Patents by Inventor Fumiya FUKUHARA

Fumiya FUKUHARA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of double-side polishing semiconductor wafer
    Patent number: 11731234
    Abstract: Provided is a method of double-side polishing a semiconductor wafer, which can suppress variation in the polishing quality by providing for changes in the polishing environment during polishing.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: August 22, 2023
    Assignee: SUMCO CORPORATION
    Inventors: Mami Kubota, Fumiya Fukuhara, Tomonori Miura
  • METHOD OF DOUBLE-SIDE POLISHING SEMICONDUCTOR WAFER
    Publication number: 20200039021
    Abstract: Provided is a method of double-side polishing a semiconductor wafer, which can suppress variation in the polishing quality by providing for changes in the polishing environment during polishing.
    Type: Application
    Filed: October 3, 2017
    Publication date: February 6, 2020
    Applicant: SUMCO CORPORATION
    Inventors: Mami KUBOTA, Fumiya FUKUHARA, Tomonori MIURA