Patents by Inventor Fumitoshi Ikejiri
Fumitoshi Ikejiri has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 5763517Abstract: The thermoplastic resin composition of the present invention comprises (A) polyamide having a melting point of not lower than 280.degree. C., particularly preferably (A-1) specific polyamide having a melting point of higher than 300.degree. C., (B) a specific modified polymer, (C) a hindered phenol type antioxidant having a molecular weight of not less than 500 and a TGA 10% weight loss temperature of not lower than 300.degree. C., and (D) a sulfur type antioxidant having a molecular weight of not less than 600 and a TGA 10% weight loss temperature of not lower than 280.degree. C. The molded product of the present invention is made of the above-mentioned thermoplastic resin composition. The thermoplastic resin composition of the invention is excellent in heat stability.Type: GrantFiled: September 26, 1996Date of Patent: June 9, 1998Assignee: Mitsui Petrochemical Industries, Ltd.Inventors: Sanehiro Yamamoto, Kazuto Sugiyama, Akinori Toyota, Yoshikatsu Amimoto, Fumitoshi Ikejiri
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Patent number: 5424104Abstract: Disclosed is a thermoplastic resin composition comprising(A) an aromatic polyamide comprisingdicarboxylic acid units comprising 50-100 mol % of units derived from terephthalic acid, and 0-50 mol % of units derived from an aromatic dicarboxylic acid other than terephthalic acid and/or an aliphatic-dicarboxylic acid having 4-20 carbon atoms, anddiamine units derived from an aliphatic diamine and/or an alicyclic diamine,said aromatic polyamide having an intrinsic viscosity of 0.5-3.0 dl/g as measured in conc. sulfuric acid at 30.degree. C. and a melting point of higher than 300.degree. C.,(B) a graft modified .alpha.-olefin polymer, and/or a graft modified aromatic vinyl hydrocarbon/conjugated diene copolymer or hydrogenated product thereof, and(C) an aliphatic polyamide,wherein said thermoplastic resin composition comprises 10-80 parts by weight of the graft modified .alpha.Type: GrantFiled: January 7, 1994Date of Patent: June 13, 1995Assignee: Mitsui Petrochemical Industries, Ltd.Inventors: Yoshikatsu Amimoto, Fumitoshi Ikejiri, Sanehiro Yamamoto, Akinori Toyota, Katunari Nishimura, Masahiro Kanda, Tetsuo Kato
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Patent number: 5405904Abstract: The connector of the present invention has a housing formed from a polyamide resin composition which comprises 65-85% by weight of a specific polyamide (A), and 5-20% by weight of a graft-modified .alpha.-olefin random copolymer and/or graft-modified vinyl aromatic hydrocarbon/conjugated diene copolymer or a hydrogenation product thereof (B), and 0.1-1.0% by weight, based on 100% by weight of the total of the aromatic polyamide (A) and graft-modified copolymer (B), of a polyethylene wax or a metallic salt of an aliphatic carboxylic acid having 26-32 carbon atoms (C), and further, optionally, an antioxidant (D).An object of the present invention is to provide a connector which is free from a decrease in characteristics such as toughness by heating, and, in particular, can be formed with excellent moldability, and is light weight.Type: GrantFiled: June 3, 1994Date of Patent: April 11, 1995Assignees: Mitsui Petrochemical Industries, Ltd., Sumitomo Wiring Systems, Ltd.Inventors: Fumitoshi Ikejiri, Katunari Nishimura, Takao Nozaki, Akira Nabeshima, Masamitsu Chishima
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Patent number: 5324766Abstract: The resin composition for forming plated layer disclosed herein comprises a polyamide composed of a dicarboxylic acid component recuring unit and a recurring unit derived from a diamine component unit having an alkylene group of 4 to 25 carbon atoms and at least one inorganic filler. There are also disclosed the resin molded article having plated layer formed thereon, the electromagnetic wave shielding material, the decorative resin molded article and the connecting material produced by forming plated layer on the surfaces of the resin molded articles formed from said resin composition. Further, there is disclosed the printed circuit board produced by forming selectively metallized layer in wiring circuit portion on the surface of the resin molded article formed from said resin composition and the method for plating to form these articles having the layer plated thereon.Type: GrantFiled: October 20, 1993Date of Patent: June 28, 1994Assignee: Mitsui Petrochemical Industries, Ltd.Inventors: Fumitoshi Ikejiri, Sanehiro Yamamoto, Keiji Kawamoto
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Patent number: 5306754Abstract: The resin composition of the invention comprises as resin components specific aromatic polyamide (A), a specific graft-modified polymer (B), an aliphatic polyamide (C), and plural antioxidants comprising a hindered phenol type antioxidant (D) having a molecular weight of not less than 500 and a TGA 10% weight loss temperature of not lower than 300.degree. C. and a sulfur type antioxidant (E) having a molecular weight of not less than 600 and a TGA 10% weight loss temperature of not lower than 280.degree. C. The connector of the invention has housing formed from the above-mentioned resin composition. The resin composition of the invention shows excellent heat resistance. The connector of the invention is lightweight and is excellent in heat resistance, water resistance and chemical resistance.Type: GrantFiled: March 17, 1993Date of Patent: April 26, 1994Assignees: Mitsui Petrochemical Industries, Ltd., Yazaki CorporationInventors: Sanehiro Yamamoto, Kazuto Sugiyama, Akinori Toyota, Yoshikatsu Amimoto, Fumitoshi Ikejiri, Tetsuo Kato, Masahiro Kanda
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Patent number: 5256718Abstract: The present invention provides resin compositions containing thermoplastic resins. Thermoplastic resins employable for the compositions are polyolefin resins, polyester resins, polystyrene resins, polyamide resins and polyphenylene ether resins. The present invention can be particularly effected by using polyamide, particularly, specific aromatic polyamides.In the present invention, the resin compositions can be improved in various chemical and physical properties such as flame-retardance, moldability, color tone, heat stability, mechanical strength by the use of other resin component and stabilizers such as halogenated organic compounds, modified polyolefins, antimony compounds, phosphorus-containing compounds, amine- or phosphorus-type stabilizers.Type: GrantFiled: February 12, 1991Date of Patent: October 26, 1993Assignee: Mitsui Petrochemical Industries, Ltd.Inventors: Sanehiro Yamamoto, Hideki Sakai, Hirotaka Aso, Kazuo Ishiwatari, Fumitoshi Ikejiri
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Patent number: 5183843Abstract: A polyamide resin composition which comprises: (A) an aromatic polyamide resin comprising preferably a terephthalic acid component and a diamine component comprising at least one of an aliphatic diamine component and an alicyclic diamine component; (B) a fibrous reinforcement; and (C) at least one additive selected from the group consisting of a salt of the group I, II and III metals of the periodic table of a higher fatty acid salt and an acid ester, a partially saponified ester and a metal salt of an aliphatic carboxylic acid of 26-32 carbons.The resin composition is of high fluidity and mold-releasing properties as well as of high heat resistance and rigidity, so that the composition can be molded with decomposition of the resins.Type: GrantFiled: September 21, 1989Date of Patent: February 2, 1993Assignee: Mitsui Petrochemical Industries, Ltd.Inventors: Hideki Sakai, Kazuo Ishiwatari, Fumitoshi Ikejiri
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Patent number: 5118207Abstract: Rolling bearing cages disclosed herein are prepared from compositions comprising an aromatic polyamide which comprises terephthalic acid constituent units, aromatic dicarboxylic acid constituent units other than terephthalic acid constituent units and straight-chain aliphatic alkylenediamine constituent units, and glass fibers, and can be easily incorporated into bearing races without damage, resultant bearings capable of being operated over a long period of time without deformation of said cages and deterioration of the lubricant oil.Type: GrantFiled: May 31, 1991Date of Patent: June 2, 1992Assignee: Mitsui Petrochemical Industries, Ltd.Inventors: Fumitoshi Ikejiri, Noboru Umemto
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Patent number: 5115010Abstract: A composition comprising (I) a thermally stable polyamide such as an aromatic polyamide, (II) a halogenated polystyrene or a halogenated polyphenylene oxide, and (III) sodium antimonate has excellent fire retardancy and excellent thermal stability during molding. The thermal stability of the composition is further enhanced by including (IV) a hydrotalcite-type complex hydroxide or (V) magnesium oxide and/or zinc oxide.Type: GrantFiled: April 15, 1991Date of Patent: May 19, 1992Assignee: Mitsui Petrochemical Industries, Inc.Inventors: Hideki Sakai, Kazuo Ishiwatari, Fumitoshi Ikejiri
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Patent number: 4918133Abstract: In accordance with the present invention, there are provided cycloolefin type random copolymer compositions excellent in heat resistance, chemical resistance, rigidity, impact resistance, etc., which comprise(A) a cycloolefin type random copolymer containing an ethylene component and a cycloolefin component and having an intrinsic viscosity [.eta.] of 0.05-10 dl/g as measured at 135.degree. C. in decalin and a softening temperature (TMA) of not lower than 70.degree. C., and(B) one or more non-rigid copolymers selected from the group consisting of:(i) a cycloolefin type random copolymer containing an ethylene component, at least one other .alpha.-olefin component and a cycloolefin component and having an intrinsic viscosity [.eta.] of 0.01-10 dl/g as measured at 135.degree. C. in decalin and a softening temperature (TMA) of below 70.degree. C.,(ii) a non-crystalline to low crystalline .alpha.-olefin type elastomeric copolymer formed from at least two .alpha.-olefins,(iii) an .alpha.Type: GrantFiled: June 7, 1989Date of Patent: April 17, 1990Assignee: Mitsui Petrochemical Industries, Ltd.Inventors: Satoru Moriya, Akio Ishimoto, Yoshinori Akana, Yozo Yamamoto, Kotaro Kishimura, Fumitoshi Ikejiri