Patents by Inventor Fumitoshi Ikegaya
Fumitoshi Ikegaya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10738389Abstract: A semiconductor manufacturing apparatus according to an embodiment comprises a container contains a mixed solution that includes a processing solution for plating processing of a substrate and an additive and being capable of draining a part of the mixed solution when a first condition is satisfied. A first supplier supplies the processing solution to the container. A second supplier supplies the additive to the container when the first condition is satisfied and drainage of a part of the mixed solution is finished.Type: GrantFiled: September 8, 2015Date of Patent: August 11, 2020Assignee: Toshiba Memory CorporationInventors: Takashi Izumi, Fumitoshi Ikegaya
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Patent number: 10483126Abstract: A semiconductor manufacturing apparatus according to the present embodiment has a mount unit capable of mounting a substrate. A first supplier supplies a chemical solution onto the substrate. A first protection plate is provided along an outer circumference of the substrate, to receive the chemical solution splashing from the substrate. A second supplier is provided above the first protection plate, to supply a cleaning solution to an inner surface of the first protection plate.Type: GrantFiled: September 7, 2017Date of Patent: November 19, 2019Assignee: TOSHIBA MEMORY CORPORATIONInventors: Takashi Izumi, Fumitoshi Ikegaya
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Publication number: 20180226268Abstract: A semiconductor manufacturing apparatus according to the present embodiment has a mount unit capable of mounting a substrate. A first supplier supplies a chemical solution onto the substrate. A first protection plate is provided along an outer circumference of the substrate, to receive the chemical solution splashing from the substrate. A second supplier is provided above the first protection plate, to supply a cleaning solution to an inner surface of the first protection plate.Type: ApplicationFiled: September 7, 2017Publication date: August 9, 2018Applicant: TOSHIBA MEMORY CORPORATIONInventors: Takashi Izumi, Fumitoshi Ikegaya
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Publication number: 20160362793Abstract: A semiconductor manufacturing apparatus according to an embodiment comprises a container contains a mixed solution that includes a processing solution for plating processing of a substrate and an additive and being capable of draining a part of the mixed solution when a first condition is satisfied. A first supplier supplies the processing solution to the container. A second supplier supplies the additive to the container when the first condition is satisfied and drainage of a part of the mixed solution is finished.Type: ApplicationFiled: September 8, 2015Publication date: December 15, 2016Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Takashi IZUMI, Fumitoshi IKEGAYA
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Publication number: 20150068911Abstract: A copper plating apparatus according to an embodiment includes a plating tank configured to have a copper member and a plating member being disposed in an interior of the plating tank, a blocking film configured to partition the interior of the plating tank into an anode chamber where the copper member is to be disposed and a cathode chamber where the plating member is to be disposed, the blocking film being configured to transmit copper ions and not transmit an additive agent, a supply unit configured to supply the additive agent to the anode chamber, and a power supply configured to apply a voltage between the copper member and the plating member.Type: ApplicationFiled: December 6, 2013Publication date: March 12, 2015Applicant: Kabushiki Kaisha ToshibaInventors: Fumitoshi IKEGAYA, Toshiyuki MORITA
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Patent number: 7526859Abstract: The apparatus for manufacturing a wiring substitute comprises a transporter having a circuit where a sheet is circulated; a screen printer for printing a conductive paste on the sheet; a counter for counting the number of times to print the conductive paste on the sheet; and a distributor for ejecting the sheet from the circuit when the counted number reaches a preset number. Thus, the conductive pillars having uniform properties can be formed automatically on the conductive foil with high productivity.Type: GrantFiled: October 13, 2006Date of Patent: May 5, 2009Assignee: Dai Nippon Printing Co., Ltd.Inventors: Kenji Sasaoka, Fumitoshi Ikegaya, Takahiro Mori, Tomohisa Motomura, Yoshizumi Sato, Koichiro Shibayama
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Publication number: 20070044294Abstract: The apparatus for manufacturing a wiring substitute comprises a transporter having a circuit where a sheet is circulated; a screen printer for printing a conductive paste on the sheet; a counter for counting the number of times to print the conductive paste on the sheet; and a distributor for ejecting the sheet from the circuit when the counted number reaches a preset number. Thus, the conductive pillars having uniform properties can be formed automatically on the conductive foil with high productivity.Type: ApplicationFiled: October 13, 2006Publication date: March 1, 2007Applicant: Dai Nippon Printing Co., Ltd.Inventors: Kenji Sasaoka, Fumitoshi Ikegaya, Takahiro Mori, Tomohisa Motomura, Yoshizumi Sato, Koichiro Shibayama
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Patent number: 7134193Abstract: The apparatus for manufacturing a wiring substitute comprises a transporter having a circuit where a sheet is circulated; a screen printer for printing a conductive paste on the sheet; a counter for counting the number of times to print the conductive paste on the sheet; and a distributor for ejecting the sheet from the circuit when the counted number reaches a preset number. Thus, the conductive pillars having uniform properties can be formed automatically on the conductive foil with high productivity.Type: GrantFiled: December 29, 2004Date of Patent: November 14, 2006Assignee: Dai Nippon Printing Co., Ltd.Inventors: Kenji Sasaoka, Fumitoshi Ikegaya, Takahiro Mori, Tomohisa Motomura, Yoshizumi Sato, Koichiro Shibayama
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Publication number: 20050272258Abstract: According to one aspect of the present invention, provided is a method of manufacturing a semiconductor device, including: forming a first metal film on a substrate having a recessed portion in a surface thereof, by a plating method so as to bury the first metal film in at least part of the recessed portion; forming a second metal film on the first metal film by a film deposition method different from the plating method, the second metal film including, as a main component, a metal that is a main component of the first metal film and containing an impurity whose concentration is lower than concentration of an impurity contained in the first metal film; heat-treating the first and second metal films; and removing the first and second metal films except portions buried in the recessed portion.Type: ApplicationFiled: June 3, 2005Publication date: December 8, 2005Inventors: Toshiyuki Morita, Hiroshi Toyoda, Yoshitaka Matsui, Fumitoshi Ikegaya, Atsuko Sakata, Tomio Katata, Seiichi Omoto
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Publication number: 20050115068Abstract: The apparatus for manufacturing a wiring substitute comprises a transporter having a circuit where a sheet is circulated; a screen printer for printing a conductive paste on the sheet; a counter for counting the number of times to print the conductive paste on the sheet; and a distributor for ejecting the sheet from the circuit when the counted number reaches a preset number. Thus, the conductive pillars having uniform properties can be formed automatically on the conductive foil with high productivity.Type: ApplicationFiled: December 29, 2004Publication date: June 2, 2005Applicant: Kabushiki Kaisha ToshibaInventors: Kenji Sasaoka, Fumitoshi Ikegaya, Takahiro Mori, Tomohisa Motomura, Yoshizumi Sato, Koichiro Shibayama
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Patent number: 6865801Abstract: The apparatus for manufacturing a wiring substitute comprises a transporter having a circuit where a sheet is circulated; a screen printer for printing a conductive paste on the sheet; a counter for counting the number of times to print the conductive paste on the sheet; and a distributor for ejecting the sheet from the circuit when the counted number reaches a preset number. Thus, the conductive pillars having uniform properties can be formed automatically on the conductive foil with high productivity.Type: GrantFiled: July 5, 2001Date of Patent: March 15, 2005Assignee: Kabushiki Kaisha ToshibaInventors: Kenji Sasaoka, Fumitoshi Ikegaya, Takahiro Mori, Tomohisa Motomura, Yoshizumi Sato, Koichiro Shibayama
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Patent number: 6507995Abstract: The apparatus for manufacturing a wiring substitute comprises a transporter having a circuit where a sheet is circulated; a screen printer for printing a conductive paste on the sheet; a counter for counting the number of times to print the conductive paste on the sheet; and a distributor for ejecting the sheet from the circuit when the counted number reaches a preset number. Thus, the conductive pillars having uniform properties can be formed automatically on the conductive foil with high productivity.Type: GrantFiled: June 9, 1998Date of Patent: January 21, 2003Assignee: Kabushiki Kaisha ToshibaInventors: Kenji Sasaoka, Fumitoshi Ikegaya, Takahiro Mori, Tomohisa Motomura, Yoshizumi Sato, Koichiro Shibayama
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Publication number: 20010039720Abstract: The apparatus for manufacturing a wiring substitute comprises a transporter having a circuit where a sheet is circulated; a screen printer for printing a conductive paste on the sheet; a counter for counting the number of times to print the conductive paste on the sheet; and a distributor for ejecting the sheet from the circuit when the counted number reaches a preset number. Thus, the conductive pillars having uniform properties can be formed automatically on the conductive foil with high productivity.Type: ApplicationFiled: July 5, 2001Publication date: November 15, 2001Applicant: Kabushiki Kaisha ToshibaInventors: Kenji Sasaoka, Fumitoshi Ikegaya, Takahiro Mori, Tomohisa Motomura, Yoshizumi Sato, Koichiro Shibayama
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Patent number: 6010769Abstract: A multilayered wiring board using conductive pillars for the interconnection of wiring layers. Since through holes are bored in the via lands of the wiring layers of the multilayered wiring board, the stress applied between the conductive pillars and wiring layers can be released at the time of connecting the conductive pillars to the via lands. Since the external side face of each conductive pillar smoothly continues to the surface of the via land at the contact section between the conductive pillar and the via land, the notch effect is relieved. Therefore, the reliability of the interconnection is secured even when a stress is applied to the connections during the manufacturing of the multilayered wiring board, and the mounting of electronic elements, etc.Type: GrantFiled: July 16, 1997Date of Patent: January 4, 2000Assignee: Kabushiki Kaisha ToshibaInventors: Kenji Sasaoka, Hiroshi Odaira, Madoka Fujiwara, Fumitoshi Ikegaya, Takahiro Mori
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Patent number: 5822850Abstract: A supporting member or first synthetic resin sheet with conductive bumps disposed at predetermined positions are superposed on a second synthetic resin sheet under the condition that the resin component of the second synthetic resin sheet is plastic deformed or the temperature thereof exceeds a glass transition temperature so that the conductive bumps are pierced into the second synthetic resin sheet. In other words, the conductive bumps are pierced vertically into the second synthetic resin sheet so as to form through-type conducive lead portions exposed to the first (supporting substrate) and second synthetic resin sheets. The through-type conductive lead portions are used to electrically connect electric devices and circuit and to connect wiring pattern layers. The conductive bumps can be precisely and densely formed and disposed by printing method or plating method. The conductive bumps can be pushed and pierced into the second synthetic resin sheet.Type: GrantFiled: December 22, 1995Date of Patent: October 20, 1998Assignee: Kabushiki Kaisha ToshibaInventors: Hiroshi Odaira, Eiji Imamura, Yusuke Wada, Yasushi Arai, Kenji Sasaoka, Takahiro Mori, Fumitoshi Ikegaya, Sadao Kowatari
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Patent number: 5600103Abstract: A supporting member or first synthetic resin sheet with conductive bumps disposed at predetermined positions are superposed on a second synthetic resin sheet under the condition that the resin component of the second synthetic resin sheet is plastic deformed or the temperature thereof exceeds a glass transition temperature so that the conductive bumps are pierced into the second synthetic resin sheet. In other words, the conductive bumps are pierced vertically into the second synthetic resin sheet so as to form through-type conducive lead portions exposed to the first (supporting substrate) and second synthetic resin sheets. The through-type conductive lead portions are used to electrically connect electric devices and circuit and to connect wiring pattern layers. The conductive bumps can be precisely and densely formed and disposed by printing method or plating method. The conductive bumps can be pushed and pierced into the second synthetic resin sheet.Type: GrantFiled: March 2, 1994Date of Patent: February 4, 1997Assignee: Kabushiki Kaisha ToshibaInventors: Hiroshi Odaira, Eiji Imamura, Yusuke Wada, Yasushi Arai, Kenji Sasaoka, Takahiro Mori, Fumitoshi Ikegaya, Sadao Kowatari