and a thermoplastic resin having a thermal decomposition rate of 2.0% by mass or less, the thermal decomposition rate being measured under a nitrogen stream using a thermogravimetric measurement device.
    Type: Application
    Filed: December 9, 2016
    Publication date: March 5, 2020
    Inventors: Masaki TAKEUCHI, Fumitaka UENO, Yoshitsugu MATSUURA, Katsuhiko YASU
  • Publication number: 20200071569
    Abstract: A method of producing a joined body includes: providing a composition for transient liquid phase sintering to at least one of a portion of a first member to which a second member is to be joined and a portion of the second member to which the first member is to be joined, so as to form a composition layer; bringing the portion of the first member to which the second member is to be joined and the portion of the second member to which the first member is to be joined into contact with each other via the composition layer; and sintering the composition layer by heating, and the composition for transient liquid phase sintering includes metal particles capable of transient liquid phase sintering and a thermoplastic resin.
    Type: Application
    Filed: December 8, 2017
    Publication date: March 5, 2020
    Inventors: Masaki TAKEUCHI, Fumitaka UENO, Yoshitsugu MATSUURA, Shinji AMANUMA
  • Publication number: 20200063008
    Abstract: A composition includes metal particles capable of transient liquid phase sintering and a polyamide imide resin.
    Type: Application
    Filed: December 9, 2016
    Publication date: February 27, 2020
    Inventors: Masaki TAKEUCHI, Fumitaka UENO, Yoshitsugu MATSUURA, Hideaki YAMAGISHI, Yoko SAKAIRI
  • Publication number: 20190300651
    Abstract: A composition includes metal particles capable of transient liquid phase sintering and a thermoplastic resin having a softening point that is lower than the liquid phase transition temperature of the metal particles.
    Type: Application
    Filed: December 8, 2017
    Publication date: October 3, 2019
    Inventors: Masaki TAKEUCHI, Fumitaka UENO, Yoshitsugu MATSUURA, Shinji AMANUMA
  • Publication number: 20190084093
    Abstract: A bonding material disclosed in this specification contains high melting point metal particles, low melting point metal particles, and a thermosetting flux resin. A mass proportion of the high melting point metal particles with respect to a total mass of the high melting point metal particles and the low melting point metal particles is 55% to 75%.
    Type: Application
    Filed: September 11, 2018
    Publication date: March 21, 2019
    Applicants: TOYOTA JIDOSHA KABUSHIKI KAISHA, Hitachi Chemical Company, Ltd.
    Inventors: Masahiro SAKATA, Masaki YAMAGUCHI, Koichi SAITOU, Masaki TAKEUCHI, Fumitaka UENO, Katsuhiko YASU