Abstract: A pump device (10) includes: a drive unit (30); a cover body (150); a circuit board (130) which faces the cover body (150) and the drive unit (30) in an electrically non-contact state therewith; and a spring member (160) disposed across front and rear sides of the circuit board (130) and in contact with the cover body (150) and the drive unit (30) in an electrically conductive state. The drive unit (30), the spring member (160) and the cover body (150) constitute a static elimination path. The spring member (160) comprises: a spring deformation part (163) which enables spring deformation such that neighboring wires (161) can move toward or away from each other; and an electrically conductive bypass path (162) which is continuously disposed with at least one end of the spring deformation part (163) and is positioned across the front and rear sides of the circuit board (130).

Abstract: A pump device (10) includes: a drive unit (30); a cover body (150); a circuit board (130) which faces the cover body (150) and the drive unit (30) in an electrically non-contact state therewith; and a spring member (160) disposed across front and rear sides of the circuit board (130) and in contact with the cover body (150) and the drive unit (30) in an electrically conductive state. The drive unit (30), the spring member (160), and the cover body (150) constitute a static elimination path. The spring member (160) comprises: a spring deformation part (163) which enables spring deformation such that neighboring wires (161) can move toward or away from each other, and an electrically conductive bypass path (162) which is continuously disposed with at least one end of the spring deformation part (163) and is positioned across the front and rear sides of the circuit board (130).