Patents by Inventor Fumitoshi NISHIURA

Fumitoshi NISHIURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PLATING APPARATUS AND PLATING METHOD
    Publication number: 20210040641
    Abstract: Provided is a plating apparatus for plating a substrate, which prevents deterioration of uniformity of plating film thickness caused by an oxide film created at an edge section of the substrate and/or an organic substance attached to the edge section of the substrate. The plating apparatus includes a plating bath for applying a voltage to the substrate set in a substrate holder to plate the substrate; and an edge section washing device that locally removes at least either of the organic substance and the oxide film present at the edge section of the substrate before the substrate is set in the substrate holder.
    Type: Application
    Filed: March 2, 2017
    Publication date: February 11, 2021
    Applicant: Ebara Corporation
    Inventors: Mizuki NAGAI, Masashi SHIMOYAMA, Takashi KISHI, Fumitoshi NISHIURA
  • COPPER OXIDE POWDER FOR USE IN PLATING OF A SUBSTRATE
    Publication number: 20200165737
    Abstract: Soluble copper oxide powder capable of preventing a decrease in quality of a copper film formed by plating is disclosed. The copper oxide powder contains copper and impurities including sodium. A concentration of the sodium is not more than 20 ppm. The copper oxide powder is regularly supplied into a plating solution. A voltage is applied between an insoluble anode and a substrate immersed in the plating solution, thereby plating the substrate.
    Type: Application
    Filed: January 30, 2020
    Publication date: May 28, 2020
    Applicant: EBARA CORPORATION
    Inventors: MASASHI SHIMOYAMA, JUMPEI FUJIKATA, FUMITOSHI NISHIURA, TAKASHI KISHI
  • COPPER OXIDE POWDER FOR USE IN PLATING OF A SUBSTRATE, METHOD OF PLATING A SUBSTRATE USING THE COPPER OXIDE POWDER, AND METHOD OF MANAGING PLATING SOLUTION USING THE COPPER OXIDE POWDER
    Publication number: 20180105946
    Abstract: Soluble copper oxide powder capable of preventing a decrease in quality of a copper film formed by plating is disclosed. The copper oxide powder contains copper and impurities including sodium. A concentration of the sodium is not more than 20 ppm. The copper oxide powder is regularly supplied into a plating solution. A voltage is applied between an insoluble anode and a substrate immersed in the plating solution, thereby plating the substrate.
    Type: Application
    Filed: October 9, 2017
    Publication date: April 19, 2018
    Inventors: Masashi SHIMOYAMA, Jumpei FUJIKATA, Fumitoshi NISHIURA, Takashi KISHI